IEC 62969-1:2017

IEC 62969-1 ®
Edition 1.0 2017-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 1: General requirements of power interface for automotive vehicle sensors

Dispositifs à semiconducteurs – Interface à semiconducteurs pour les véhicules
automobiles –
Partie 1: Exigences générales de l’interface d’alimentation destinée aux capteurs
de véhicules automobiles
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IEC 62969-1 ®
Edition 1.0 2017-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Semiconductor interface for automotive vehicles –

Part 1: General requirements of power interface for automotive vehicle sensors

Dispositifs à semiconducteurs – Interface à semiconducteurs pour les véhicules

automobiles –
Partie 1: Exigences générales de l’interface d’alimentation destinée aux capteurs

de véhicules automobiles
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-5272-7

– 2 – IEC 62969-1:2017 © IEC 2017

CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 General system . 8
4.1 General system blocks . 8
4.2 Classification . 8
4.2.1 Sensors in automotive vehicles . 8
4.2.2 Power sources . 9
4.3 Data interface . 10
4.3.2 Reset . 10
4.3.3 Monitoring . 10
5 Environmental conditions and requirements . 10
5.1 General . 10
5.2 Test conditions and items . 10
5.2.1 General . 10
5.2.2 Temperature range . 11
5.2.3 Humidity . 11
5.2.4 Damp heat . 11
5.2.5 Temperature cycling . 11
5.2.6 Mechanical impact and vibration . 12
5.2.7 EMC . 12
5.2.8 IP ratings . 12
5.3 Test setup . 12
6 Power interfaces and checking items . 13
6.1 Input voltage level . 13
6.2 Main error sources . 14
6.2.1 AC noise . 14
6.2.2 Voltage drop . 14
6.3 Redundancy of power interface . 14
Annex A (informative) General description of power interface for automotive vehicle
sensors . 15
Bibliography . 16

Figure 1 – Power supply chains to the vehicle sensors . 8
Figure 2 – Example of test conditions and items . 10
Figure 3 – Test setup for checking the power level to sensors . 13
Figure 4 – Checking input voltage level to sensors (12 V sensors) . 13
Figure A.1 – Sensor-based system in automotive vehicles . 15

Table 1 – Sensors for automotive vehicles . 9
Table 2 – Power sources to sensors in automotive vehicles . 9

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES –

Part 1: General requirements of power interface
for automotive vehicle sensors

FOREWORD
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International Standard IEC 62969-1 has been prepared by IEC technical committee 47:
Semiconductor devices.
This bilingual version (2018-01) corresponds to the monolingual English version, published in
2017-12.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2433/FDIS 47/2447/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.

– 4 – IEC 62969-1:2017 © IEC 2017
The French version of this standard has not been voted upon.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62969 series, published under the general title Semiconductor
devices – Semiconductor interface for automotive vehicles, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
INTRODUCTION
The IEC 62969 series is composed of four parts as follows:
• IEC 62969-1, Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 1: General requirements of power interface for automotive vehicle sensors
• IEC 62969-2, Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 2: Efficiency evaluation methods of wireless power transmission using resonance for
automotive vehicle sensors
• IEC 62969-3, Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
• IEC 62969-4, Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 4: Evaluation methods of data interface for automotive vehicle sensors
The IEC 62969 series covers power and data interfaces for sensors in automotive vehicles.
The first part covers general requirements of test conditions such as temperature, humidity,
vibration, etc. for automotive sensor power interface. This part also includes various electrical
performances of power interface such as voltage drop from power source to automotive
sensors, noises, voltage level, etc. The second part covers “Efficiency evaluation methods of
wireless power transmission using resonance for automotive vehicle sensors “. The third part
covers “Shock driven piezoelectric energy harvesting for automotive vehicle sensors”. The
fourth part covers “Evaluation methods of data interface for automotive vehicle sensors”.

