IEC 62751-2:2014 gives the detailed method to be adopted for calculating the power losses in the valves for an HVDC system based on the "modular multi-level converter", where each valve in the converter consists of a number of self-contained, two-terminal controllable voltage sources connected in series. It is applicable both for the cases where each modular cell uses only a single turn-off semiconductor device in each switch position, and the case where each switch position consists of a number of turn-off semiconductor devices in series (topology also referred to as "cascaded two-level converter"). The main formulae are given for the two-level "half-bridge" configuration but guidance is also given as to how to extend the results to certain other types of MMC building block configuration.

  • Standard
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  • Standard
    115 pages
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This document outlines the visualization elements for data exchange between the Product Lifecycle Management and Manufacturing Execution System (PLM-MES) or Manufacturing Operations Management (MOM). The following are within the scope of this document: — the need for a PLM-MES interface; — the technical elements that make up the PLM-MES interface; — the visualization elements of the PLM-MES interface. The following is outside the scope of this document: — application of the PLM-MES interface and its visualization elements.

  • Technical report
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  • Draft
    29 pages
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  • Draft
    29 pages
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IEC 62885-4:2020 is applicable to measurements of the performance of cordless dry vacuum cleaners for household use or under conditions similar to those in households. The results obtained under this document are intended to be comparable to the results obtained under IEC 62885-2 for mains-connected vacuums.
The purpose of this document is to specify essential performance characteristics of cordless dry vacuum cleaners which are of interest to users and to describe methods for measuring these characteristics.
This standard is to be read in conjunction with IEC 62885-2:2016, to which it refers, and which is applicable unless otherwise specified in this standard.

  • Standard
    108 pages
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  • Standard
    50 pages
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IEC 62769-6-100:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation regarding the components FDI® Client and User Interface Plug-in (UIP) using the Runtime .NET. This runtime is specific only to the WORKSTATION platform as defined in IEC 62769‑4. [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-6-200:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation regarding the components FDI® Client and User Interface Plug-in (UIP) for the Runtime HTML5. [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

  • Draft
    26 pages
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IEC 62769-150-1:2023 is available as IEC 62769-150-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-150-1:2023 specifies an FDI profile of IEC 62769 for IEC 62734 (ISA100.11a)[1]. [1] ISA100 WIRELESSTM is a trade name of the non-profit consortium Wireless Compliance Institute. This information is given for the convenience of users of this standard and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

  • Draft
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IEC 62769-103-1:2023 is available as IEC 62769-103-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-103-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784-1_CP 3/1 (PROFIBUS DP)[2] and IEC 61784-1_CP3/2 (PROFIBUS PA). [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder. [2] PROFIBUS is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

  • Draft
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IEC 62769-101-2:2023 is available as IEC 62769-101-2:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-101-2:2023 specifies the IEC 62769 profile for IEC 61784‑1, CP 1/2 (Foundation™ Fieldbus HSE)[1]. [1] Foundation™ Fieldbus is the trade name of the non-profit consortium Fieldbus Foundation. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

  • Draft
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IEC 62769-109-1:2023 is available as IEC 62769-109-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 62769-109-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784‑1_CP 9/1 (HART®)[2] and IEC 61784‑1_CP 9/2 (WirelessHART®)[3]. [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder. [2] HART is the trade name of the non-profit consortium FieldComm Group. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder. [3] WirelessHART is the trade name of the non-profit consortium FieldComm Group. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

  • Draft
    46 pages
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IEC 62769-103-4:2023 is available as IEC 62769-103-4:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-103-4:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784-2_CP 3/4, IEC 61784-2_CP3/5 and IEC 61784-2_CP3/6 (PROFINET[2]). [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder. [2] PROFINET is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

  • Draft
    38 pages
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IEC 62769-101-1:2023 is available as IEC 62769-101-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 62769-101-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784‑1_CP 1/1 (Foundation™ Fieldbus H1)[2]. [1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder. [2] Foundation™ Fieldbus is the trade name of the non-profit consortium Fieldbus Foundation. This information is given for the convenience of users of this standard and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 60534-1:2023 is available as IEC 60534-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60534-1:2023 applies to all types of industrial-process control valves (hereinafter referred to as control valves). This document establishes a partial basic terminology list and provides guidance on the use of all other parts of IEC 60534.

