IEC 62572-3:2014

IEC 62572-3 ®
Edition 2.0 2014-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fibre optic active components and devices – Reliability standards –
Part 3: Laser modules used for telecommunication

Composants et dispositifs actifs en fibres optiques – Normes de fiabilité –
Partie 3: Modules laser utilisés pour les télécommunications

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IEC 62572-3 ®
Edition 2.0 2014-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fibre optic active components and devices – Reliability standards –

Part 3: Laser modules used for telecommunication

Composants et dispositifs actifs en fibres optiques – Normes de fiabilité –

Partie 3: Modules laser utilisés pour les télécommunications

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX R
ICS 31.260, 33.180 ISBN 978-2-8322-1635-4

– 2 – IEC 62572-3:2014 © IEC 2014
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms, definitions, symbols and abbreviations . 7
3.1 Terms and definitions. 7
3.2 Symbols and abbreviations . 8
4 Laser reliability and quality assurance procedure . 8
4.1 Demonstration of product quality . 8
4.2 Testing responsibilities . 9
4.2.1 General . 9
4.2.2 Recommendation applicable to laser customer/system supplier . 9
4.2.3 Recommendation applicable to system operator . 9
4.3 Quality improvement programmes (QIPs) . 9
5 Tests . 9
5.1 General . 9
5.2 Structural similarity . 10
5.3 Burn-in and screening (when applicable in the specification) . 10
6 Activities . 13
6.1 Analysis of reliability results . 13
6.2 Technical visits to LMMs . 14
6.3 Design/process changes . 14
6.4 Deliveries. 14
6.5 Supplier documentation . 14
Annex A (informative) Guidance on testing in Table 1 and Table 2 . 15
A.1 Laser module life tests containing thermoelectric coolers (for example,

Peltier, test 1.1, Table 1) . 15
A.2 Laser module life tests – Uncooled modules (test 1.2, Table 1) . 15
A.3 Laser diode life tests on submounts (test 1.3, Table 1) . 16
A.4 Monitor photodiode life tests (test 1.4, Table 1) . 16
A.5 Temperature cycling and thermal shock (test 3, Table 1 and Test 2, Table 2) . 17
A.6 Sealing/hermeticity (test 4, Table 1 and test 3, Table 2) . 17
A.7 Shock and vibration (test 5, Table 1 and test 4, Table 2) . 17
A.8 High-temperature storage (test 6, Table 1 and test 5, Table 2) . 17
A.9 Electrostatic discharge sensitivity (ESD) (test 7, Table 1 and test 6, Table 2) . 18
A.10 Residual gas analysis (RGA) (test 8, Table 1 and test 7, Table 2) . 18

Table 1 – Initial qualification (1 of 3) . 10
Table 2 – Maintenance of qualification (1 of 2) . 12
Table 3 – Performance for laser module reliability parameters . 14
Table A.1 – Recommended life test conditions for laser modules containing Peltier
coolers . 15
Table A.2 – Recommended life test conditions for uncooled laser modules . 16
Table A.3 – Recommended laser diode life test conditions . 16
Table A.4 – Recommended photodiode life test conditions . 17

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
RELIABILITY STANDARDS –
Part 3: Laser modules used for telecommunication

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62572-3 has been prepared by subcommittee 86C: Fibre optic
systems and active devices of IEC technical committee 86: Fibre optics.
This second edition cancels and replaces the first edition published in 2011. This second
edition constitutes a technical revision in which multiple errors in references have been
corrected.
– 4 – IEC 62572-3:2014 © IEC 2014
The text of this standard is based on the following documents:
FDIS Report on voting
86C/1234/FDIS 86C/1259/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62572 series, published under the general title Fibre optic active
components and devices – Reliability standards, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
INTRODUCTION
The laser modules covered by this International Standard are purchased by system suppliers
(SS) to be inserted in equipment, which in turn are supplied/sold to a system operator (SO) or
a network operator (see definitions in Clause 3).
For the system operator to act as an informed buyer, he/she should have knowledge of the
potential risks posed by the use of critical components.
Optoelectronic component technology is continuing to develop. Consequently, during product
development phases, many failure mechanisms in laser modules have been identified. These
failure mechanisms, if undetected, could result in very short laser lifetime in system use.

