IEC 61000-4-36:2014

IEC 61000-4-36 ®
Edition 1.0 2014-11
INTERNATIONAL
STANDARD
colour
inside
BASIC EMC PUBLICATION
Electromagnetic compatibility (EMC) –
Part 4-36: Testing and measurement techniques – IEMI immunity test methods
for equipment and systems
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IEC 61000-4-36 ®
Edition 1.0 2014-11
INTERNATIONAL
STANDARD
colour
inside
BASIC EMC PUBLICATION
Electromagnetic compatibility (EMC) –

Part 4-36: Testing and measurement techniques – IEMI immunity test methods

for equipment and systems
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
XC
ICS 33.100.20 ISBN 978-2-8322-1904-1

– 2 – IEC 61000-4-36:2014 © IEC 2014

CONTENTS
FOREWORD . 6

INTRODUCTION . 8

1 Scope . 9

2 Normative references . 9

3 Terms, definitions and abbreviations . 9

3.1 Terms and defintions . 9

3.2 Abbreviations . 12
4 General . 13
5 IEMI environments and interaction . 13
5.1 General . 13
5.2 IEMI environments . 14
5.2.1 Technical capability groups . 14
5.2.2 IEMI deployment scenarios . 14
5.2.3 Radiated IEMI environment summary . 15
5.2.4 Published conducted IEMI environments. 15
5.3 Interaction with fixed installations . 16
5.3.1 General . 16
5.3.2 Protection level . 17
6 Test methods . 17
6.1 Derivation of applicable test methods . 17
6.2 Derivation of transfer functions . 18
6.3 Radiated tests using IEMI simulator . 19
6.4 Radiated tests using a reverberation chamber . 19
6.5 Complex waveform injection (CWI) . 19
6.6 Damped sinusoidal injection (DSI) . 19
6.7 Electrostatic discharge (ESD) . 19
6.8 Electrically fast transient (EFT) . 19
6.9 Antenna port injection . 20
7 Test parameters . 20
7.1 Derivation of immunity test parameters . 20
7.2 Radiated test parameters . 21
7.2.1 Generic hyperband test parameters (skilled capability group) . 21
7.2.2 Generic mesoband test parameters (skilled capability group). 21
7.2.3 Generic hypoband/narrowband test parameters (skilled capability
group) . 23
7.3 Generic conducted IEMI test parameters. 24
7.3.1 General . 24
7.3.2 Characteristics and performance of the fast damped oscillatory wave
generator . 25
7.4 Tailored test level derivation . 26
7.5 Relevance of EMC immunity data . 26
8 Bibliography . 27
Annex A (informative) Failure mechanisms and performance criteria . 29
A.1 General . 29
A.2 Failure mechanisms . 29
A.2.1 General . 29

A.2.2 Noise . 30

A.2.3 Parameter offset and drifts . 30

A.2.4 System upset or breakdown . 31

A.2.5 Component destruction . 31

A.3 Effect of pulse width. 32

A.4 Performance criteria . 32

A.5 References . 33

Annex B (informative) Developments in IEMI source environments . 35

B.1 General . 35

B.2 IEMI environment . 36
B.3 IEMI sources . 37
B.4 Published radiated IEMI environments . 41
B.4.1 IEC 61000-2-13 . 41
B.4.2 Mil-Std-464C . 41
B.4.3 The International Telecommunication Union (ITU) . 42
B.4.4 Practical determination of a tailored test level – An example. 42
B.5 Summary . 43
B.6 References . 44
Annex C (informative) Interaction with buildings . 46
C.1 Building attenuation . 46
C.2 Coupling to cables . 47
C.3 Low voltage cable attenuation . 48
C.4 References . 49
Annex D (informative) Relation between plane wave immunity testing and immunity
testing in a reverberation chamber . 51
D.1 General . 51
D.2 Relation between measurements of shielding effectiveness in the two
environments . 52
D.3 Relation between immunity testing in the two environments . 55
D.4 Additional aspects . 57
D.5 References . 57
Annex E (informative) Complex waveform injection – Test method . 60
E.1 General . 60
E.2 Prediction . 60
E.2.1 General . 60

E.2.2 Example . 64
E.3 Construction . 66
E.4 Injection . 70
E.5 Summary . 72
E.6 References . 72
Annex F (informative) Significance of test methodology margins . 74
F.1 General . 74
F.2 Examples . 74
F.2.1 General . 74
F.2.2 Negative contributions . 75
F.2.3 Positive contributions. 77
F.2.4 Summary . 79
F.3 References . 79
Annex G (informative) Intentional EMI – The issue of jammers . 80

