IEC 60191-6-2:2001/COR1:2002
(Corrigendum)Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
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Standards Content (Sample)
CEI 60191-6-2 IEC 60191-6-2
(Première édition – 2001) (First edition – 2001)
Normalisation mécanique des dispositifs
Mechanical standardization of
à semiconducteurs –
semiconductor devices –
Partie 6-2: Règles générales pour la préparation des
dessins d'encombrement des dispositifs à
Part 6-2: General rules for the preparation
semiconducteurs pour montage en surface – Guide
of outline drawings of surface mounted
de conception pour les boîtiers à broches en forme
semiconductor device packages – Design
de billes et de colonnes, avec des pas de 1,50 mm,
guide for 1,50 mm, 1,27 mm and 1,00 mm
1,27 mm et 1,00 mm
pitch ball and column terminal packages
Publication monolingue (anglais)
CORRIGENDUM 1
Pages 5 and 8
Clause 4 and clause 5
Reference characters and drawings
R
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