– 6 – IEC 62572-3:2014 © IEC 2014
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
RELIABILITY STANDARDS –
Part 3: Laser modules used for telecommunication

1 Scope
This part of IEC 62572 deals with reliability assessment of laser modules used for
telecommunication.
The aim of this standard is
– to establish a standard method of assessing the reliability of laser modules in order to
minimize risks and to promote product development and reliability;
– to establish means by which the distribution of failures with time can be determined. This
should enable the determination of equipment failure rates for specified end of life criteria.
In addition, guidance is given in IEC TR 62572-2.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60747-1, Semiconductor devices – Part 1: General
IEC 60749-6, Semiconductor devices – Mechanical and climatic test methods – Part 6:
Storage at high temperature
IEC 60749-8, Semiconductor devices – Mechanical and climatic test methods – Part 8:
Sealing
IEC 60749-10, Semiconductor devices – Mechanical and climatic test methods – Part 10:
Mechanical shock
IEC 60749-11, Semiconductor devices – Mechanical and climatic test methods – Part 11:
Rapid change of temperature – Two-fluid-bath method
IEC 60749-12, Semiconductor devices – Mechanical and climatic test methods – Part 12:
Vibration, variable frequency
IEC 60749-25, Semiconductor devices – Mechanical and climatic test methods – Part 25:
Temperature cycling
IEC 60749-26, Semiconductor devices – Mechanical and climatic test methods – Part 26:
Electrostatic discharge (ESD) sensitivity testing – Human body model (HBM)

IEC TR 62572-2, Fibre optic active components and devices – Reliability standards – Part 2:
Laser module degradation
MIL-STD-883, Test method standard – Microcircuits
3 Terms, definitions, symbols and abbreviations
3.1 Terms and definitions
For the purposes of this document the following definitions apply.
3.1.1
laser module
packaged assembly containing a laser diode with/without photodiode
Note 1 to entry: The module may also include a cooler and temperature sensor to enable laser temperature to be
controlled and monitored. The optical output is normally via an optical fibre pigtail.
3.1.2
submount
substrate upon which a laser diode or photodiode may be mounted for assembly into the laser
module
Note 1 to entry: Components on submounts are also subject to qualification testing.
3.1.3
laser module manufacturer
LMM
manufacturer of laser modules who provides devices meeting the requirements of the relevant
detail specification (DS) and the customer’s reliability requirements
3.1.4
network operator
NO
organization which operates a telecommunications network
3.1.5
system supplier
SS
manufacturer of telecommunications/data transmission equipment containing optoelectronic
semiconductor lasers, i.e. laser module customer
3.1.6
system operator
SO
network operator of telecommunications/data transmission equipment containing opto-
electronic semiconductor lasers in the transmission path
Note 1 to entry: The system may also be part of other more extensive systems, for example telecommunications,
rail, road vehicles, aerospace or weapons.
3.1.7
capability qualifying components
CQC
components selected to represent critical stages of the process and limiting or boundary
characteristics of mechanical and electro-optic design
Note 1 to entry: Such components should aid the identification of end product failure mechanisms to enable the
determination of activation energies.

