EN 16602-70-60:2019

SLOVENSKI STANDARD
01-september-2019
Nadomešča:
SIST EN 16602-70-10:2015
SIST EN 16602-70-11:2015
Zagotavljanje kakovosti proizvodov v vesoljski tehniki - Kvalifikacija in nabava
plošč tiskanih vezij
Space product assurance - Qualification and Procurement of printed circuit boards
Raumfahrtproduktsicherung - Qualifizierung und Beschaffung von Leiterplatten
Assurance produit des projets spatiaux - Qualification et approvisionnement des circuits
imprimés
Ta slovenski standard je istoveten z: EN 16602-70-60:2019
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 16602-70-60
NORME EUROPÉENNE
EUROPÄISCHE NORM
July 2019
ICS 31.180; 49.140
Supersedes EN 16602-70-10:2015, EN 16602-70-
11:2015
English version
Space product assurance - Qualification and Procurement
of printed circuit boards
Assurance produit des projets spatiaux - Qualification Raumfahrtproduktsicherung - Qualifizierung und
et approvisionnement des circuits imprimés Beschaffung von Leiterplatten
This European Standard was approved by CEN on 9 November 2018.

CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for
giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical
references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to
any CEN and CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by
translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC
Management Centre has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium,
Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany,
Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania,
Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.

CEN-CENELEC Management Centre:
Rue de la Science 23, B-1040 Brussels
© 2019 CEN/CENELEC All rights of exploitation in any form and by any means Ref. No. EN 16602-70-60:2019 E
reserved worldwide for CEN national Members and for
CENELEC Members.
Table of contents
European Foreword . 13
Introduction . 14
1 Scope . 15
2 Normative references . 16
3 Terms, definitions and abbreviated terms . 18
3.1 Terms from other standards . 18
3.2 Terms specific to the present standard . 19
3.3 Abbreviated terms. 27
3.4 Nomenclature . 29
4 Principles . 30
4.1 General . 30
4.2 Roles . 30
4.3 References to acceptance criteria . 30
5 QA for qualification . 31
5.1 Qualified PCBs . 31
5.2 Ceramic PCB technology . 32
5.3 Flexible PCB . 32
5.3.1 General . 32
5.3.2 Qualification of flexible PCB . 32
5.4 Qualification process . 34
5.5 Request for qualification . 34
5.6 Quality standards . 35
5.7 Description of qualification vehicle . 35
5.8 Evaluation . 36
5.9 Audit . 36
5.10 Qualification test programme . 38
5.11 PID . 38
5.12 Qualification approval . 39
5.13 Process change . 39
5.14 QA report . 40
5.15 Qualification renewal . 40
5.16 Nonconformances during qualification renewal . 41
6 QA for manufacture and procurement . 43
6.1 Overview . 43
6.2 Procurement process . 43
6.2.1 Overview . 43
6.2.2 Procurement specification . 44
6.2.3 Quotation . 44
6.2.4 Purchase order . 45
6.2.5 Design review (DR) . 45
6.2.6 MRR . 45
6.3 Final and in-process inspection. 46
6.4 Quality records for manufacture and procurement . 47
6.5 Control of materials and chemistry . 48
6.6 Control of plating chemistry . 49
6.7 Cleanliness of PCB processes . 50
6.7.1 Overview . 50
6.7.2 Cleanliness control . 51
6.8 Traceability . 52
6.9 Operator and inspector training. 53
6.10 Repair of bare PCBs . 54
6.10.1 Overview . 54
6.10.2 General . 54
6.11 Packaging . 56
6.12 Storage and baking of PCB and coupons . 57
6.13 Shelf-life and relife testing . 57
6.14 QA for PCB procurement in space projects. 58
7 Test and inspection for qualification . 61
7.1 Overview . 61
7.2 Test selection for qualification activities . 64
7.3 Initial qualification of PCB manufacturer . 68
7.4 Initial qualification of PCB technology . 68
7.5 Qualification renewal . 68
7.6 Delta qualification . 68
7.7 Project qualification and RFA . 69
7.7.1 Overview . 69
7.7.2 Requirements for project qualification and RFA . 69
8 Test and inspection for procurement . 74
8.1 Outgoing inspection on PCB . 74
8.2 Outgoing inspection on coupons . 75
8.2.1 Overview . 75
8.2.2 Configuration of coupons for plated holes . 78
8.2.3 Configuration of dedicated coupons . 81
8.2.4 Evaluation of coupons . 82
8.2.5 Delivery of coupons, microsections and spare coupons . 84
8.3 Reporting of outgoing inspection and delivery . 85
8.4 Incoming inspection by procurement authority . 85
8.5 FAI on PCB by microsectioning . 86
9 Test descriptions . 88
9.1 Overview . 88
9.2 Additional tests . 88
9.2.1 Cleanliness . 88
9.2.2 Bake-out . 88
9.2.3 Plated copper tensile strength and elongation . 89
9.2.4 Steam ageing . 89
9.3 Group 1 – Visual inspection and non-destructive tests . 90
9.3.1 Visual inspection - general . 90
9.3.2 Visual inspection for qualitative aspects . 90
9.3.3 Visual inspection for dimensional verification . 90
9.3.4 Impedance test . 94
9.3.5 Dielectric constant and loss tangent . 94
9.3.6 Cleanliness . 94
9.3.7 High resistance electrical test . 95
9.3.8 Continuity test . 97
9.4 Group 2 - Miscellaneous tests . 99
9.4.1 Overview . 99
9.4.2 Peel strength . 100
9.4.3 Flexural fatigue . 101
9.4.4 Bending test .
...