Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

General Information

Status
Published
Publication Date
17-Oct-2002
Current Stage
PPUB - Publication issued
Start Date
30-Nov-2002
Completion Date
18-Oct-2002
Ref Project

Relations

Buy Standard

Standard
IEC 60191-6-2:2001/COR1:2002 - Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages Released:10/18/2002
English language
10 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (Sample)


CEI 60191-6-2 IEC 60191-6-2
(Première édition – 2001) (First edition – 2001)
Normalisation mécanique des dispositifs
Mechanical standardization of
à semiconducteurs –
semiconductor devices –
Partie 6-2: Règles générales pour la préparation des
dessins d'encombrement des dispositifs à
Part 6-2: General rules for the preparation
semiconducteurs pour montage en surface – Guide
of outline drawings of surface mounted
de conception pour les boîtiers à broches en forme
semiconductor device packages – Design
de billes et de colonnes, avec des pas de 1,50 mm,
guide for 1,50 mm, 1,27 mm and 1,00 mm
1,27 mm et 1,00 mm
pitch ball and column terminal packages
Publication monolingue (anglais)
CORRIGENDUM 1
Pages 5 and 8
Clause 4 and clause 5
Reference characters and drawings
R
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.