– 8 – IEC 62572-3:2014 © IEC 2014
3.2 Symbols and abbreviations
T minimum storage temperature
A
T maximum storage temperature
B
T module case temperature
c
T submount temperature
s
T recommended submount temperature
s nom
T module minimum operating temperature
op min
T module maximum operating temperature
op max
T module minimum storage temperature
stg min
T module maximum storage temperature

stg max
Qc test for gross leak detection
Qk  test for fine leak detection
p periodicity (in months)
n sample size
CA capability approval
CQC capability qualifying components
DS detail specification
LMM laser module manufacturer
ML median life
NO network operator
QA quality approval
QIP quality improvement programmes
RGA residual gas analysis
SO system operator
SS system suppliers
4 Laser reliability and quality assurance procedure
4.1 Demonstration of product quality
This standard (where required by the specification) gives the minimum mandatory
requirements and is part of a total laser reliability and quality assurance procedure adopted
by the laser module manufacturer.
It also provides guidance on the activities of system suppliers and system operators and
provides feedback on field performance to laser module manufacturers and system suppliers.
The laser module manufacturer shall be capable of demonstrating, by means of qualification
approval of devices, technology approval or capability approval of the manufacturing process.
a) a documented and audited manufacturing process including the qualification of purchased
components in accordance with an internationally recognized quality management system;
b) a performance qualification programme, including for example, accelerated life testing,
burn-in and screening of components and modules;
c) a qualification maintenance programme to ensure continuity of reliability performance;
d) a procedure to provide feedback on reliability issues to development and production.

4.2 Testing responsibilities
4.2.1 General
The testing detailed in Tables 1 and 2 is to be performed by the laser module manufacturer
and component suppliers (where applicable). Additional testing may be specified in the
specification.
4.2.2 Recommendation applicable to laser customer/system supplier
The system supplier is recommended to have a programme to analyse and verify the results
including failure analysis. This programme includes an independent life test of fully packaged
laser modules (see Table 2, test 1 and/or test 2 and 3 and/or test 5 (sample size >10 per
test)).
4.2.3 Recommendation applicable to system operator
The system operator is recommended to have a programme to monitor and report field failure
rates in sufficient detail to enable the system supplier and laser module manufacturer to
initiate any necessary corrective actions at an early stage in the lifetime of a product.
Suppliers may have different approaches (i.e. to reliability concepts) during the development
of product maturity and resource limitations may dictate testing strategies.
Alternative tests and activities to those specified are permitted, provided the LMM/SS/SO can
show intent to remove end-product failures and the associated failure mechanisms. However,
this will require significant data to substantiate compliance.
4.3 Quality improvement programmes (QIPs)
Quality improvement programmes (QIPs) shall be initiated with component suppliers and
customers (SOs, SSs and LMMs) to address non-compliances (including quality and reliability
problems identified during subsequent service life of the laser). The correction of non-
compliances and subsequent QIPs are a required strategy to minimize reliability risks. The
operation of QIPs should be stated in the quality approval (QA) generic and capability
approval documents.
5 Tests
5.1 General
The tests described in Tables 1 and 2 are designed to accelerate the main failure
mechanisms known to be reliability hazards in laser modules (see IEC TR 62572-2). Where
appropriate, the CQC shall demonstrate an ability to reduce end product failure mechanisms.
Final product validation is required to demonstrate that CQCs are operating at the boundaries
of the process or technology. These tests will reduce the risk of unreliable components
entering system use and will enable estimates to be made of the distribution of laser lifetimes
and hence the laser failure rates.
The sample size and level of testing may vary depending on the business volume between the
laser customer/system supplier (SS) and laser module manufacturer (LMM). This information
will be given in the capability approval (CA) document and the specification where appropriate.
It is essential that the lasers evaluated are entirely representative of standard production
devices and have passed all the production and/or specified (where applicable in the
specification) burn-in and screening procedures.

