IEC 61967-6:2002+AMD1:2008 CSV

IEC 61967-6
Edition 1.1 2008-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz
to 1 GHz –
Part 6: Measurement of conducted emissions – Magnetic probe method

Circuits intégrés – Mesure des émissions électromagnétiques, 150 kHz à 1 GHz –
Partie 6: Mesure des émissions conduites – Méthode de la sonde magnétique
IEC 61967-6:2002+A1:2008
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IEC 61967-6
Edition 1.1 2008-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz
to 1 GHz –
Part 6: Measurement of conducted emissions – Magnetic probe method

Circuits intégrés – Mesure des émissions électromagnétiques, 150 kHz à 1 GHz –
Partie 6: Mesure des émissions conduites – Méthode de la sonde magnétique

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CP
CODE PRIX
ICS 31.200 ISBN 2-8318-9726-2
– 2 – 61967-6 © IEC:2002+A1:2008
CONTENTS
FOREWORD.5
1 Scope.7
2 Normative references.7
3 Definitions.7
4 General.7
4.1 Measurement philosophy.7
4.2 Measurement principle.8
5 Test conditions.8
5.1 General.8
5.2 Frequency range.8
6 Test equipment.8
6.1 General.8
6.2 Magnetic probe .8
6.3 Probe spacing fixture and placement.8
7 Test set-up.11
7.1 General.11
7.2 Probe calibration.11
7.3 Modifications to standardized IC test board .11
7.3.1 Layer arrangement.11
7.3.2 Layer thickness.11
7.3.3 Decoupling capacitors.11
7.3.4 I/O pin loading.12
8 Test procedure.16
8.1 General.16
8.2 Test technique.16
9 Test report.16
9.1 General.16
9.2 Documentation.16

Annex A (normative) Probe calibration procedure – Microstrip line method .18
Annex B (informative) Measurement principle and calibration factor.21
Annex C (informative) Spatial resolution of magnetic probe .25
Annex D (informative) Angle pattern of probe placement.26
Annex E (informative) Advanced magnetic probe .27

Bibliography.44

Figure 1 – Magnetic probe .9
Figure 2 – Magnetic probe 1st and 3rd layers .9
Figure 3 – Magnetic probe 2nd layer.10
Figure 4 – Magnetic probe – layer construction.10
Figure 5 – Standardized IC test board (sectional view 1).12
Figure 6 – Standardized IC test board (sectional view 2 – measurement line) .12

61967-6 © IEC:2002+A1:2008 – 3 –
Figure 7 – Power line pattern on the standardized IC test board – Bottom layer .13
Figure 8 – I/O signal line pattern on the standardized IC test board – Bottom layer .14
Figure 9 – Multi-power lines on the standardized IC test board – Bottom layer .14
Figure 10 – Measurement set-up .15
Figure 11 – Measurement circuit schematic .15
Figure 12 – Transfer constant for current calculation as a function of insulator
thickness of microstrip board. .17
Figure A.1 – Cross-sectional view of a microstrip line for calibration .18
Figure A.2 – Measurement set-up for probe calibration .20
Figure B.1 – Cross-sectional view of a microstrip line .21
Figure B.2 – Measurement of magnetic probe output .23
Figure B.3 – Example of calibration factor for the magnetic probe
specified in figures 1, 2, 3, and 4 .24
Figure C.1 – Diagram for measuring a magnetic field distribution.25
Figure C.2 – Magnetic field distribution across the microstrip line (800 MHz) .25
Figure D.1 – Diagram for measuring an angle pattern of probe placement .26
Figure D.2 – Probe output to angle ϕ .26
Figure 1 – Magnetic probe .9
Figure 2 – Magnetic probe – First and third layers .9
Figure 3 – Magnetic probe – Second layer .10
Figure 4 – Magnetic probe – Layer construction.10
Figure 5 – Standardized IC test board – Sectional view 1 .12
Figure 6 – Standardized IC test board – Sectional view 2 – Measurement line .12
Figure 7 – Power line pattern on the standardized IC test board – Bottom layer.13
Figure 8 – I/O signal line pattern on the standardized IC test board – Bottom layer.14
Figure 9 – Multi-power lines on the standardized IC test board – Bottom layer.14
Figure 10 – Measurement set-up .15
Figure 11 – Measurement circuit schematic .15
Figure 12 – Transfer constant for current calculation as a function of insulator
thickness of microstrip board .17
Figure A.1 – Cross-sectional view of a microstrip line for calibration .18
Figure A.2 – Measurement set-up for probe calibration .20
Figure B.1 – Cross-sectional view of a microstrip line .21
Figure B.2 – Measurement of magnetic probe output .23
Figure B.3 – Example of calibration factor for the magnetic probe specified in figures 1,
2, 3, and 4 .24
Figure C.1 – Diagram for measuring a magnetic field distribution.25
Figure C.2 – Magnetic field distribution across the microstrip line (at 800 MHz) .25
Figure D.1 – Diagram for measuring an angle pattern of probe placement .26
Figure D.2 – Probe output to angle ϕ .26
Figure E.1 – Illustration of the assembled advanced magnetic probe .29
Figure E.2 – Enlarged view of part A of Figure E.1
(an example of connection construction) .29