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IEC 62769-100:2023 is available as IEC 62769-100:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-100:2023 specifies an FDI®[1] profile of IEC 62769 for Generic Protocols. That means that all interfaces are defined and a host can add support for more protocols without changing its implementation. Nevertheless, there are some protocol specific definitions (PSD) that need to be specified per protocol using this profile. Annex C specifies what PSD need to be defined per protocol so that FDI® Device Packages, FDI® Communication Packages for Gateways and FDI® Communication Servers, FDI® Communication Server, Gateways and Devices supporting such a protocol can work together in a host not aware about this specific protocol.

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IEC 62769-4:2023 is available as IEC 62769-4:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-4:2023 specifies the FDI®[1] Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Architecture diagram figure. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-6:2023 is available as IEC 62769-6:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.

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IEC 62769-7:2023 is available as IEC 62769-7:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-7:2023 specifies the elements implementing communication capabilities called Communication Devices. The overall FDI®[1] architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this illustration. The document scope with respect to FDI® Packages is limited to Communication Devices. The Communication Server shown in Figure 1 is an example of a specific Communication Device. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-5:2023 is available as IEC 62769-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-5:2023 defines the FDI®[1] Information Model. One of the main tasks of the Information Model is to reflect the topology of the automation system. Therefore, it represents the devices of the automation system as well as the connecting communication networks including their properties, relationships, and the operations that can be performed on them. The types in the AddressSpace of the FDI® Server constitute some kind of catalogue, which is built from FDI® Packages. The fundamental types for the FDI® Information Model are well defined in OPC UA for Devices (IEC 62541‑100). The FDI® Information Model specifies extensions for a few special cases and otherwise explains how these types are used and how the contents are built from elements of DevicePackages. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-1:2023 is available as IEC 62769-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 62769-1:2023 describes the concepts and overview of the Field Device Integration (FDI®[1]) specifications. The detailed motivation for the creation of this technology is also described . Reading this document is helpful to understand the other parts of this multi-part standard. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-3:2023 is available as IEC 62769-3:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-3:2023 specifies the FDI®[1] Server. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure. Annex A provides a functional description of the FDI® Server. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-2:2023 is available as IEC 62769-2:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-2:2023 specifies the FDI®[1] Client. See Annex C for some typical FDI® Client use cases. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-150-1:2023 is available as IEC 62769-150-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-150-1:2023 specifies an FDI profile of IEC 62769 for IEC 62734 (ISA100.11a)[1].
[1] ISA100 WIRELESSTM is a trade name of the non-profit consortium Wireless Compliance Institute. This information is given for the convenience of users of this standard and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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This document enables a flexible creation of product knowledge models and data that supports systems engineering processes. The payload or design data can be exchanged across organizations or with the supply chain by combining resource description framework (RDF) triples, reference data dictionaries and a standardized set of relationships. This document is appropriate for use with the ISO 15926-series based reference data libraries, and it is applicable to the process industry, including oil, gas and power. However, manufacturing and aerospace industries can also benefit from this document. The following are within the scope of this document: — process plants in accordance with ISO 15926-1; — a methodology with low threshold for using reference data in combination with RDF triples for representing statements as defined in the ISO 15926 series; — an initial set of relationships required for process plant life-cycle representation; — a method to implement configuration management to trace back additions, changes and deletions in product and project data and enabling baselining; — data sharing, integration, exchange, and hand-over between computer systems. The following are outside the scope of this document: — serialisation methods; — definition of reference data libraries; — the syntax and format of implementations of either product data models or instance data using this document, or both; — any specific methods and guidelines other than RDF(S) for implementing ISO 15926-2.

