IEC 60191-6-2:2001

IEC 60191-6-2 ®
Edition 1.0 2001-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6-2: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Design guide for 1,50 mm, 1,27 mm
and 1,00 mm pitch ball and column terminal packages

Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-2: Règles générales pour la préparation des dessins d'encombrement
des dispositifs à semiconducteurs pour montage en surface – Guide de
conception pour les boîtiers à broches en forme de billes et de colonnes, avec
des pas de 1,50 mm, 1,27 mm et 1,00 mm

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite ni
utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie et les
microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé Fax: +41 22 919 03 00
CH-1211 Geneva 20 info@iec.ch
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

Useful links:
IEC publications search - www.iec.ch/searchpub Electropedia - www.electropedia.org
The advanced search enables you to find IEC publications The world's leading online dictionary of electronic and
by a variety of criteria (reference number, text, technical electrical terms containing more than 30 000 terms and
committee,…). definitions in English and French, with equivalent terms in
It also gives information on projects, replaced and additional languages. Also known as the International
withdrawn publications. Electrotechnical Vocabulary (IEV) on-line.

IEC Just Published - webstore.iec.ch/justpublished Customer Service Centre - webstore.iec.ch/csc
Stay up to date on all new IEC publications. Just Published If you wish to give us your feedback on this publication
details all new publications released. Available on-line and or need further assistance, please contact the
also once a month by email. Customer Service Centre: csc@iec.ch.

A propos de la CEI
La Commission Electrotechnique Internationale (CEI) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications CEI
Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possédez
l’édition la plus récente, un corrigendum ou amendement peut avoir été publié.

Liens utiles:
Recherche de publications CEI - www.iec.ch/searchpub Electropedia - www.electropedia.org
La recherche avancée vous permet de trouver des Le premier dictionnaire en ligne au monde de termes
publications CEI en utilisant différents critères (numéro de électroniques et électriques. Il contient plus de 30 000
référence, texte, comité d’études,…). termes et définitions en anglais et en français, ainsi que
Elle donne aussi des informations sur les projets et les les termes équivalents dans les langues additionnelles.
publications remplacées ou retirées. Egalement appelé Vocabulaire Electrotechnique
International (VEI) en ligne.
Just Published CEI - webstore.iec.ch/justpublished
Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications de la CEI.
Just Published détaille les nouvelles publications parues. Si vous désirez nous donner des commentaires sur
Disponible en ligne et aussi une fois par mois par email. cette publication ou si vous avez des questions
contactez-nous: csc@iec.ch.
IEC 60191-6-2 ®
Edition 1.0 2001-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –

Part 6-2: General rules for the preparation of outline drawings of surface

mounted semiconductor device packages – Design guide for 1,50 mm, 1,27 mm

and 1,00 mm pitch ball and column terminal packages

Normalisation mécanique des dispositifs à semiconducteurs –

Partie 6-2: Règles générales pour la préparation des dessins d'encombrement

des dispositifs à semiconducteurs pour montage en surface – Guide de

conception pour les boîtiers à broches en forme de billes et de colonnes, avec

des pas de 1,50 mm, 1,27 mm et 1,00 mm

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX K
ICS 31.080.01 ISBN 978-2-83220-532-7

– 2 – 60191-6-2  IEC:2001
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-2: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball
and column terminal packages
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-2 has been prepared by subcommittee SC 47D: Mechanical
standardization of semiconductor devices, of IEC technical committee 47: Semiconductor devices.
This bilingual version (2012-12) corresponds to the monolingual English version, published in
2001-12.
The text of this standard is based on the following documents:
FDIS Report on voting
47D/460/FDIS 47D/471/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
The committee has decided that the contents of this publication will remain unchanged until
2004. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or

60191-6-2  IEC:2001 – 3 –
• amended.
The contents of the corrigendum of October 2002 have been included in this copy.