– 4 – 61967-6 © IEC:2002+A1:2008
Figure E.3 – Main pattern (layer 2 to 4) of advanced magnetic probe.30
Figure E.4 – Layer 1 (ground pattern) of advanced magnetic probe .30
Figure E.5 – Layer 2 and 4 (ground pattern) of advanced magnetic probe.31
Figure E.6 – Layer 3 (signal pattern) of advanced magnetic probe .31
Figure E.7 – Layer 5 (ground pattern) of advanced magnetic probe .32
Figure E.8 – Construction of advanced magnetic probe .32
Figure E.9 – Measurement set-up .33
Figure E.10 – Definition of loop center .33
Figure E.11 – Error graph of the measured voltage versus measurement distance.34
Figure E.12 – Set-up for measuring magnetic field distribution.34
Figure E.13 – Magnetic field distribution across microstrip line (1 GHz) .35
Figure E.14 – Set-up for measuring an angle pattern of probe placement .35
Figure E.15 – Probe output amplitude as function of angle ϕ (D is 0,47 mm) .36
m
Figure E.16 – Current models of strip conductor of microstrip line.38
Figure E.17 – Calibration factor for different board parameters .39
Figure E.18 – Example of measured (C – C ) at microstrip line under
f_dB h-distributed_dB
the same condition (W=1,0 mm, h=0,6 mm) as shown in Figure E.9.39
Figure E.19 – Cross-sectional view of a microstrip line for calibration (example).41
Figure E.20 – Measurement set-up for probe calibration .42
Figure E.21 – Example of IC test board – Bottom layer .43
Figure E.22 – Example of measurement pattern of V .43
DD1
61967-6 © IEC:2002+A1:2008 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –
Part 6: Measurement of conducted emissions –
Magnetic probe method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61967-6 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
This consolidated version of IEC 61967-6 consists of the first edition (2002) [documents
47A/645/FDIS and 47A/653/RVD], its amendment 1 (2008) [documents 47A/781/FDIS and
47A/784/RVD] and its corrigendum 1 of August 2010.
The technical content is therefore identical to the base edition and its amendment and has
been prepared for user convenience.
It bears the edition number 1.1.
A vertical line in the margin shows where the base publication has been modified by
amendment 1.
– 6 – 61967-6 © IEC:2002+A1:2008
Annex A forms an integral part of this standard.
Annexes B, C, D and E are for information only.
This standard should be read in conjunction with IEC 61967-1.
IEC 61967 consists of the following parts, under the general title Integrated circuits –
Measurement of electromagnetic emissions, 150 kHz to 1 GHz:
Part 1: General conditions and definitions
Part 2: Measurement of radiated emissions – TEM-cell method
Part 3: Measurement of radiated emissions – Surface scan method (technical specification)
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
Part 5: Measurement of conducted emissions – Workbench Faraday cage method
Part 6: Measurement of conducted emissions – Magnetic probe method
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until the maintenance result date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date,
the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this publication using a colour printer.