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IEC 62769-103-4:2023 is available as IEC 62769-103-4:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-103-4:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784-2_CP 3/4, IEC 61784-2_CP3/5 and IEC 61784-2_CP3/6 (PROFINET[2]).
[1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
[2] PROFINET is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-109-1:2023 is available as IEC 62769-109-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62769-109-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784‑1_CP 9/1 (HART®)[2] and IEC 61784‑1_CP 9/2 (WirelessHART®)[3].
[1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
[2] HART is the trade name of the non-profit consortium FieldComm Group. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
[3] WirelessHART is the trade name of the non-profit consortium FieldComm Group. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-103-1:2023 is available as IEC 62769-103-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-103-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784-1_CP 3/1 (PROFIBUS DP)[2] and IEC 61784-1_CP3/2 (PROFIBUS PA).
[1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
[2] PROFIBUS is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-101-2:2023 is available as IEC 62769-101-2:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-101-2:2023 specifies the IEC 62769 profile for IEC 61784‑1, CP 1/2 (Foundation™ Fieldbus HSE)[1].
[1] Foundation™ Fieldbus is the trade name of the non-profit consortium Fieldbus Foundation. This information is given for the convenience of users of this technical report and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-101-1:2023 is available as IEC 62769-101-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62769-101-1:2023 specifies an FDI®[1] profile of IEC 62769 for IEC 61784‑1_CP 1/1 (Foundation™ Fieldbus H1)[2].
[1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.
[2] Foundation™ Fieldbus is the trade name of the non-profit consortium Fieldbus Foundation. This information is given for the convenience of users of this standard and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-6-200:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation regarding the components FDI® Client and User Interface Plug-in (UIP) for the Runtime HTML5.
[1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

  • Standard
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IEC 62769-6-100:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation regarding the components FDI® Client and User Interface Plug-in (UIP) using the Runtime .NET. This runtime is specific only to the WORKSTATION platform as defined in IEC 62769‑4.
[1] FDI is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

  • Standard
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IEC 62769-100:2023 is available as IEC 62769-100:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-100:2023 specifies an FDI®[1] profile of IEC 62769 for Generic Protocols. That means that all interfaces are defined and a host can add support for more protocols without changing its implementation. Nevertheless, there are some protocol specific definitions (PSD) that need to be specified per protocol using this profile. Annex C specifies what PSD need to be defined per protocol so that FDI® Device Packages, FDI® Communication Packages for Gateways and FDI® Communication Servers, FDI® Communication Server, Gateways and Devices supporting such a protocol can work together in a host not aware about this specific protocol.

  • Standard
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IEC 62769-6:2023 is available as IEC 62769-6:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-6:2023 specifies the technology mapping for the concepts described in the Field Device Integration (FDI®[1]) standard. The technology mapping focuses on implementation of the components FDI® Client and User Interface Plug-in (UIP) in the specified technologies for the WORKSTATION platform and the MOBILE platform as defined in IEC 62769-4. There are individual subparts for the currently supported technologies .NET and HTML5.

  • Standard
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IEC 62769-7:2023 is available as IEC 62769-7:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-7:2023 specifies the elements implementing communication capabilities called Communication Devices. The overall FDI®[1] architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this illustration. The document scope with respect to FDI® Packages is limited to Communication Devices. The Communication Server shown in Figure 1 is an example of a specific Communication Device.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-4:2023 is available as IEC 62769-4:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-4:2023 specifies the FDI®[1] Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Architecture diagram figure.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

  • Standard
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IEC 62769-5:2023 is available as IEC 62769-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-5:2023 defines the FDI®[1] Information Model. One of the main tasks of the Information Model is to reflect the topology of the automation system. Therefore, it represents the devices of the automation system as well as the connecting communication networks including their properties, relationships, and the operations that can be performed on them. The types in the AddressSpace of the FDI® Server constitute some kind of catalogue, which is built from FDI® Packages. The fundamental types for the FDI® Information Model are well defined in OPC UA for Devices (IEC 62541‑100). The FDI® Information Model specifies extensions for a few special cases and otherwise explains how these types are used and how the contents are built from elements of DevicePackages.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-1:2023 is available as IEC 62769-1:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62769-1:2023 describes the concepts and overview of the Field Device Integration (FDI®[1]) specifications. The detailed motivation for the creation of this technology is also described . Reading this document is helpful to understand the other parts of this multi-part standard.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-3:2023 is available as IEC 62769-3:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-3:2023 specifies the FDI®[1] Server. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure. Annex A provides a functional description of the FDI® Server.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 62769-2:2023 is available as IEC 62769-2:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 62769-2:2023 specifies the FDI®[1] Client. See Annex C for some typical FDI® Client use cases. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1.
[1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