– 4 – IEC 61000-4-36:2014 © IEC 2014

G.1 General . 80

G.2 Effects . 80

G.3 Published accounts of jamming . 81

G.4 Risk assessment . 81

G.5 Mitigation . 81

G.6 References . 82

Figure 1 – Example of radiated and conducted IEMI interaction with a building . 16

Figure 2 – Assessment options . 18

Figure 3 – Examples of ports . 20
Figure 4 – Typical hyperband waveform . 21
Figure 5 – Typical mesoband waveform . 23
Figure 6 – Typical hypoband/narrowband waveform . 24
Figure 7 – Waveform of the damped oscillatory wave (open circuit voltage) . 25
Figure A.1 – IEMI induced offset of sensor output – Corruption of information . 30
Figure A.2 – Collision of an induced disturbance with data bits [1] . 31
Figure A.3 – Examples of destruction on a chip [2] . 31
Figure A.4 – Generic failure trend as a function of pulse width . 32
Figure B.1 – A comparison of HPEM and IEMI spectra [6] . 35
Figure B.2 – Representation of typical IEMI radiation and coupling onto systems [3] . 37
Figure B.3 – Parameter space in power/frequency occupied by sophisticated IEMI (i.e.
DEW) sources [1] . 38
Figure B.4 – Peak power and energy from continuous and pulsed (durations shown)
microwave sources, narrowband and wideband . 38
Figure B.5 – Peak powers of various types of pulsed HPM sources [1]. 39
Figure B.6 – Peak vs. average power for microwave sources with duty factors
indicated . 39
Figure B.7 – Phase coherence leading to a compact HPM source with N scaling of
output power . 40
Figure B.8 – Briefcase mesoband UWB source sold by Diehl-Rheinmetall [3] . 40
Figure B.9 – A do-it-yourself electromagnetic weapon made from an oven magnetron
[13] . 41
Figure B.10 – Plot of entire narrowband system weight as a function of output

microwave power for land-mobile and land-transportable systems . 43
Figure C.1 – Typical unprotected low-rise building plane wave E-field attenuation
collected from references . 46
Figure C.2 – Cable coupling – Resonance region . 48
Figure C.3 – Mains cable attenuation profile . 49
Figure E.1 – LLSC reference field measurement set-up . 61
Figure E.2 – LLSC induced current measurement set-up . 62
Figure E.3 – Typical LLSC magnitude-only transfer function . 62
Figure E.4 – Prediction of induced current using minimum phase constraints . 63
Figure E.5 – IEC 61000-2-9 early-time (E1) HEMP environment . 64
Figure E.6 – Overlay of transfer function and threat (frequency domain) . 65
Figure E.7 – Predicted current . 65
Figure E.8 – Example of de-convolution result . 67

Figure E.9 – Damped sinusoidal waveforms – Ten-component fit . 67

Figure E.10 – Approximated and predicted transient . 68

Figure E.11 – Approximated and predicted transient (0 ns to 100 ns) . 68

Figure E.12 – Approximation and prediction transient – Frequency domain comparison . 69

Figure E.13 – Variation in error for increasing number of damped sinusoids . 70

Figure E.14 – Complex injection set-up . 71

Figure E.15 – Amplifier requirements for various current levels . 71

Figure E.16 – Comparison of predicted (green) and injected (red) current . 72

Figure F.1 – Variation in induced currents as a result of configuration . 75
Figure F.2 – Comparison of HPD and VPD induced currents . 76
Figure F.3 – System variability . 76
Figure F.4 – Comparison of single- and multi-port injection . 77
Figure F.5 – Example transfer functions and worst-case envelope . 78
Figure F.6 – Comparison of individual and worst-case transfer function predictions . 78
Figure F.7 – Comparison between predicted and measured induced currents . 79

Table 1 – Possible IEMI Deployment Scenarios . 15
Table 2 – Summary of radiated IEMI source output (rE ) by capability group . 15
far
Table 3 – Example protection levels . 17
Table 4 – Generic hyperband test parameters (skilled capability group) . 21
Table 5 – Generic mesoband test parameters (skilled capability group) . 22
Table 6 – Generic hypoband/narrowband test parameters (skilled capability group) . 23
Table 7 – Conducted IEMI test levels . 24
Table 8 – Open circuit specifications . 25
Table 9 – Short Circuit Specifications . 26
Table A.1 – Recommended performance criteria . 33
Table B.1 – IEMI environments from IEC 61000-2-13 . 41
Table B.2 – Hypoband/narrowband HPM environment. 42
Table B.3 – Hyperband/wideband HPM environment . 42
Table C.1 – Shielding effectiveness measurements for various power system buildings
and rooms. 47

