Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials

IEC 62951-5:2019 specifies the test method for thermal characteristics of flexible materials. This document includes terms, definitions, symbols, and test methods that can be used to evaluate and determine thermal characteristics of flexible materials for practical use. The measurement method relies on non-contact optical thermometry that is based on temperature dependent optical reflectance. This document is applicable to both substrate and thin-film flexible semiconductor materials that are subjected to bending and stretching.

Dispositifs à semiconducteurs - Dispositifs à semiconducteurs souples et extensibles - Partie 5 : Méthode d’essai pour les caractéristiques thermiques des matériaux souples

L’IEC 62951-5:2019 spécifie la méthode d’essai pour les caractéristiques thermiques des matériaux souples. Le présent document inclut les termes, définitions, symboles et méthodes d’essai pouvant être utilisés pour évaluer et déterminer les caractéristiques thermiques des matériaux souples, dans le contexte d’une utilisation pratique. La méthode de mesure s’appuie sur la thermométrie optique sans contact, qui est elle-même basée sur le facteur de réflexion optique, qui dépend de la température. Le présent document s’applique aux semiconducteurs souples en substrat et en couche mince, qui sont soumis à des contraintes de courbure et d’étirement.

General Information

Status
Published
Publication Date
26-Feb-2019
Technical Committee
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
29-Mar-2019
Completion Date
27-Feb-2019
Ref Project

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IEC 62951-5:2019 - Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
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IEC 62951-5 ®
Edition 1.0 2019-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Flexible and stretchable semiconductor devices –
Part 5: Test method for thermal characteristics of flexible materials

Dispositifs à semiconducteurs – Dispositifs à semiconducteurs souples et
extensibles –
Partie 5: Méthode d’essai pour les caractéristiques thermiques des matériaux
souples
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IEC 62951-5 ®
Edition 1.0 2019-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Flexible and stretchable semiconductor devices –

Part 5: Test method for thermal characteristics of flexible materials

Dispositifs à semiconducteurs – Dispositifs à semiconducteurs souples et

extensibles –
Partie 5: Méthode d’essai pour les caractéristiques thermiques des matériaux

souples
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-6611-3

– 2 – IEC 62951-5:2019 © IEC 2019
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Testing method . 6
4.1 General . 6
4.2 Test apparatus . 7
4.3 Test procedures . 13
4.3.1 General . 13
4.3.2 Substrate specimen . 13
4.3.3 Thin-film specimen . 14
4.4 Report of results . 14
Annex A (informative) Example of 3D design of thermoreflectance thermometry . 15
Bibliography . 16

Figure 1 – Thermoreflectance signals of substrate and thin-film materials as functions
of temperature . 7
Figure 2 – Reflectance vs. temperature of silicon thin-films (thicknesses of 1,62 µm,
1,64 µm, and 1,67 µm) for the wavelength of 633 nm . 7
Figure 3 – Schematic of thermoreflectance thermometry with one laser source that is
used for calibration . 8
Figure 4 – Schematic of thermoreflectance thermometry with one laser source that is
used for measurement . 9
Figure 5 – Schematic of thermoreflectance thermometry with two lasers of different
wavelengths used for calibration . 10
Figure 6 – Schematic of thermoreflectance thermometry with two lasers of different
wavelengths used for measurement . 11
Figure 7 – Optical reflectance of a silicon thin-film (1,526 µm) at 532 nm and 633 nm
as a function of temperature . 12
Figure 8 – Reflectance ratio of a silicon thin-film as a function of temperature
(λ = 633 nm and λ = 532 nm) . 12
1 2
Figure 9 – Suspended bending or uniaxial stretching of flexible or stretchable
semiconductor materials . 13
Figure A.1 – 3D design of dual wavelength thermoreflectance setup . 15

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
FLEXIBLE AND STRETCHABLE SEMICONDUCTOR DEVICES –

Part 5: Test method for thermal characteristics of flexible materials

FOREWORD
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International Standard IEC 62951-5 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2534/FDIS 47/2543/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62951 series, published under the general title Semiconductor
devices – Flexible and stretchable semiconductor devices, can be found on the IEC website.

– 4 – IEC 62951-5:2019 © IEC 2019
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