___________
Under consideration.
To be published.
61967-6 © IEC:2002+A1:2008 – 7 –
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –
Part 6: Measurement of conducted emissions –
Magnetic probe method
1 Scope
This part of the IEC 61967 specifies a method for evaluating RF currents on the pins of an
integrated circuit (IC) by means of non-contact current measurement using a miniature
magnetic probe. This method is capable of measuring the RF currents generated by the IC
over a frequency range of 0,15 MHz to 1 000 MHz. This method is applicable to the
measurement of a single IC or a chip set of ICs on the standardized test board for
characterization and comparison purposes. It is also usable to evaluate the electromagnetic
characteristics of an IC or group of ICs on an actual application PCB for emission reduction
purposes. This method is called the "magnetic probe method".
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 1: General conditions and definitions
IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
3 Definitions
For the purposes of this part of IEC 61967 the definitions found in IEC 61967-1 apply.
4 General
4.1 Measurement philosophy
The emissions radiated from a PCB are, in part, caused by RF current generated by the
onboard IC which drives PCB traces, PCB ground and supply planes, and cables connected to
the PCB. All of these can act as RF antennas to radiate the emissions. The emission level is
proportional to the driving RF current, and is also affected significantly by PCB design,
radiation effectiveness of the pseudo-antennas, and noise coupling path coefficients from the
IC to the pseudo-antennas.
For this emission mechanism, the driving force of the IC can be a significant parameter for
both users and manufacturers to estimate and predict the electromagnetic characteristics of a
PCB, module, or system. A measure of the emission driving force can be obtained by
measuring the RF currents generated by the IC under test. Thus, the measured RF noise
current can be regarded as an indicator of the undesirable electromagnetic emission driving
force generated by the IC.
___________
To be published.
– 8 – 61967-6 © IEC:2002+A1:2008
4.2 Measurement principle
Using this test method, the RF current on the power supply pins and I/O pins of an IC under
test can be measured using a miniature triplate-structured magnetic probe. This probe
measures the magnetic field at a specified height over a power supply or I/O strip conductor
on the standardized test board in a controlled manner. The RF current is calculated from the
measured magnetic field using the formula described in 8.2. With accurate mechanical
placement of the magnetic probe, this method provides a high degree of repeatability. In
addition, the frequency range of this method can be extended subject to the limitations
described in 5.2. Higher frequencies can be obtained without a substantial influence on
accuracy. The estimation of the RF current over the power supply or I/O strip conductor is an
easy and handy way of characterizing and comparing the ICs.
5 Test conditions
5.1 General
General test conditions are described in IEC 61967-1.
5.2 Frequency range
The effective frequency range of this measurement method is 0,15 MHz to 1 000 MHz. The
maximum frequency can be extended, if desired, subject to the limitations of the test set-up.
The upper limit of the frequency range is directly related to high frequency characteristics of
the magnetic probe and its distance from the line under test as described in annex B. At a low
frequency region of 0,15 MHz to 10 MHz, however, it may be advisable to use a low noise
pre-amplifier to improve dynamic range of the measurement.
6 Test equipment
6.1 General
For general information on test equipment see IEC 61967-1.
6.2 Magnetic probe
The magnetic probe shall be a triplate-structured strip line composed of a three-layer PCB.
Recommended probe construction details are shown in figures 1, 2, 3 and 4.
An SMA connector is attached at the edge of the PCB opposite to the rectangular loop portion
of the probe as shown in the figures . Attachment pads for the SMA connector are on layers 1
and 3, which are connected to each other through four vias. The strip conductor pattern is on
layer 2, which is connected to the centre pin of the SMA connector.
6.3 Probe spacing fixture and placement
The probe output voltage depends on the distance between the probe tip and the strip
conductor under measurement. This makes it very critical to maintain a 1 mm space between
the strip conductor and the magnetic probe tip during this measurement. Therefore, a probe
spacing fixture shall be used to maintain 1,0 mm ± 0,1 mm spacing between the bottom of the
rectangular loop portion of the probe and strip line on the IC test board, or the entire probe
can be molded into a piece of fixing block which houses the probe so as to maintain the
specified space precisely as shown in figure 10.