Table E.1 – Time waveform norms . 66

– 6 – IEC 61000-4-36:2014 © IEC 2014

INTERNATIONAL ELECTROTECHNICAL COMMISSION

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ELECTROMAGNETIC COMPATIBILITY (EMC) –

Part 4-36: Testing and measurement techniques –

IEMI immunity test methods for equipment and systems

FOREWORD
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International Standard IEC 61000-4-36 has been prepared by subcommittee 77C: High-power
transient phenomena, of IEC technical committee 77: Electromagnetic compatibility.
It forms part 4-36 of IEC 61000. It has the status of a basic EMC publication in accordance
with IEC Guide 107.
The text of this standard is based on the following documents:
CDV Report on voting
77C/231/CDV 77C/236/RVC
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 61000 series, published under the general title Electromagnetic

compatibility (EMC), can be found on the IEC website.

The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be

• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 8 – IEC 61000-4-36:2014 © IEC 2014

INTRODUCTION
IEC 61000 is published in separate parts according to the following structure:

Part 1: General
General considerations (introduction, fundamental principles)

Definitions, terminology
Part 2: Environment
Description of the environment
Classification of the environment
Compatibility levels
Part 3: Limits
Emission limits
Immunity limits (in so far as they do not fall under the responsibility of the product
committees)
Part 4: Testing and measurement techniques
Measurement techniques
Testing techniques
Part 5: Installation and mitigation guidelines
Installation guidelines
Mitigation methods and devices
Part 6: Generic standards
Part 9: Miscellaneous
Each part is further subdivided into several parts, published either as International Standards
or as technical specifications or technical reports, some of which have already been published
as sections. Others will be published with the part number followed by a dash and a second
number identifying the subdivision (example: IEC 61000-6-1).

ELECTROMAGNETIC COMPATIBILITY (EMC) –

Part 4-36: Testing and measurement techniques –

IEMI immunity test methods for equipment and systems

1 Scope
This part of IEC 61000 provides methods to determine test levels for the assessment of the
immunity of equipment and systems to intentional electromagnetic interference (IEMI)
sources. It introduces the general IEMI problem, IEMI source parameters, derivation of test
limits and summarises practical test methods.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61000-4-4, Electromagnetic compatibility (EMC) – Part 4-4: Testing and measurement
techniques – Electrical fast transient/burst immunity test
IEC 61000-4-12, Electromagnetic compatibility (EMC) – Part 4-12: Testing and measurement
techniques – Ring wave immunity test
IEC 61000-4-18, Electromagnetic compatibility (EMC) – Part 4-18: Testing and measurement
techniques – Damped oscillatory wave immunity test
3 Terms, definitions and abbreviations
For the purposes of this document, the following terms, definitions and abbreviations apply.
3.1 Terms and defintions
3.1.1
attenuation
reduction in magnitude (as a result of absorption and/or scattering) of an electric or magnetic
field or a current or voltage, usually expressed in decibels
3.1.2
bandratio
br
ratio of the high and low frequencies between which there is 90 % of the energy
Note 1 to entry: If the spectrum has a large dc content, the lower limit is nominally defined as 1 Hz (see
IEC 61000-2-13 for further details).
3.1.3
bandratio decades
brd
bandratio expressed in decades as: brd = log10(br)

– 10 – IEC 61000-4-36:2014 © IEC 2014

3.1.4
burst
time frame in which a series of pulses occurs with a given repetition rate

Note 1 to entry: When multiple bursts occur, the time between bursts is usually defined.

3.1.5
conducted HPEM environment
high-power electromagnetic currents and voltages that are either coupled or directly injected

to cables and wires with voltage levels that typically exceed 1 kV

3.1.6
continuous wave
CW
time waveform that has a fixed frequency and is continuous
3.1.7
electromagnetic compatibility
EMC
ability of an equipment or system to function satisfactorily in its electromagnetic environment
without introducing intolerable electromagnetic disturbances to anything in that environment
3.1.8
electromagnetic disturbance
any electromagnetic phenomenon which may degrade the performance of a device,
equipment or system
3.1.9
electromagnetic interference
EMI
degradation of the performance of a device, transmission channel or system caused by an
electromagnetic disturbance
Note 1 to entry: Disturbance and interference are respectively cause and effect.
3.1.10
(electromagnetic) shield
electrically continuous housing for a facility, area, or component used to attenuate incident
electric and magnetic fields by both absorption and reflection
3.1.11
(electromagnetic) susceptibility
inability of a device, equipment or system to perform without degradation in the presence of

an electromagnetic disturbance
Note 1 to entry: Susceptibility is a lack of immunity.
3.1.12
equipment under test
EUT
equipment being subjected to the test
3.1.13
high-altitude electromagnetic pulse
HEMP
electromagnetic pulse produced by a nuclear explosion outside the earth’s atmosphere
Note 1 to entry: Typically above an altitude of 30 km.