– 10 – IEC 62572-3:2014 © IEC 2014
Table 1 – Initial qualification
These tests will normally be performed by the laser manufacturer as part of an initial
qualification programme.
Table 2 – Maintenance of qualification
These tests cover periodic monitoring performed on production devices to ensure that the
quality and reliability performance established during initial qualification is maintained or
improved.
5.2 Structural similarity
Where a range of laser modules is produced by a laser manufacturer, there may be some
significant structural similarity between different type codes. A combination of results from
different test programmes, where appropriate, is therefore permitted.
Consideration should be given to the fact that minor differences in technology or processing
can have a major impact on reliability, whilst not being apparent during quality assessment.
Evidence shall be presented which demonstrates that all results are directly relevant.
5.3 Burn-in and screening (when applicable in the specification)
NOTE See IEC TR 62572-2.
The screening test should be designed by the laser module manufacturer specifically for his
particular technology. Any approach based on similarity to that which is performed by other
manufacturers is good for comparison purposes, but can be ineffective in achieving the actual
screening goal. This is particularly true for fibre optic components whose technology is not yet
mature and varies significantly from supplier to supplier.
Where a manufacturer can demonstrate component and process stability, screening pro-
cedures may be revised.
Table 1 – Initial qualification (1 of 3)
Test
Test IEC references Conditions n
no.
1 Initial endurance test
1.1 a) Module with 25
Φ specified, constant power
e
thermoelectric cooler
Temperature: T = T
c op max
T = T
s s nom
a
Duration: 5 000 h
1.2 b) Module without 25
Φ specified, constant power
e
thermoelectric cooler
Temperature: T = T
c op max
a
Duration: 5 000 h
1.3 Laser diode (submount) Temperature: at least two
test temperatures:
Φ specified, constant power
e
d
T = T See
max
s1 s
d
T =
s2 s1
Duration: >5 000 h
Table 1 (2 of 3)
Test
Test IEC references Conditions n
no.
1.4 Photodiode Temperature: at least two
(in representative test temperatures:
package)
V or l specified
r r
b d
T = 125 °C min See
s1
d
T = <(T –30 °C) See
s2 s1
Duration: >1 000 h
1.5 High temperature storage T = T of the cooler 25
stg max
of the thermoelectric
Duration: 1 000 h
cooler
1.6 Power cycle tests cooled Number of cycles: 20 K 25
devices
T = T
c op max
T = T to (T – ∆T )
s c c max
T = T of the sensor
1.7 High-temperature storage 25
stg max
of the thermal sensor
2 Fibre test
d
2.1 Fibre proof test Proof test see 10
d
Duration see
d
Min. bend radius see
2.2 Fibre retention
d
2.2.1 Fibre pull Fibre pull see 10
d
2.2.2 Side pull Side pull see
c d
3 Change of temperature See and
3.1 Rapid change of 60749-11 Temperature:    10
temperature
T = T
A stg min
T = T
B stg max
Number of cycles = 50
3.2 Temperature cycling 60749-25 Temperature: 10
60068-2-14 T = T
A stg min
T = T
B stg max
>1 °C/min
Number of cycles = 500
d
4 Sealing 60749-8 See  10
Test Qk followed by Test Qc
c d
See and and Clause A.6
5 Shock and vibration See Clause A.7
5.1 Shock 60749-10 500 G, 0,5 ms with/without    10
thermoelectric cooler,
1 500 G, 0,5 ms without thermoelectric
(where appropriate)
6-directions, 5 times each
5.2 Vibration 60749-12 20 – 2 000 Hz, 20 G, 10
3-directions, 30 min each
– 12 – IEC 62572-3:2014 © IEC 2014
Table 1 (3 of 3)
Test
Test IEC references Conditions n
no.
6 High temperature storage 60749-6 Temperature: T = T 10

stg max
(not applicable if module
Duration: >2 000 h
life test performed at
equivalent case
(See, IEC TR 62572-2)
temperature and
submount temperature)
7 ESDS, modules   60749-26 Human body model, see Clause A.9 5 per wafer
a) Lasers 5 discharges/test voltage, charge-
discharge cycle > 0,1 s
b) Photodiodes
d
8 Residual gas analysis MIL-STD-883, See 6
Method 1018
See Clause A.10
9 Low-temperature storage 60068-2-1 T = T 10
stg min
Duration: >1 000 h
a
Provided data about the distribution of wear-out lifetime is accumulated with sufficient accuracy. Provisional
approval for product shipment shall be granted at 2 000 h. It is also recommended to continue the test until
accurate extrapolation of lifetime is possible with an upper limit of 10 000 h. Durations up to 5 000 h may be
needed for accurate lifetime prediction.
b
Or as limited by technology.
c
Results from tests 1.1 and 1.2 shall be supplemented by a laser customer/SS independent test of fully
packaged modules in accordance with Table 2, test 2 and/or test 3 (sample size ≥ 10 per test). See also 4.2.
d
Number of samples and conditions shall be determined by a laser customer/SS and LMM.