61967-6 © IEC:2002+A1:2008 – 9 –
In addition, the probe output voltage depends on probe placement angle (ϕ) to direction of
microstrip line under measurement. According to an experimental measurement on angle
patterns of probe directional placement, the angle shall be less than 15° for amplitude error to
be less than –2 dB. See annex D for details.

Via for SMA connector
through layers 1, 2, and 3
Via for SMA connector
through layers 1, 2, and 3
Pads for SMA connector
on layer 1 and 3
Signal line pattern on layer 2
30 mm
50 Ω strip line
Ground plane patterns
on layer 1 and layer 3
Rectangular loop portion
for detection
10 mm
Via through layers 1, 2, and 3
IEC  1468/02
Figure 1 – Magnetic probe
Via
Center line
Via
10 mm
30 mm 0,8 mm
1,8 mm 0,2 mm
Via: 0,25 mm diameter
8,4 mm
0,1 mm
10 mm
IEC  1469/02
Figure 2 – Magnetic probe – First and third layers

– 10 – 61967-6 © IEC:2002+A1:2008

Via
Center line
30 mm
0,1 mm
1,0 mm
5,2 mm
Via: 0,25 mm diameter
0,4 mm
10 mm
IEC  2078/10
Figure 3 – Magnetic probe – Second layer
Layer 1
Insulator
Layer 2
Insulator
Layer 3
Insulators
(glass epoxy)
Insulators for reinforcement
(recommended)
Thickness of copper foils:
Layer 1: 0,035 mm
Layer 2: 0,035 mm
Layer 3: 0,035 mm
0,2 mm* 0,2 mm*
* Thickness of insulator
Center line
IEC  1471/02
Figure 4 – Magnetic probe – Layer construction