3.1.14
high-power microwaves
HPM
narrowband signals, nominally with peak power in a pulse, in excess of 100 MW at the source

Note 1 to entry: This is a historical definition that depended on the strength of the source. The interest in this
document is mainly on the EM field incident on an electronic system.

3.1.15
hyperband signal
signal or waveform with a pbw (see 3.1.20) value between 163,4 % and 200 % or a

bandratio > 10
3.1.16
hypoband signal
narrowband signal or waveform with a pbw of < 1 % or a bandratio < 1,01
3.1.17
intentional electromagnetic interference
IEMI
intentional malicious generation of electromagnetic energy introducing noise or signals into
electric and electronic systems, thus disrupting, confusing or damaging these systems for
terrorist or criminal purposes
[SOURCE: IEC 61000-2-13:2005, 3.16]
3.1.18
L band
radar frequency band between 1 GHz and 2 GHz
3.1.19
mesoband signal
signal or waveform with a pbw value between 1 % and 100 % or a bandratio between 1,01
and 3
3.1.20
percentage bandwidth
pbw
bandwidth of a waveform expressed as a percentage of the centre frequency of that waveform
Note 1 to entry: The pbw has a maximum value of 200 % when the centre frequency is the mean of the high and
low frequencies. The pbw does not apply to signals with a large dc content (e.g., HEMP) for which the bandratio
decades is used.
3.1.21
port-of-entry
PoE
physical location (point) on an electromagnetic barrier, where EM energy may enter or exit a
topological volume, unless an adequate PoE protective device is provided
Note 1 to entry: A PoE is not limited to a geometrical point.
Note 2 to entry: PoEs are classified as aperture PoEs or conductive PoEs according to the type of penetration.
They are also classified as architectural, mechanical, structural or electrical PoEs according to the functions they
serve.
3.1.22
pulse
transient waveform that usually rises to a peak value and then decays, or a similar waveform
that is an envelope of an oscillating waveform

– 12 – IEC 61000-4-36:2014 © IEC 2014

3.1.23
pulse repetition frequency
prf
number of pulses per unit time, measured in Hz (per second)

3.1.24
radiated HPEM environment
high-power electromagnetic fields with peak electric field levels that typically exceed 100 V/m

3.1.25
rE
far
electric field normalised at a distance of 1 m from the antenna as derived from an E-field
measurement at a given distance in the far-field
3.1.26
sub-hyperband signal
signal or a waveform with a pbw value between 100 % and 163,4 % or a bandratio between 3
and 10
3.1.27
transient
pertaining to or designating a phenomenon or a quantity which varies between two
consecutive steady states during a time interval which is short compared with the time-scale
of interest
Note 1 to entry: A transient can be a unidirectional impulse of either polarity or a damped oscillatory wave with
the first peak occurring in either polarity.
3.1.28
ultrawideband
UWB
signal that has a percent bandwidth greater than 25 %
3.2 Abbreviations
DS Damped sinusoid
EMI Electromagnetic interference
ESD Electrostatic discharge
HEMP High-altitude electromagnetic pulse
HIRF High-intensity radiated fields

HPD Horizontally polarized dipole
HPEM High-power electromagnetic
HPM High-power microwave
LEMP Lightning electromagnetic pulse
LLSF Low level swept field
LLSC Low level swept current
NEMP Nuclear electromagnetic pulse
SE Shielding effectiveness
UWB Ultra wideband
VPD Vertically polarized dipole

4 General
The use of electromagnetic sources to generate intentional electromagnetic interference

(IEMI) is of increasing concern as the reliance of society on technology increases

significantly. Many technical papers have been published that show the effects of IEMI are
cause for concern; they are summarised in [1] . A summary of failure mechanisms at
equipment level is provided in Annex A.