– 6 – IEC 62969-1:2017 © IEC 2017
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES –

Part 1: General requirements of power interface
for automotive vehicle sensors

1 Scope
This part of IEC 62969 provides general requirements for performance evaluations and
environmental conditions for the power interface of automotive vehicle sensors. For
performance evaluations, various electrical performances such as voltage drop from power
source to automotive sensors, AC noises and voltage level are included. For environmental
conditions, various test conditions such as temperature, humidity and vibration are included.
In addition, terms, definitions, symbols and configurations are covered in this part.
NOTE Additional information on power interface for automotive vehicle sensors is provided in Annex A.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-30, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
IEC 60529, Degrees of protection provided by enclosures (IP Code)
IEC 60721 (all parts), Classification of environmental conditions
IEC 60749-10, Semiconductor devices – Mechanical and climatic test methods – Part 10:
Mechanical shock
IEC 60749-12, Semiconductor devices – Mechanical and climatic test methods – Part 12:
Vibration, variable frequency
IEC 61851-1, Electric vehicle conductive charging system – Part 1: General requirements
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 1: General conditions and definitions
IEC 61967-2, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 2: Measurement of radiated emissions – TEM cell and wideband TEM cell
method
IEC TS 61967-3, Integrated circuits – Measurement of electromagnetic emissions – Part 3:
Measurement of radiated emissions – Surface scan method
IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling
method
IEC 61967-5, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 5: Measurement of conducted emissions – Workbench Faraday Cage method
IEC 61967-6, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method
IEC 61967-8, Integrated circuits – Measurement of electromagnetic emissions – Part 8:
Measurement of radiated emissions – IC stripline method
IEC 62132-1, Integrated circuits – Measurement of electromagnetic immunity – Part 1:
General conditions and definitions
IEC 62132-2, Integrated circuits – Measurement of electromagnetic immunity – Part 2:
Measurement of radiated immunity – TEM cell and wideband TEM cell method
IEC 62132-3, Integrated circuits – Measurement of electromagnetic immunity, 150 kHz to
1 GHz – Part 3: Bulk current injection (BCI) method
IEC 62132-4, Integrated circuits – Measurement of electromagnetic immunity 150 kHz to
1 GHz – Part 4: Direct RF power injection method
IEC 62132-5, Integrated circuits – Measurement of electromagnetic immunity, 150 kHz to
1 GHz – Part 5: Workbench Faraday cage method
IEC TS 62215-2, Integrated circuits – Measurement of impulse immunity – Part 2:
Synchronous transient injection method
IEC 62262, Degrees of protection provided by enclosures for electrical equipment against
external mechanical impacts (IK code)
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
power interface
physical connection between two different functional units those are connected via cable,
printed circuit or wireless connection through a medium such as air to transfer the electrical
power
EXAMPLE connection between battery and electrical load such as electronic control units (ECU) and sensors
through electrical cable to transfer electrical power.

– 8 – IEC 62969-1:2017 © IEC 2017
3.2
reference voltage
V
r
value of the voltage in accordance with which the relevant performance of a meter is fixed
[SOURCE: IEC 60050-314:2001, 314-07-04]
3.3
maximum voltage
V
max
the specified highest voltage applied to a load at which the load (systems or devices) operate
normally
3.4
minimum voltage
V
min
the specified lowest voltage applied to a load at which the load (systems or devices) operate
normally
4 General system
4.1 General system blocks
Power sources in automotive vehicles vary depending on the type of automotive vehicles.
Using energy harvesting and wireless power transfer technologies, the battery in an
automotive vehicle can be charged to provide power to sensors directly or through ECU as
shown in Figure 1.
DC power
Parking
Convenience
mode
(Black box, motion)
Accessory Fundamental function
mode (Audio, clock)
Power on Convenience
mode
(Rain sensor)
Run/Safety
ECU
(Pressure, fluid)
Battery Ignition
Alternator
mode
AC power
Wireless sensors
- Energy harvesting
Energy harvesting
(TPMS)
- Wireless power transfer
IEC
Figure 1 – Power supply chains to the vehicle sensors
4.2 Classification
4.2.1 Sensors in automotive vehicles
The type of the applicable sensors with respect to usage shall be listed as shown in Table 1.