61967-6 © IEC:2002+A1:2008 – 11 –
7 Test set-up
7.1 General
General test set-up requirements are described in IEC 61967-1.
The measurement set-up and circuit schematic of the magnetic probe measurement method
are shown in figures 10 and 11, respectively.
7.2 Probe calibration
The magnetic probe used shall be calibrated to obtain accurate correlation between the
measured magnetic field intensity and the estimated RF current. The probe calibration shall
be in accordance with the method described in annex A (microstrip line method).
7.3 Modifications to standardized IC test board
The standardized IC test board described in IEC 61967-1 shall be used. However, it shall be
adapted as shown in figures 5, 6, 7, 8, and 9.
7.3.1 Layer arrangement
The IC test board shall have a minimum of four layers. It is recommended to use a four-layer
IC test board as shown in figures 5 and 6. If necessary, additional layers may be inserted
between the top layer and the microstrip ground layer to accommodate additional signal
and/or power routing. The construction of the IC test board shall be as specified in
IEC 61967-1, except as noted below in the case of n layers in general.
1) Top layer (layer 1): The IC under test shall be put on layer 1. See IEC 61967-1.
2) Layer next to the bottom layer (layer n−1): A ground plane area shall be formed on layer
n−1 to provide a reference for the microstrip structures on the bottom layer. The ground
plane can cover the entire layer or can be limited to the area under the microstrip
structures as shown in the dotted line area of figures 7 and 8. This ground plane area shall
have a minimum width of 11 mm and a minimum length of 14 mm.
3) Bottom layer (layer n): The microstrip conductor lines for measurement and peripheral
ground planes shall be on layer n. The microstrip conductor lines shall be in accordance
with figures 7 and 8 for power lines and I/O lines, respectively. The width of the strip
conductor line shall be 1,0 mm at maximum to achieve a high spatial resolution. See
annex C for details. The length of the microstrip conductor lines should be between 14 mm
and 25 mm in length to avoid standing waves.
7.3.2 Layer thickness
The PCB insulator thickness of 0,6 mm between layer n−1 and layer n is strongly
recommended. The coplanar gap between the measurement line and coplanar ground planes
shall be at least 2,0 mm and shall be at least three times the insulator thickness.
7.3.3 Decoupling capacitors
Decoupling capacitors (C1, C2) shall be used between the power supply lines and ground
planes on the test board as shown in figure 11. The capacitor (C2) shall be placed as close as
possible to the measurement area of the power supply line to provide low RF impedance. The
distance between C2 and the via to the V land shall be no more than 25 mm as shown in
DD
land and the IC ground as
figure 7. The capacitor (C1) shall be placed between the IC V
DD
shown in figure 9.
– 12 – 61967-6 © IEC:2002+A1:2008
7.3.4 I/O pin loading
This measurement can be used to measure the RF current of a single I/O pin. The I/O pin
current shall be measured pin by pin. The layout of the pin loading shall be in accordance with
figures 8 and 9. This pin should be loaded with an impedance matching network with a
resistance of 150 Ω as shown in figure 11. The impedance matching network should be
loaded by a 50 Ω resistor (R3) or a 50 Ω input impedance of normal measurement equipment
(receiver).
DUT
A B
Layer 1
0,4 mm Ground Ground Ground -Ground/signal
Layer 2
Signal Signal
0,4 mm V 1
DD -Power/signal
Layer 3
-Power/ground/signal
Ground and signal Ground and signal
0,6 mm V 2
DD
Layer 4
V and ground and signal V V V and ground and signal
DD DD DD DD
-Power/ground/signal
V (IC ground)
SS
Decoupling capacitor C1 for DUT
Layer thickness
Layer 1 : 0,035 mm (Recommended)
Insulator (Layer 1 to Layer 2) : 0,40 mm  (Recommended)
Layer 2 : 0,035 mm (Recommended)
Insulator (Layer 2 to Layer 3) : 0,40 mm (Recommended)
Layer 3 : 0,035mm (Recommended)
Insulator (Layer 3 to Layer 4) : 0,60mm (Strongly recommended)
Layer 4 : 0,035mm (Recommended)
IEC  1472/02
Figure 5 – Standardized IC test board – Sectional view 1

DUT
C D
Layer 1
-Ground/signal
Ground Ground Ground
0,4 mm
Layer 2
-Power/signal
0,4 mm Signal V 1 Signal
DD
Layer 3
-Power/ground/signal
V 2
0,6 mm Ground and signal DD Ground and signal
Ground V and ground and Layer 4
DD
signal -Power/ground/signal
Power supply
V (IC ground)
SS
pattern
Measurement power supply line
Decoupling capacitor C2
IEC  1473/02
Figure 6 – Standardized IC test board – Sectional view 2 – Measurement line

1,54 mm
1,54 mm
61967-6 © IEC:2002+A1:2008 – 13 –

Via to V land: 0,8 mm diameter
DD
11 mm min.
Power supply strip width:
1,0 mm max.
Coplanar gap: 2,0 mm min.
Overlapped plane width between layer 3 and
layer 4 ground planes: 3,0 mm min.
Via: 0,8 mm diameter
Layer 3 (microstrip ground plane pattern)
Decoupling capacitors
(example: 0,1 μF each)
C2
Decoupling capacitor
(example: 10 μF)
Power supply line pattern
Peripheral ground plane
IEC  1474/02
Figure 7 – Power line pattern on the standardized IC test board – Bottom layer

25 mm max.
14 mm min.
– 14 – 61967-6 © IEC:2002+A1:2008

Via: 0,3 mm diameter
11 mm min.
Via: 0,8 mm diameter
I/O signal strip width: 0,3 mm
Coplanar gap: 2,0 mm min.
Layer 3 (microstrip ground plane pattern)
Overlapped plane width between
layer 3 and layer 4 ground planes:
3,0 mm min.
R1 = 120 Ω
C3 = 6,8 nF
R2 = 51 Ω
SMA connector
IEC  1475/02
Figure 8 – I/O signal line pattern on the standardized IC test board – Bottom layer
IC ground plane
Power supply line pattern
to V 1 (see figure 7)
DD
A D
Peripheral ground plane
Example of I/O signal line pattern
C2
SMA connector
C1
* The RF current probe defined in
IEC 61967-4 may be used for
measurement of ground current,
C1
or this pattern shall be short-circuited
C2
if not used.
Power supply line
pattern to V 2
DD
(see figure 7)
C B
101,6 mm
IEC  1476/02
Figure 9 – Multi-power lines on the standardized IC test board – Bottom layer