Table 2 – Maintenance of qualification (1 of 2)
Test IEC
Test Conditions
n p
no. references
1 Ongoing reliability test Periodic testing: See 6
NOTES
a) Module (cooled) Test 1.1 10

b) Module (uncooled) Test 1.2 10
a
c) Laser diode (submount) Test 1.3 25
a
d) Photodiode Test 1.4 25
2 Temperature cycling 60749-25 Temperature: 10 6
T = T
60068-2-14 A stg min
T = T
B stg max
> 1 °C /min
Periodic testing: number of
cycles = 100 (see NOTE 1 )
3 Sealing 60749-8 See NOTE 2 10
Test Qk followed by Test Qc
See NOTES and Clause A.6
4 Shock and vibration See NOTES and Clause A.7
4.1 Shock 60749-10 500 G, 1 ms with 10
thermoelectric cooler,
1 500 G, 0,5 ms without
thermoelectric cooler,
6-direction, 5 times each
20 – 2 000 Hz, 20 G
4.2 Vibration 60749-12 3-direction, 30 min each 10
Table 2 (2 of 2)
Test IEC
Test Conditions n p
no. references
5 High temperature storage 60749-6 Temperature: 10 12
(not applicable if module
T = T
stg max
life test performed at
equivalent case
Duration: >2 000 h
temperature and submount
temperature)
Periodic testing: see NOTES
(See,IEC TR 62572-2)
6 ESDS, modules  60749-26 Periodic testing: see Clause A.9 5 per
wafer
a) Lasers Human body model
b) Photodiodes 5 discharges/test voltage,
Charge-discharge cycle > 0,1 s
7 Residual gas analysis MIL-STD-883, See NOTE 2 See 6
Method 1018 NOTE
Periodic testing:
see NOTES and Clause A.10
a
Out of different wafers.
NOTE 1 Results of test 2 are supplemented by a laser customer/system supplier (SS) independent test of fully
packaged modules in accordance with Table 2, test 2 and/or test 3 and/or test 5 (sample size ≥ 10 per test). See
also 4.2.
NOTE 2 Number of samples and conditions are determined by a laser customer/SS and LMM.

6 Activities
6.1 Analysis of reliability results
The laser module customer/system supplier (SS) shall have a programme to analyse and
verify a laser manufacturer’s reliability claims. In particular
– life test data for the complete laser module,
– life test data for initial components, for example laser diode and photodiode,
– environmental test result, i.e. inspection requirements group B, C of the detail
specification;
– where appropriate, see Clause 5, the data and test results of appropriate CQCs.
The analysis of results should lead to reporting of the laser module reliability parameters for
each of the laser module types. Minimum reliability parameters are presented as in Table 3.
Where data reveals more than one wear-out mechanism, median life and dispersion in each
case shall be stated.
The failure criteria used to derive these reliability parameters shall be agreed between the
laser customer/system suppliers (SS) and laser module manufacturer (LMM). The criteria will
be stated in the detail specification, see IEC TR 62572-2

