IEC 60191-6:2009

IEC 60191-6 ®
Edition 3.0 2009-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6: General rules for the preparation of outline drawings of surface mounted
semiconductor device packages
Normalisation mécanique des dispositifs à semi-conducteurs –
Partie 6: Règles générales pour la préparation des dessins d'encombrement des
boîtiers pour dispositifs à semi-conducteurs pour montage en surface

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IEC 60191-6 ®
Edition 3.0 2009-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6: General rules for the preparation of outline drawings of surface mounted
semiconductor device packages
Normalisation mécanique des dispositifs à semi-conducteurs –
Partie 6: Règles générales pour la préparation des dessins d'encombrement des
boîtiers pour dispositifs à semi-conducteurs pour montage en surface

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
W
CODE PRIX
ICS 31.080.01 ISBN 978-2-88910-063-7
– 2 – 60191-6 © IEC:2009
CONTENTS
FOREWORD.4
1 Scope.6
2 Normative references .6
3 Terms and definitions .6
4 Design rules .7
5 Dimensions to be specified.8
6 Notes .8
Annex A (informative) Illustration of the rules.12
Annex B (informative) Optional table format.36
Bibliography.38

Figure A.1 – Illustrations of terminal projection zone.13
Figure A.2 – Isometric view of an example of gauge .13
Figure A.3a – Top view .14
Figure A.3b – Side view .14
Figure A.3c – Lead section .14
Figure A.3d – Lead side view.14
Figure A.4 – Pattern of terminal position areas .14
Figure A.5a – Top view .17
Figure A.5b – Side view .17
Figure A.5c – Lead section .17
Figure A.5d – Lead side view.17
Figure A.6 – Pattern of terminal position areas .17
Figure A.7a – Top view .20
Figure A.7b – Side view .20
Figure A.7c – Lead section .20
Figure A.7d – Lead side view.20
Figure A.8 – Pattern of terminal position areas .20
Figure A.9a – Top view .23
Figure A.9b – Side view .23
Figure A.9c – Side view .23
Figure A.9d – Lead shape.23
Figure A.9e – Lead side view.23
Figure A.9f – Lead section .23
Figure A.10 – Pattern of terminal position areas .23
Figure A.11a – Top view .26
Figure A.11b – Side view .26
Figure A.11c – Side view .26
Figure A.11d – Lead section .27
Figure A.11e – Lead shape .27
Figure A.11f – Lead side view.27

60191-6 © IEC:2009 – 3 –
Figure A.12 – Pattern of terminal position areas .27
Figure A.13a – Top View.30
Figure A.13b – Side View.30
Figure A.13c – Bottom view .30
Figure A.14 – Pattern of terminal position areas .30
Figure A.15a – Top view .33
Figure A.15b – Side view .33
Figure A.15c – Bottom view .33
Figure A.16 – Pattern of terminal position areas .33

Table 1 – Dimensions to be specified for Group 1 .9
Table 2 – Dimensions to be specified for Group 2 .10

– 4 – 60191-6 © IEC:2009
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION
OF SEMICONDUCTOR DEVICES –
Part 6: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages

FOREWORD
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