IEC 62047-12:2011

IEC 62047-12 ®
Edition 1.0 2011-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Micro-electromechanical devices –
Part 12: Bending fatigue testing method of thin film materials using resonant
vibration of MEMS structures
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 12: Méthode d'essai de fatigue en flexion des matériaux en couche mince
utilisant les vibrations à la résonance des structures à systèmes
microélectromécaniques (MEMS)
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IEC 62047-12 ®
Edition 1.0 2011-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Micro-electromechanical devices –
Part 12: Bending fatigue testing method of thin film materials using resonant
vibration of MEMS structures
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 12: Méthode d'essai de fatigue en flexion des matériaux en couche mince
utilisant les vibrations à la résonance des structures à systèmes
microélectromécaniques (MEMS)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX U
ICS 31.080.99 ISBN 978-2-88912-689-7

– 2 – 62047-12  IEC:2011
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test equipment . 7
4.1 General . 7
4.2 Actuator . 8
4.3 Sensor . 8
4.4 Controller . 8
4.5 Recorder . 9
4.6 Parallel testing . 9
5 Specimen . 9
5.1 General . 9
5.2 Resonant properties . 9
5.3 Test part. 9
5.4 Specimen fabrication . 9
6 Test conditions . 9
6.1 Test amplitude. 9
6.2 Load ratio . 10
6.3 Vibration frequency . 10
6.4 Waveform . 10
6.5 Test time . 10
6.6 Test environment. 10
7 Initial measurement . 10
7.1 Reference strength measurement . 10
7.2 Frequency response test . 11
8 Test . 11
8.1 General . 11
8.2 Initial load application . 11
8.3 Monitoring . 12
8.4 Counting the number of cycles . 12
8.5 End of the test . 12
8.6 Recorded data . 12
9 Test report. 12
Annex A (informative) Example of testing using an electrostatic device with an
integrated actuation component and displacement detection component . 14
Annex B (informative) Example of testing using an external drive and a device with an
integrated strain gauge for detecting displacement . 17
Annex C (informative) Example of electromagnetic drive out-of-plane vibration test
(external drive vibration test) . 20
Annex D (informative) Theoretical expression on fatigue life of brittle materials based
on Paris’ law and Weibull distribution . 23
Annex E (informative) Analysis examples. 27
Bibliography . 29

62047-12  IEC:2011 – 3 –
Figure 1 – Block diagram of the test method . 7
Figure A.1 – Microscope image of the specimen . 14
Figure A.2 – Block diagram of test equipment . 15
Figure B.1 – The specimens’ structure . 17
Figure B.2 – Block diagram of test equipment . 18
Figure C.1 – Specimen for out-of-plane vibration testing . 20
Figure C.2 – Block diagram of test equipment . 21
Figure E.1 – Example of fatigue test results for silicon materials . 27
Figure E.2 – Static strength and fatigue life of polysilicon plotted in 3D . 28

– 4 – 62047-12  IEC:2011
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 12: Bending fatigue testing method of thin film materials
using resonant vibration of MEMS structures

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