IEC 60191-6-2:2001/COR1:2002
(Corrigendum)Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
General Information
- Status
- Published
- Publication Date
- 17-Oct-2002
- Technical Committee
- SC 47D - Semiconductor devices packaging
- Drafting Committee
- WG 2 - TC 47/SC 47D/WG 2
- Current Stage
- PPUB - Publication issued
- Start Date
- 18-Oct-2002
- Completion Date
- 30-Nov-2002
Relations
- Effective Date
- 05-Sep-2023
IEC 60191-6-2:2001/COR1:2002 - Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages Released:10/18/2002
Frequently Asked Questions
IEC 60191-6-2:2001/COR1:2002 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages". This standard covers: Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60191-6-2:2001/COR1:2002 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.
IEC 60191-6-2:2001/COR1:2002 has the following relationships with other standards: It is inter standard links to IEC 60191-6-2:2001. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
IEC 60191-6-2:2001/COR1:2002 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
CEI 60191-6-2 IEC 60191-6-2
(Première édition – 2001) (First edition – 2001)
Normalisation mécanique des dispositifs
Mechanical standardization of
à semiconducteurs –
semiconductor devices –
Partie 6-2: Règles générales pour la préparation des
dessins d'encombrement des dispositifs à
Part 6-2: General rules for the preparation
semiconducteurs pour montage en surface – Guide
of outline drawings of surface mounted
de conception pour les boîtiers à broches en forme
semiconductor device packages – Design
de billes et de colonnes, avec des pas de 1,50 mm,
guide for 1,50 mm, 1,27 mm and 1,00 mm
1,27 mm et 1,00 mm
pitch ball and column terminal packages
Publication monolingue (anglais)
CORRIGENDUM 1
Pages 5 and 8
Clause 4 and clause 5
Reference characters and drawings
R
...
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