– 14 – IEC 62572-3:2014 © IEC 2014
Table 3 – Performance for laser module reliability parameters
Parameter Measured value
Median life (ML) at 25 °C or 55 °C: see NOTE 3 Years
Dispersion(s)
Wear-out failure rate
FITs
at 5 years (λ)
FITs
at 10 years (λ)
at 20 years (λ) FITs
Wear-out activation energy eV
Random failure rate
(λ ) @ 25 °C: see NOTE 2 FITs
a
Confidence limits used: %
Random failure activation energy eV
NOTE 1 This table assumes a log-normal distribution of times to failure. The dispersion parameter is the
standard deviation of the logarithm to the base ‘e’ of the times to failure. See IEC TR 625722-2.
NOTE 2 The reference temperature used for all parameters in this table is 25 °C. An alternative reference
temperature (50 °C) may be used provided activation energies are given.
NOTE 3 Special attention should be paid to all extrapolation models used and the justification for activation
energies employed in reliability predictions is to be stated.
Guidance on these activities is given in IEC TR 62572-2.

6.2 Technical visits to LMMs
Laser module designs continue to evolve, and a LMM may introduce significant changes
which impinge on reliability. Under the negotiation between customer and manufacturer,
technical visits should be performed until there is sufficient evidence of a maturing technology
and production stability. These technical meetings/visits shall contain an item on the agenda
that concerns quality and reliability. Where a LMM holds a capability approval, the frequency
of these technical visits may be reduced provided the manufacturer can demonstrate
a) that the CQCs fully represent any relevant design, process updates and reliability issues,
b) satisfactory self-audit of the quality system.
6.3 Design/process changes
The customer/system supplier (SS) shall be informed by the laser module manufacturer (LMM)
of any design or process change which may affect the form, fit or function of the end product.
6.4 Deliveries
Laser module designs will continue to evolve and therefore each delivered lot shall be
manufactured according to a stated technology and production process.
This should be verified by the supplier/ and customer before delivery.
6.5 Supplier documentation
The laser customer/system supplier (SS) and component manufacturer or LMM shall
incorporate, wherever possible, the tests and activities described in this standard into their in-
house component qualification, or where appropriate, capability approval procedures and
purchasing specifications. This documentation will be used in reliability/technical
presentations, tender submissions and marketing briefs to customers.

Annex A
(informative)
Guidance on testing in Table 1 and Table 2
A.1 Laser module life tests containing thermoelectric coolers (for example,
Peltier, test 1.1, Table 1)
With laser modules containing thermoelectric coolers it is difficult to provide a significant
degree of overstress to all key components simultaneously. During “normal operation”, the
laser submount temperature is usually controlled at T = 25 °C. However, for a life test with a
s
case temperature of T = T , a useful stress can be obtained for the laser diode, fibre
c op max
fixing, photodiode and thermal sensor if the cooler is operated at a relatively high current to
maintain a submount temperature of T = T . The conditions in Table A.1 are
s s nom
recommended.
Some additional testing of the cooler is recommended, for example T = T and

c op max
T = T – 10 °C.
s s
Table A.1 – Recommended life test conditions for laser modules
containing Peltier coolers
Case temperature T
op max
Laser submount temperature T = T
s s nom
Optical power Fibre output set to P at start of life test (using monitor circuit)
max
Laser current To maintain constant monitor output
Monitor current Normal bias
Thermal sensor current Normal bias
Cooler current To maintain constant thermistor resistance (or sensor conditions)
Duration > 5 000 h
A.2 Laser module life tests – Uncooled modules (test 1.2, Table 1)
For modules without thermoelectric coolers (for example Peltier), life tests can be readily
performed over a range of temperatures up to the recommended maximum operating
temperature for the module. During initial qualification, service life tests at two or more
temperatures, for example T = T and T 40 °C to 50 °C, are recommended. Here, the

c op max c
accuracy of lifetime estimation becomes high in proportion to the number of test levels.
An additional life test at low temperature (duration > 2 000 h at T ) may be required for
op min
modules containing epoxies or organic materials.
If only a single life test is to be performed, for example during maintenance of qualification
testing, the conditions in Table A.2 are recommended.