Table 1 – Sensors for automotive vehicles
Usage Sensors Type
oxygen sensor gas sensor
crankshaft position sensor magnetic sensor
engine coolant temperature sensor temperature sensor
wheels speed sensor magnetic sensor
shaft speed sensor hall sensor
manifold absolute pressure (MAP) sensor pressure sensor
throttle position sensor hall sensor
Run (power train and
torque sensor magnetic sensor
control)
transmission fluid temperature sensor temperature sensor
turbine speed sensor magnetic sensor
vehicle speed sensor magnetic sensor
current sensor current sensor
fuel level sensor capacitive sensor
engine oil level sensor ultrasonic sensor
brake fluid level sensor magnetic sensor
air bag sensor accelerometer sensor
steering wheel angle sensor magnetic sensor
blind spot monitor image sensor
Safety parking sensor ultrasonic sensor
radar sensor radar sensor
yaw rate sensor gyro sensor
tire pressure sensor pressure sensor
rain sensor light sensor
light sensor light sensor
Security,
Convenience and temperature/ humidity sensor temperature/ humidity sensor
Entertainment
air quality sensor gas sensor
black box image sensor
NOTE Additional sensors can be added.
4.2.2 Power sources
To provide power to sensors, various power sourcing technologies can be used as in Table 2.
Table 2 – Power sources to sensors in automotive vehicles
Power sources Power sourcing methods
Generating power using Fuel or gas
Activating engine to generate electrical power using fuel or gas
Providing electrical power from transmitter to sensors through air or
Wireless power transfer medium (inductive coupling, magnetic resonance, microwave-based
transfer, etc.)
Acquiring electrical power from physical phenomena of environment
Energy harvesting
such as vibration, thermal difference, etc.

NOTE Additional power sourcing technologies can be added.

– 10 – IEC 62969-1:2017 © IEC 2017
4.3 Data interface
4.3.1 General
The functions described in 4.3.2 and 4.3.3 shall be included to control and monitor the status
of power supply between ECU and sensors.
4.3.2 Reset
Reset function of power supply shall be provided. This function shall be done automatically or
manually.
4.3.3 Monitoring
Monitoring function of power supply shall be provided. This function shall be provided with
user interface (UI) such as display.
5 Environmental conditions and requirements
5.1 General
The power interface for sensors in automotive vehicles shall be designed and manufactured
to resist the effect of various solvents and fluids, vibration and shock, temperature changes,
humidity changes and dust.
Environmental conditions shall be defined for semiconductor components used for automotive
vehicle according to existing specifications based on IEC 61851-1 and classification of
environmental conditions based on IEC 60721 (all parts).
5.2 Test conditions and items
5.2.1 General
All test conditions and items shall be listed in a table or diagram as shown as an example in
Figure 2.
Test procedure and items
Electrical properties EMC/ESD Environmental test Reliability test
Voltage level on each mode EMC (EMI/EMS) Temperature on each mode Impact test
Voltage level in battery ESD Temperature/humidity Vibration test
Power switching test Thermal shock
Open/short test Temperature cycle
Reverse voltage test Temperature/humidity cycle
Dust
Over voltage test
Water proof test
Salt water
IEC
Figure 2 – Example of test conditions and items

NOTE Additional tests can be added.
5.2.2 Temperature range
5.2.2.1 General
The semiconductor components in the power interface shall be checked by ECU or another
monitoring system under various temperature conditions to prevent malfunction and damage.
5.2.2.2 Temperature monitoring
The temperature for the ambient, coldest and hottest including damp heat and temperature
cycling shall be monitored and recorded at real time and various places. For the monitoring,
widely used thermistors can be used.
5.2.2.3 Ambient temperature
The ambient temperature shall be measured and recorded to provide reference temperature
for the coldest and the hottest temperature conditions. The ambient temperature range shall
be provided by the manufacturer.
5.2.2.4 Coldest temperature
The coldest temperature shall be measured and recorded at real time and in various places
and the semiconductor components in the power interface shall be tested at the coldest
temperature.
The test shall be in accordance with IEC 60068-2-1 at – 25 °C ± 3 °C for 16 hours.
5.2.2.5 Hottest temperature
The hottest temperature shall be measured and recoded at real time and in various places
and the semiconductor components in the power interface shall be tested at the hottest
temperature.
The test shall be in accordance with IEC 60068-2-2.
5.2.3 Humidity
The semiconductor components in the power interface shall be checked by ECU or other
monitoring system under various humidity conditions to prevent malfunction and damage.
The semiconductor components in the power interface shall be tested at a range between 5 %
and 95 %. The test shall be in accordance with IEC 60068-2-30 for the 12 days. The test shall
be done 5 cycles at the various damp heat cycling, (40 ± 3) °C and relative humidity of 95 %
for 24 hours according to IEC 60068-2-30.
5.2.4 Damp heat
This test applies a highly accelerated temperature and humidity stress test for the purpose of
evaluating the resistance of the semiconductor components in the power interface against
damp heat conditions. The effect of damp heat conditions on semiconductor components in
the power interface shall be checked by ECU or another monitoring system to prevent
malfunction and damage.
5.2.5 Temperature cycling
The ability of the semiconductor components in the power interface to withstand mechanical
stresses induced by alternating high and low temperature extremes shall be checked by ECU
or another monitoring system to prevent malfunction and damage.