101,6 mm
25 mm max.
14 mm min.
61967-6 © IEC:2002+A1:2008 – 15 –

Magnetic probe
Molded fixing block of
magnetic probe
Space between the
microstrip line and
magnetic probe tip:
Measurement microstrip line
1,0 ± 0,1 mm
Bottom layer
(layer n)
C2
Top layer
(layer 1) Ground layer for microstrip
IC
(layer n–1)
Standardized IC test board
(PCB)
IEC  1477/02
Figure 10 – Measurement set-up

Magnetic probe
Magnetic probe
Power supply 1
+
Power supply 2
I 1
DD
C2 C3 = 6,8 nF
C1 C1
SMA
V 2 V 1
DD DD
connector
I/O
IC
R1 = 120 Ω
I
I/O
R3 = 50 Ω
Ground
R2 = 51 Ω
Ground IC ground
Receiver
Impedance matching
network
IEC  1478/02
Figure 11 – Measurement circuit schematic

– 16 – 61967-6 © IEC:2002+A1:2008
8 Test procedure
8.1 General
The general requirements for the test procedure are described in IEC 61967-1.
8.2 Test technique
The magnetic probe shall be placed at a distance above the surface of the line under test on
the test board as described in 6.3. The output voltage (V ) of the magnetic probe is measured
p
by a spectrum analyzer or measuring receiver as described in IEC 61967-1. The magnetic
) is calculated from the measured value of the V as corrected by C (calibration
field (H
x_dB p f
factor of magnetic probe, see annexes A and B) with the following equation (B.12) taken from
annex B:
H = C + V (dB A/m) (B.12)
x_dB f_dB p_dB
RF current (I ) is then obtained using the following equation (B.13) with a transfer constant
_dB
(C ) for a typical example of the test board as described in annex B:
h
= V + C – C (dB A) (B.13)
I
dB p_dB f_dB h_dB
_
where
V = V value in dB (dB V);
p_dB p
C = C value in dB (dB S/m);
f_dB f
C = C value in dB (dB 1/m).
h_dB h
The C value depends on the insulator thickness of the microstrip board as shown in
h_dB
figure 12. The insulator thickness between layer n – 1 and layer n should be between 0,1 mm
and 1,6 mm. For the recommended insulator thickness (h = 0,6 mm), the C value
h_dB
is 30 (dB 1/m). For the microstrip board with a different insulator thickness, the RF current
is calculated according to equation (B.13), using an appropriate C value as shown in
h_dB
figure 12.
9 Test report
9.1 General
The test report shall be as described in IEC 61967-1.
The test report shall contain all specific requirements.
9.2 Documentation
The measurement data and parameters shall be documented in the test report, which shall
include the following information:
– test board material and its specification,
– thickness of insulator between layer n – 1 and layer n,
– microstrip line conductor width, coplanar gap, and characteristic impedance,
– decoupling capacitors (capacitance values, physical dimensions, number of pieces used,
and locations placed).
61967-6 © IEC:2002+A1:2008 – 17 –
Also description of the IC test board used (schematic, parts list, picture or copy of artwork,
etc.) shall accompany the test report. The measured data of RF currents shall be added.
Data shall be presented as a matrix of the frequency and the corresponding measured
amplitude data at each measurement point and/or as a plot of this matrix.
A description of any data processing used shall be a part of the test report.
0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6
Insulator thickness h [mm]
IEC  1479/02
Figure 12 – Transfer constant for current calculation as
a function of insulator thickness of microstrip board