– 16 – IEC 62572-3:2014 © IEC 2014
Table A.2 – Recommended life test conditions for uncooled laser modules
Case temperature T
op max
Optical power Fibre output set to P at start of life test (using monitor circuit)
max
Laser current To maintain constant monitor photocurrent
Monitor photocurrent Normal bias
Duration
> 5 000 h
A.3 Laser diode life tests on submounts (test 1.3, Table 1)
The laser life test shall be performed with the laser operating at constant light output, as it
would be in normal operation, unless otherwise agreed with the ONS. Temperatures in the
range T = 50 °C to 80 °C are often used. The acceleration in the rate of degradation, relative
s
to normal operation, is therefore relatively small. The maximum temperature at which life tests
can be performed under lasing operating conditions is usually in the range T = 70 °C to
s
100 °C. However, constant current/life tests at temperatures up to T = 150 °C can be useful
s
in studying the reliability of contact metallizations. Actual failures do not often occur in well
screened laser diodes tested at temperatures T < 90 °C. In order to estimate the laser life,
s
some extrapolation is required to predict when the threshold or operating current will exceed
the pre-determined failure criterion. To obtain a reasonable increase in operating current, a
life test duration greater than 5 000 h is required.
If a single life test is to be performed, for example during maintenance of qualification testing,
the conditions in Table A.3 are recommended.
Table A.3 – Recommended laser diode life test conditions
Temperature T = 70 °C
s
Optical power Maximum specified
Bias To maintain constant monitor output
Duration
> 5 000 h
A.4 Monitor photodiode life tests (test 1.4, Table 1)
Photodiode life tests are best performed with the devices under reverse bias if the
susceptibility to increased dark current is to be assessed. To obtain failures in a reasonable
timescale, temperatures in the range T = 125 °C to 200 °C are usually required. Devices with
s
organic passivations should be tested at temperatures below the curing temperature of the
passivation.
Increased bias voltage can also be used to accelerate failure, but the dependence of lifetime
on voltage would then need to be determined before a prediction of operating lifetime could
be made.
It is necessary for measurements of photodiode dark currents to include measurement at the
normal operating temperature. Measurements made at only the life test temperature may not
detect increased surface leakage, because bulk dark currents dominate at high temperatures.
Failed photodiodes with increased dark currents (as a result of the accumulation of mobile
charge) will often recover quickly if stored at high temperatures without bias. It is essential,
that at the end of the test duration, the reverse bias conditions shall be maintained until the
temperature is below 30 °C. The post test measurements shall be completed within 3 h. The
increase in dark current of photodiodes with exposed junctions (for example unpassivated

mesa devices) is very sensitive to the package atmosphere, and small traces of oxygen or
water vapour can result in decreased lifetimes. Life tests should therefore be performed with
the photodiodes sealed in representative hermetic packages, and not on open submounts.
Tests in flowing (nominally dry) nitrogen can produce variable results. The conditions in
Table A.4 are recommended.
Table A.4 – Recommended photodiode life test conditions
Temperature In the range T = 125 °C to 200 °C
s
Bias Specified maximum reverse bias voltage.
Bias to be maintained during cool down prior to measurements
Duration 1 000 h
Atmosphere Photodiode in representative hermetic package

A.5 Temperature cycling and thermal shock (test 3, Table 1 and Test 2, Table 2)
It is difficult to quantify the acceleration (with respect to normal operation) obtained from a
temperature cycling test. Nevertheless, it has been clearly demonstrated that temperature
cycling from T = –40 °C to +70 °C can reveal potentially serious hazards in laser modules
c
associated with fibre instability, thermal mismatch between piece parts (for example coolers
and submounts), and with fibre breaks.
For initial qualification, number of cycles = 500 from T to T are required. For
stg min stg max
periodic testing (3 and/or 6 monthly), the number of cycles = 100. The temperature cycling
procedure should follow either:
a) IEC 60068-2-14, Test Na: two-chamber method;
b) IEC 60068-2-14, Test Nb: single-chamber method, rate of change equal to 1, 3, or
5 °C/min.
Well designed and constructed
...