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IEC 61158-4-21:2023 describes:
procedures for the timely transfer of data and control information from one data link user entity to a peer user entity, and among the data link entities forming the distributed data link service provider;
procedures for giving communication opportunities based on ISO/IEC/IEEE 8802‑3 MAC, with provisions for nodes to be added or removed during normal operation;
structure of the fieldbus data link protocol data units (DLPDUs) used for the transfer of data and control information by the protocol of this document, and their representation as physical interface data units.

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IEC 61158-4-24:2023 provides
procedures for the timely transfer of data and control information from one data-link user entity to a peer user entity, and among the data-link entities forming the distributed datalink service provider;
procedures for giving communications opportunities to all participating DL-entities (DLEs), sequentially and in a cyclic manner for deterministic and synchronized transfer at cyclic intervals up to 64 ms;
procedures for giving communication opportunities available for time-critical data transmission together with non-time-critical data transmission without prejudice to the time-critical data transmission;
procedures for giving cyclic and acyclic communication opportunities for time-critical data transmission with prioritized access;
procedures for giving communication opportunities based on ISO/IEC/IEEE 8802‑3 medium access control, with provisions for nodes to be added or removed during normal operation;
the structure of the fieldbus DLPDUs used for the transfer of data and control information by the protocol of this document, and their representation as physical interface data units.

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IEC 61158-6-26:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 26 fieldbus. The term "time-critical" is used to represent the presence of a time-window, within which one or more specified actions are required to be completed with some defined level of certainty. Failure to complete specified actions within the time window risks failure of the applications requesting the actions, with attendant risk to equipment, plant and possibly human life.

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IEC 61158-6-23:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 23 fieldbus. The term "time-critical" is used to represent the presence of a time-window, within which one or more specified actions are required to be completed with some defined level of certainty. Failure to complete specified actions within the time window risks failure of the applications requesting the actions, with attendant risk to equipment, plant and possibly human life.

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IEC 61158-5-2:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term "time-critical" is used to represent the presence of a time-window, within which one or more specified actions are required to be completed with some defined level of certainty. Failure to complete specified actions within the time window risks failure of the applications requesting the actions, with attendant risk to equipment, plant and possibly human life.

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IEC 61158-6-4:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 4 fieldbus. The term “time-critical” is used to represent the presence of a time-window, within which one or more specified actions are required to be completed with some defined level of certainty. Failure to complete specified actions within the time window risks failure of the applications requesting the actions, with attendant risk to equipment, plant and possibly human life.

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IEC 61158-6-2:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term "time-critical" is used to represent the presence of a time-window, within which one or more specified actions are required to be completed with some defined level of certainty. Failure to complete specified actions within the time window risks failure of the applications requesting the actions, with attendant risk to equipment, plant and possibly human life.

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IEC 61158-6-24:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 24 fieldbus. The term "time-critical" is used to represent the presence of a time-window, within which one or more specified actions are required to be completed with some defined level of certainty. Failure to complete specified actions within the time window risks failure of the applications requesting the actions, with attendant risk to equipment, plant and possibly human life.

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IEC 61158-6-10:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 10 fieldbus. The term “time-critical” is used to represent the presence of a time window, within which one or more specified actions are required to be completed with a defined level of certainty. Failure to complete specified actions within the time window risks failure of the applications requesting the actions, with attendant risk to equipment, plant and possibly human life.

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IEC 61158-5-10:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 10 fieldbus. The term "time-critical" is used to represent the presence of a time-window, within which one or more specified actions are required to be completed with some defined level of certainty. Failure to complete specified actions within the time window risks failure of the applications requesting the actions, with attendant risk to equipment, plant and possibly human life.

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IEC 61158-5-4:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 4 fieldbus. The term "time-critical" is used to represent the presence of a time-window, within which one or more specified actions are required to be completed with some defined level of certainty. Failure to complete specified actions within the time window risks failure of the applications requesting the actions, with attendant risk to equipment, plant and possibly human life.

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