– 4 – 60191-6-2  IEC:2001
INTRODUCTION
This design guide is intended to standardize the requirements for all ball and column terminal
packages in order to establish common rules for terminal shapes, irrespective of device and
package types.
60191-6-2  IEC:2001 – 5 –
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-2: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball
and column terminal packages
1 Scope
This part of IEC 60191 covers the requirements for the preparation of drawings of integrated
circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA),
plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column
terminal packages, e.g. ceramic column grid array (C-CGA).
2 Normative references
The following normative documents contain provisions, which, through reference in this text,
constitute provisions of this part of IEC 60191. For dated references, subsequent amend-
ments to, or revisions of, any of these publications do not apply. However, parties to
agreements based on this part of IEC 60191 are encouraged to investigate the possibility of
applying the most recent editions of the normative documents indicated below. For undated
references, the latest edition of the normative document referred to applies. Members of IEC
and ISO maintain registers of currently valid International Standards.
IEC 60191 (all parts), Mechanical standardization of semiconductor devices
3 Definitions
For the purpose of this part of IEC 60191, the following definitions apply.
3.1
ball terminal packages
packages that have solder balls attached to a ceramic/laminate/tape substrate for mounting
on a PCB surface, e.g. C-BGA, P-BGA and T-BGA
3.2
column terminal packages
packages that have solder columns attached to a ceramic/laminate/tape substrate for
mounting on a PCB surface, e.g. C-CGA

– 6 – 60191-6-2  IEC:2001
4 Ball terminal packages, 1,50 mm, 1,27 mm and 1,00 mm pitch
Reference characters and drawings
v S
D
A
B
Terminal
index area
v S
S S
S
y S
e
bp
∅
X1 S A B
SD
X2 S
1 2 3
IEC  2699/01
A
A2
A B C
A3
SE
E
A1
e
60191-6-2  IEC:2001 – 7 –
4.1 Outline dimensions
The ball terminal dimensions are shown in the tables below.
4.2 Package height
The package height (A) is the thickness of the package body, including the lid and ball
heights. For all BGA packages, the package body thickness (A2) is considered to be design
specific.
4.3 Ball terminal diameter
Table 1 – Solder terminal
Ball diameter
nominal
b
Terminal
p
pitch
C-BGA P-BGA T-BGA
e
a b
LMP HMP LMP HMP
LMP HMP
1,00 0,60 0,70 0,60 – 0,60 0,63
1,27 0,75 0,89 0,75 – 0,75 0,63
1,50 0,75 0,89 0,75 – 0,75 0,63
a
LMP = Low melting point.
b
HMP = High melting point.
4.4 Tolerance of ball centre position
Table 2 – Tolerance of ball centre position

Tolerance of solder ball centre position Coplanarity
Terminal pitch
y
e X1 X2
a b
LMP HMP
1,00 0,25 0,10 0,15 0,15
1,27 0,30 0,15 0,20 0,15
1,50 0,30 0,15 0,20 0,15
a
LMP = Low melting point.
b
HMP = High melting point.
4.5 Package body thickness and stand-off heights
The relationship between the package body thickness and stand-off heights for each package
is shown in the table below.
– 8 – 60191-6-2  IEC:2001
Table 3 – Package body thickness and stand-off heights
Stand-off height
Package body
Terminal pitch
thickness A1 nominal
Package type
e
A2 nominal
a b
LMP HMP
0,50 0,70 1,00
C-BGA Design specific 0,60 0,90 1,27
0,60 0,90 1,50
0,50 – 1,00
P-BGA Design specific 0,60 – 1,27
0,60 – 1,50
0,50 0,55 1,00
T-BGA Design specific 0,60 0,55 1,27
0,60 0,55 1,50
a
LMP = Low melting point.
b
HMP = High melting point.
4.6 Tolerance of terminal centre position and coplanarity
Table 4 – Tolerance of terminal centre position and coplanarity
Tolerance of solder ball
Terminal Coplanarity
Centre position
pitch
Package type
y
X1 X2
e
a b
LMP HMP
C-BGA, P-BGA, T-BGA 1,00 0,25 0,10 0,15 0,15
C-BGA, P-BGA, T-BGA 1,27 0,30 0,15 0,20 0,15
C-BGA, P-BGA, T-BGA 1,50 0,30 0,15 0,20 0,15
a
LMP = Low melting point.
b
HMP = High melting point.
4.7 Explanatory notes
4.7.1 Objective of establishment
This part of IEC 60191 is intended to standardize the requirements of all types of ball terminal
packages and to establish common rules, regardless of package type.
4.7.2 Conventional design rules for ball terminal packages
Dimensions for the packages with solder ball are listed in
...