Transfer constant C [dB 1/m]
h_dB
– 18 – 61967-6 © IEC:2002+A1:2008
Annex A
(normative)
Probe calibration procedure – Microstrip line method

The magnetic probe used for the measurement shall be calibrated in accordance with the
procedure described below. The calibration factor of the magnetic probe can be obtained by
using the microstrip line method, which has the advantage in that the probe can be calibrated
under the normal operating conditions for the magnetic probe method. The probe calibration
on a reference microstrip line on a PCB is shown in figure A.2. This calibration can be
performed with the same measurement set-up as the normal IC emission measurement on a
test board. This requires an accurate space placement of the probe that definitely minimizes
measuring errors and assures a highly repeatable emission measurement.
NOTE The microstrip line method is further described in [5] .
A.1 Pre-amplifier
Use a pre-amplifier as specified in IEC 61967-1, if necessary.
A.2 Spectrum analyzer set-up
Use manufacturer's recommended procedures for calibration of the spectrum analyzer. Set
attenuation at an appropriate level and video bandwidth at a minimum of three times the
resolution bandwidth to prevent video averaging of the signal.
A.3 Microstrip line
Use a microstrip line structure shown in figure A.1. The insulator thickness (h) of the
microstrip board used shall be 0,6 mm, and the characteristic impedance shall be 50 Ω ± 5 Ω.
In the case of dielectric constant ε = 4,7, the strip conductor width (W) is 1,0 mm. The ground
r
plane width (W ) of the microstrip line should be at least 50 mm. The microstrip line should
g
be long enough (for example, 101,6 mm) and should have a sufficiently high frequency
performance.
In order to check the characteristic impedance, RF measurement equipment such as a network
analyzer or a TDR oscilloscope should be used.
NOTE Power required to obtain a sufficient signal to noise (S/N) ratio may be determined in advance over
frequency range of interest.
Strip
W (1,0 mm)
(metal)
Dielectric
(ε = 4,7)
r
h = 0,6 mm
Ground
(metal)
W
g
IEC  1480/02
Figure A.1 – Cross-sectional view of a microstrip line for calibration
___________
Numbers in square brackets refer to the bibliography.

61967-6 © IEC:2002+A1:2008 – 19 –
A.4 Calibration
a) Measure the gain or loss of the test set-up. Include the pre-amplifier in this measurement,
if used.
b) Place the probe over the microstrip line so that the plane of the loop is perpendicular to
the ground plane and parallel to the longitudinal axis of the microstrip line. The centre of
the probe shall be located within ±0,4 mm distance from the centre of the microstrip line.
The face angle of the probe shall be within a 5° deviation from the axis of the microstrip
line. The distance from the microstrip line surface to the probe tip shall be maintained
within 1,0 mm ± 0,1 mm. These restrictions on the probe placement shall be maintained to
obtain calibration factors as accurately as possible. The maximum error for calibration
factors under these restrictions is estimated to be less than ±1,6 dB.
Sensitivity deviations of the probes with the dimensions specified in this document are
regarded as less than ±1,0 dB. Further information about the dependency on these
placement factors is shown in annexes B, C and D, respectively.
c) Connect a signal generator to one end of the microstrip line while a 50 Ω terminal to the
other end. Also, connect the cable from the magnetic probe connector to a spectrum
analyzer as shown in figure A.2.
d) Establish a field excitation around the reference microstrip line by the signal generator at
one frequency in the frequency band of interest, and record the level of the RF signal
induced in the probe as measured with the spectrum analyzer.
e) Repeat the procedure above at other frequencies over the frequency range. These data
can be used to plot a calibration curve for the probe under test. See reference [5] in the
bibliography for details.
f) The calibration factor can be calculated by the following equation (A.1):

⎡ ⎤
h
C = 20 log −V +V − 34 (dB S/m) (A.1)
f_dB p_dB s_dB
⎢ ⎥
πY()Y + 2h
⎣ ⎦
where
C is the calibration factor for the magnetic field (dB S/m),
f_dB
Y is the distance (m) between the strip conductor and the centre of the loop of the
magnetic probe,
h is the insulator thickness
...