– 12 – IEC 62969-1:2017 © IEC 2017
The test shall be in accordance with IEC 60068-2-14.
5.2.6 Mechanical impact and vibration
The effect of mechanical shock, impact and vibration to the semiconductor components in the
power interface shall be checked by ECU or another monitoring system to prevent malfunction
and damage. This test is intended to determine the suitability of the semiconductor
components in the power interface for use in vehicles which may be subjected to moderately
severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by
rough handling, transportation, or field operation.
The test shall be in accordance with IEC 62262 and IEC 60749-10.
5.2.7 EMC
5.2.7.1 General
The EMC of the semiconductor components in the power interface shall be tested to prevent
malfunction and damage.
5.2.7.2 Immunity
The immunity of the semiconductor components in the power interface shall be tested with
respect to performance criteria to prevent malfunction and damage.
The test shall be in accordance with IEC TS 62215-2, IEC 62132-1, IEC 62132-2,
IEC 62132-3, IEC 62132-4 and IEC 62132-5.
5.2.7.3 Emission
The electromagnetic wave emission from the semiconductor components in the power
interface shall be tested under the worst cast scenarios in order to create maximum emissions.
The test shall be in accordance with IEC 61967-1, IEC 61967-2, IEC 61967-3, IEC 61967-4,
IEC 61967-5, IEC 61967-6 and IEC 61967-8.
5.2.8 IP ratings
The IP (Ingress Protection) rating of the semiconductor components in power interface shall
be provided by the manufacturer.
The test shall be in accordance with IEC 60529.
5.3 Test setup
A multi-meter or other equipment can be used to evaluate quality of power from the power
source through an interface such as switchboard to the ECU and sensors as shown
in Figure 3.
Oscilloscope
Checking
error code
data
Interface /
Power
power
power
data
switch
ECU Actuators
source
board
power
data
Multi-meter
(Measuring V/I)
Sensors
(DUT)
IEC
Figure 3 – Test setup for checking the power level to sensors
6 Power interfaces and checking items
6.1 Input voltage level
Many sensors could be used to provide drivers or users of automotive vehicles with
convenience and safety. In that case, a secured power supply to the sensor is a key issue to
ensure functional safety.
V
max
V
r
V
min
Time (ms)
IEC
Key:
V Reference voltage
r
V Maximum voltage
max
V Minimum voltage
min
Figure 4 – Checking input voltage level to sensors (12 V sensors)
Voltage (V)
– 14 – IEC 62969-1:2017 © IEC 2017
This test shall be performed to check the input voltage level to sensors as shown in Figure 4.
Using an oscilloscope or multi-meter, input voltage level to sensors shall be checked to
ensure proper function of sensors. The deviation between “V ” and “V ” or “V ” and “V ”
r max r min
shall be confirmed.
6.2 Main error sources
6.2.1 AC noise
AC noise level from motors, pan, oil pumps, etc. shall be provided by the manufacturer to
evaluate power quality.
6.2.2 Voltage drop
Voltage drops from power sources (generator or battery) to sensors shall be checked
according to a power path. The path could be printed circuit board, cable and some active
semiconductor components.
6.3 Redundancy of power interface
Power interface could be open or voltage level could be unstable due to several reasons such
as malfunctions or damage. To secure functional safety of power interface from power source
to sensors, a redundant power interface shall be provided.

