IEC 62228-1:2018

IEC 62228-1 ®
Edition 1.0 2018-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Integrated circuits – EMC evaluation of transceivers –
Part 1: General conditions and definitions

Circuits intégrés – Évaluation de la CEM des émetteurs-récepteurs –
Partie 1: Conditions générales et définitions

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IEC 62228-1 ®
Edition 1.0 2018-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Integrated circuits – EMC evaluation of transceivers –

Part 1: General conditions and definitions

Circuits intégrés – Évaluation de la CEM des émetteurs-récepteurs –

Partie 1: Conditions générales et définitions

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-6493-5

– 2 – IEC 62228-1:2018 © IEC 2018
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms, definitions and abbreviated terms . 5
3.1 Terms and definitions . 6
3.2 Abbreviated terms . 6
4 Philosophy . 6
5 General test conditions and test board specification . 8
5.1 Test conditions . 8
5.2 Test board specification . 8
6 Test report . 8

Figure 1 – General test configuration for tests in functional operation modes . 7
Figure 2 – General test configuration for unpowered ESD test . 7

Table 1 – Overview of test and measurement methods . 6

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
EMC evaluation of transceivers –

Part 1: General conditions and definitions

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62228-1 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
This bilingual version (2019-02) corresponds to the monolingual English version, published
in 2018-01.
The text of this International Standard is based on the following documents:
CDV Report on voting
47A/1018/CDV 47A/1034/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.

– 4 – IEC 62228-1:2018 © IEC 2018
The French version of this document has not been voted upon.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62228 series, published under the general title Integrated circuits
– EMC evaluation of transceivers, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
INTEGRATED CIRCUITS –
EMC evaluation of transceivers –

Part 1: General conditions and definitions

1 Scope
This part of IEC 62228 provides general information and definitions for electromagnetic
compatibility (EMC) evaluation of integrated circuits (IC) with transceivers for wired network
applications under network condition. It defines general test conditions, general test setups
and test and measurement methods are applied to all parts of IEC 62228.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions 150 kHz to
1 GHz – Part 1: General conditions and definitions
IEC 61967-4:2002, Integrated circuits – Measurement of electromagnetic emissions 150 kHz
to 1 GHz – Part 4: Measurement of conducted emissions – 1 Ω /150 Ω direct coupling method
IEC 61967-4:2002/AMD1:2006
IEC 62132-1, Integrated circuits – Measurement of electromagnetic immunity – Part 1:
General conditions and definitions
IEC 62132-4, Integrated circuits – Measurement of electromagnetic immunity 150 kHz to
1 GHz – Part 4: Direct RF power injection method
IEC 62215-3, Integrated circuits – Measurement of impulse immunity – Part 3:
Non-synchronous transient injection method
ISO 10605, Road vehicles – Test methods for electrical disturbances from electrostatic
discharge
3 Terms, definitions and abbreviated terms
For the purposes of this document, the terms and definitions given in IEC 61967-1 and
IEC 62132-1 as well as the following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp

– 6 – IEC 62228-1:2018 © IEC 2018
3.1 Terms and definitions
3.1.1
global pin
carries a signal or power that enters or leaves the application board without any active
component in between
3.1.2
mandatory components
components needed for proper function of the IC as specified by the IC manufacturer
(e.g. application note)
3.2 Abbreviated terms
DUT device under test
DPI direct RF power injection
ESD electrostatic discharge
PCB printed circuit board
RxD receive data
SBC system base chip
TxD transmit data
4 Philosophy
The intention of this document is to provide general definitions to evaluate the EMC
performance of transceiver ICs under application-like conditions in a minimal network by
applying standardized IC EMC test methods. The goal is to define guidelines for the EMC
characterisation on dedicated global pins of transceiver ICs that are considered EMC-relevant
in the application.
The evaluation of the EMC characteristics of transceivers shall be performed in functional
operation modes under minimal network conditions with two transceivers for RF emission, RF
immunity and impulse immunity tests. For electrostatic discharge tests related to packaging
and handling of assembled devices, a single unpowered transceiver IC shall be evaluated.
The test methods used for the EMC characterization are based on the international standards
for IC EMC tests and are described in Table 1.
Table 1 – Overview of test and measurement methods
Transceiver mode Required test Test method
150 Ω direct coupling
RF emission
(IEC 61967-4)
DPI
Functional
RF immunity
(IEC 62132-4)
(powered)
Non-synchronous transient injection
Impulse immunity
(IEC 62215-3)
Passive Contact discharge
ESD
(unpowered) (ISO 10605)
The 150 Ω direct coupling, DPI and non-synchronous transient injection test methods are
chosen for the evaluation of the EMC characteristics of transceivers in functional modes.

These three test methods are based on the same approach using conductive coupling.
Therefore, it is possible to use the same test board for all tests in functional operation mode,
which increases the reproducibility and comparability of test results.
The test configuration in general consists of two transceivers with mandatory external
components and components for filtering (e.g. bus filter) and decoupling in a minimal test
network, where filtered power supplies, signals, monitoring probes and coupling ports are
connected as shown in Figure 1.
In specific cases or for analyses, a deviation from this setup can be agreed upon between the
users of this document and will be noted in the test report.
Monitoring and stimulation /
mode control
e.g. TxD, RxD, …
Test network
Node 1
Bus filter Transceiver Decoupling
(optional) network for
stimulation and
monitoring
Coupling ports and
coupling networks
Node 2
Bus filter Transceiver Decoupling
(optional) network for
stimulation and
monitoring
Power supply with decoupling
networks
e.g. VBAT, VCC, …
IEC
Figure 1 – General test configuration for tests in functional operation modes
The general test configuration for the unpowered ESD test of transceiver ICs consists of a
single transceiver IC with mandatory external components and components for filtering on a
test board with discharge coupling ports as shown in Figure 2.
Unpowered transceiver
Coupling ports and
coupling networks Bus filter Transceiver
(optional)
IEC
Figure 2 – General test configuration for unpowered ESD test

– 8 – IEC 62228-1:2018 © IEC 2018
5 General test conditions and test board specification
5.1 Test conditions
For the purposes of this document, the test conditions given in IEC 61967-1, IEC 62132-1,
IEC 62215-3 and ISO 10605 apply for the related test methods.
These test conditions are intended to ensure a consistent test environment. If the users of this
procedure agree to use other values, they shall be documented in the test report.
5.2 Test board specification
For functional tests of transceiver ICs, the test network shall be designed on a printed circuit
board. To ensure good RF characteristics of the coupling and decoupling, an equal design of
the circuitry for node 1 and 2 on a minimum two-layer PCB with a GND layer should be used.
The length of the coupling paths on the test board should be kept as short as possible. The
trace length for bus interconnections should be shorter than 30 mm from the star point of the
...