The effects of IEMI on equipment can be similar to the effects caused by high-power
electromagnetic (HPEM) environments. HPEM environments include high-intensity radiated
fields (HIRF) generated by radio and radar systems, lightning electromagnetic pulse (LEMP)
and electrostatic discharge (ESD). Some of these HPEM environments have similar
characteristics to those sources used to cause IEMI but are unintentional EMI sources, i.e.
non-malicious. However, it is possible to use information regarding qualification of equipment
and systems to these environments to inform the likely response to IEMI.
The IEC defines IEMI within 3.1.17 as ‘intentional malicious generation of electromagnetic
energy introducing noise or signals into electric and electronic systems, thus disrupting,
confusing or damaging these systems for terrorist or criminal purposes’.
Within this definition it is possible to also include jammers, which are designed to overload
antenna receiver circuits (front doors) by operating at or close to the victim receiver frequency
of operation. Jammers typically require low power to operate due to the fact that receivers are
designed to operate at very low power levels (nW or less). More information on the issue of
jammers can be found in Annex G.
This document complements IEC 61000-4-25 [2], which deals with high-altitude
electromagnetic pulse (HEMP) immunity test methods for equipment and systems.
5 IEMI environments and interaction
5.1 General
There are many types of sources that can generate electromagnetic environments that can
potentially be used to cause intentional electromagnetic interference (IEMI). IEC 61000-2-13
[3] discusses the various environments that can be generated and categorises them in terms
of time characteristics, frequency range and bandratio. Further details and actual examples
are included within Annex B.
A key requirement of developing IEMI test methods and test levels is to achieve a good
understanding of the environment in which the victim equipment or system will be required to
operate. Within this document specific focus is provided for victim equipment that is integrated
within a site or other fixed installation and it is generally assumed that such equipment is
housed within a building.
IEMI phenomena are unlike other EMC standardised phenomena where assumptions can be
made about the general or average disturbance level arriving at victim equipment ports.
Important parameters related to the IEMI interaction with victim systems which will affect the
test level include:
a) IEMI source parameters
1) frequency range of the source,
___________
Numbers in square brackets refer to the Bibliography in Clause 8.

– 14 – IEC 61000-4-36:2014 © IEC 2014

2) amplitude of the source vs. distance to the victim system,

3) pulse width, pulse repetition frequency, burst length of the source,

4) source mobility,
5) technical capability of the source user/designer.

b) The protection level of the fixed installation

1) the range or distance between the IEMI Source and the victim electronics,

2) the propagation channel loss including the properties of the intervening barriers

(attenuation and absorption).
Once these characteristics of the IEMI source and environment are well understood, then
appropriate test methods and test levels for ports on the victim equipment can be determined.
One approach would be to take all of the IEMI source parameters of interest and combine
them such that one set of test levels is derived. The disadvantage of this approach is that,
should effects be observed, it would be difficult to assign them to any single IEMI parameter
set. In addition the combination of widely varying waveform characteristics would likely result
in an extreme set of test levels.
Some IEMI sources generate waveforms/environments that are similar to other
electromagnetic (EM) environments, for example electrostatic discharge (ESD) or lightning
electromagnetic pulse (LEMP). Analytical methods can be used to determine the amount of
similarity between IEMI environments and other EM environments, in particular through the
use of waveform norms (see IEC 61000-4-33 [4]). Any deficiencies in the test evidence could
be made up through increasing the distance between the IEMI source and the electronic
systems of interest or by undertaking testing focussed on specific frequencies.
5.2 IEMI environments
5.2.1 Technical capability groups
IEMI sources vary in complexity. It is therefore important to understand the relationship
between this complexity and the technical capability of the perpetrator. This document defines
three levels:
a) Novice – Individuals or small groups with minimal technical or financial support.
b) Skilled – Moderately well-funded adversaries with training and expertise in relevant
technology.
c) Specialist – Well-funded adversaries with post-graduate level training and access to
substantial research capabilities, resources and funding.

When considering the IEMI sources of interest it is important to consider the deployment
scenario.
5.2.2 IEMI deployment scenarios
IEMI sources can be packaged and deployed in different ways, although this generally
depends on the technical capability of the designer and the available resources. A set of
potential scenarios for deployment of IEMI generators is given in Table 1.

Table 1 – Possible IEMI Deployment Scenarios

Deployment Example use Victim interaction Technical

scenarios capability group
Man portable Carried to the victim and used while in Direct Novice

possession of the adversary. Could be
Radiated Skilled
assembled in place.
Conducted
Hand delivered Carried to the victim and concealed, Direct Novice
perhaps remotely activated. Could be

Radiated Skilled
assembled in place.
Conducted
Fixed installation Set-up in a space adjacent to the victim, i.e. Radiated Novice
an adjoining room or building.
Conducted Skilled
Specialist
Automotive / Mounted inside a pic
...