Annex A
(informative)
General description of power interface
for automotive vehicle sensors
There is a great interest for semiconductor electronic devices in vehicles. In particular,
various sensors are used in automotive vehicles to enhance the safety and comfort of humans.
For example, ISO 26262 (all parts) covers various requirements of electronic systems in
automotive vehicles to secure functional safety.
The needs for sensors in automotive vehicles are increased to ensure humans’ safety and
convenience. The sensors convert physical and environmental information into electrical
signal to control various actuators such as motor, engine, etc. (see Figure A.1).

Power
Physical/Environmental
Signal
Command
Control
information
Sensors
Actuators
Unit
(ECU)
IEC
Figure A.1 – Sensor-based system in automotive vehicles
To guarantee the functional safety of various sensors in automotive vehicles, the power
interface and distribution of power to the sensors and the data interface between sensors and
electronic control units (ECUs) are very important.

– 16 – IEC 62969-1:2017 © IEC 2017
Bibliography
IEC 61508 (all parts), Functional safety of electrical/electronic/programmable electronic
safety-related systems
ISO 26262 (all parts), Road vehicles – Functional safety

___________
– 18 – IEC 62969-1:2017 © IEC 2017

SOMMAIRE
AVANT-PROPOS . 19
INTRODUCTION . 21
1 Domaine d’application . 22
2 Références normatives . 22
3 Termes et définitions . 23
4 Système général . 24
4.1 Blocs du système général . 24
4.2 Classification . 25
4.2.1 Capteurs des véhicules automobiles . 25
4.2.2 Sources d’alimentation . 26
4.3 Interface de données . 27
4.3.2 Réinitialisation . 27
4.3.3 Surveillance . 27
5 Conditions environnementales et exigences . 27
5.1 Généralités . 27
5.2 Conditions d’essai et éléments . 27
5.2.1 Généralités . 27
5.2.2 Plage de températures. 29
5.2.3 Humidité . 29
5.2.4 Chaleur humide . 29
5.2.5 Cycles de température . 30
5.2.6 Impacts et vibrations mécaniques . 30
5.2.7 CEM . 30
5.2.8 Indices IP . 30
5.3 Montage d’essai . 30
6 Interfaces d’alimentation et vérification des éléments . 31
6.1 Niveau de tension d’entrée . 31
6.2 Sources d’erreur principales . 32
6.2.1 Bruit CA . 32
6.2.2 Chute de tension . 32
6.3 Redondance de l’interface d’alimentation . 32
Annexe A (informative) Description générale de l’interface d’alimentation destinée aux
capteurs de véhicules automobiles . 33
Bibliographie . 34

Figure 1 – Chaîne d’alimentation électrique destinée aux capteurs de véhicule . 25
Figure 2 – Exemple de conditions d’essai et d’éléments . 28
Figure 3 – Montage d’essai pour la vérification du niveau de l’alimentation appliquée
aux capteurs . 31
Figure 4 – Vérification du niveau de la tension d’entrée destinée aux capteurs
(capteurs 12 V) . 32
Figure A.1 – Système à base de capteurs des véhicules automobiles . 33

Tableau 1 – Capteurs pour véhicules automobiles . 26
Tableau 2 – Sources d’alimentation destinées aux capteurs des véhicules automobiles . 27

COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
____________
DISPOSITIFS À SEMICONDUCTEURS –
INTERFACE À SEMICONDUCTEURS POUR LES VÉHICULES
AUTOMOBILES –
Partie 1: Exigences générales de l’interface d’alimentation destinée
aux capteurs de véhicules automobiles

AVANT-PROPOS
1) La Commission Electrotechnique Internationale (IEC) est une organisation mondiale de normalisation
composée de l’ensemble des comités électrotechniques nationaux (Comités nationaux de l’IEC). L’IEC a pour
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travaux desquels tout Comité national intéressé par le sujet traité peut participer. Les organisations
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travaux. L’IEC collabore étroitement avec l’Organisation Internationale de Normalisation (ISO), selon des
conditions fixées par accord entre les deux organisations.
2) Les décisions ou accords officiels de l’IEC concernant les questions techniques représentent, dans la mesure
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7) Aucune responsab
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