IEC 60191-6:2009

IEC 60191-6 ®
Edition 3.0 2009-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6: General rules for the preparation of outline drawings of surface mounted
semiconductor device packages
Normalisation mécanique des dispositifs à semi-conducteurs –
Partie 6: Règles générales pour la préparation des dessins d'encombrement des
boîtiers pour dispositifs à semi-conducteurs pour montage en surface

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IEC 60191-6 ®
Edition 3.0 2009-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6: General rules for the preparation of outline drawings of surface mounted
semiconductor device packages
Normalisation mécanique des dispositifs à semi-conducteurs –
Partie 6: Règles générales pour la préparation des dessins d'encombrement des
boîtiers pour dispositifs à semi-conducteurs pour montage en surface

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
W
CODE PRIX
ICS 31.080.01 ISBN 978-2-88910-063-7
– 2 – 60191-6 © IEC:2009
CONTENTS
FOREWORD.4
1 Scope.6
2 Normative references .6
3 Terms and definitions .6
4 Design rules .7
5 Dimensions to be specified.8
6 Notes .8
Annex A (informative) Illustration of the rules.12
Annex B (informative) Optional table format.36
Bibliography.38

Figure A.1 – Illustrations of terminal projection zone.13
Figure A.2 – Isometric view of an example of gauge .13
Figure A.3a – Top view .14
Figure A.3b – Side view .14
Figure A.3c – Lead section .14
Figure A.3d – Lead side view.14
Figure A.4 – Pattern of terminal position areas .14
Figure A.5a – Top view .17
Figure A.5b – Side view .17
Figure A.5c – Lead section .17
Figure A.5d – Lead side view.17
Figure A.6 – Pattern of terminal position areas .17
Figure A.7a – Top view .20
Figure A.7b – Side view .20
Figure A.7c – Lead section .20
Figure A.7d – Lead side view.20
Figure A.8 – Pattern of terminal position areas .20
Figure A.9a – Top view .23
Figure A.9b – Side view .23
Figure A.9c – Side view .23
Figure A.9d – Lead shape.23
Figure A.9e – Lead side view.23
Figure A.9f – Lead section .23
Figure A.10 – Pattern of terminal position areas .23
Figure A.11a – Top view .26
Figure A.11b – Side view .26
Figure A.11c – Side view .26
Figure A.11d – Lead section .27
Figure A.11e – Lead shape .27
Figure A.11f – Lead side view.27

60191-6 © IEC:2009 – 3 –
Figure A.12 – Pattern of terminal position areas .27
Figure A.13a – Top View.30
Figure A.13b – Side View.30
Figure A.13c – Bottom view .30
Figure A.14 – Pattern of terminal position areas .30
Figure A.15a – Top view .33
Figure A.15b – Side view .33
Figure A.15c – Bottom view .33
Figure A.16 – Pattern of terminal position areas .33

Table 1 – Dimensions to be specified for Group 1 .9
Table 2 – Dimensions to be specified for Group 2 .10

– 4 – 60191-6 © IEC:2009
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION
OF SEMICONDUCTOR DEVICES –
Part 6: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6 has been prepared by subcommittee 47D: Mechanical
standardization of semiconductor devices, of IEC technical committee 47: Semiconductor
devices.
This third edition of IEC 60191-6 cancels and replaces the second edition, published in 2004
and constitutes a technical revision. This edition includes the following significant changes
with respect to the previous edition:
a) scope is modified to cover all surface-mounted devices discrete semiconductors with lead
count of greater or equal to 8;
b) editorial modifications on several pages; and
c) technical revision to ball grid array package (BGA) especially its geometrical drawing
format. (two types of BGA would unify as one type as a result of revising drawing format.)

60191-6 © IEC:2009 – 5 –
The text of this standard is based on the following documents:
CDV Report on voting
47D/736/CDV 47D/749/RVC
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of IEC 60191 series under the general title Mechanical standardization of
semiconductor devices can be found on the IEC website.
The committee has decided that the contents of this amendment and the base publication will
remain unchanged until the maintenance result date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
– 6 – 60191-6 © IEC:2009
MECHANICAL STANDARDIZATION
OF SEMICONDUCTOR DEVICES –
Part 6: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages

1 Scope
This part of IEC 60191 gives general rules for the preparation of outline drawings of surface-
mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all
surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as
well as integrated circuits classified as form E in Clause 3 of IEC 60191-4.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60191-1:2007, Mechanical standardization of semiconductor devices – Part 1: General rules
for the preparation of outline drawings of discrete devices
IEC 60191-4:2002, Mechanical standardization of semiconductor devices – Part 4: Coding
system and classification into forms of package outlines for semiconductor device packages
ISO 1101:2004 Geometrical Product Specifications (GPS) – Geometrical tolerancing –
Tolerances of form, orientation, location and run-out
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
3.1
seating plane
plane which designates the plane of contact of the package, including any stand-off, with the
surface on which it will be mounted
NOTE This plane is often used as the reference plane.
3.2
reference plane
plane parallel to the seating plane at a distance A3 above seating plane (does not apply to
leadless package)
NOTE 1 The distance A3 is known as the reference plane distance. It determines the terminal projection zone
(see Figure 1).
NOTE 2 This distance is a theoretical dimension which is not related to any feature of the package. Its value is
chosen for each package so the length of terminal projection zone L is a good approximation of the terminal
p
length used for mounting, e.g. the length of the part of the terminal that is soldered to the substrate.

60191-6 © IEC:2009 – 7 –
3.3
terminal position area
maximum area on the seating plane within which the terminal projection zone is located,
taking into account the maximum values of L and b
p p
NOTE 1 The surface of the terminal position area is equal to l × b with, generally
1 3
l = L max. + (HDmax. – HDmin.)/2
p
= L max. + (HEmax. – HEmin.)/2
p
and b = b max. + x
p
NOTE 2 Checking can be carried out by means of an appropriate gauge (see Figure 2)
3.4
pattern of terminal position areas
group of all terminal position areas of a leaded package or folded lead package in the seating
plane
NOTE 1 For a leadless package, it is the projection of its metallized pads or terminals on the seating plane.
NOTE 2 The true positions of the centres of the terminal position areas are located on a grid with a modulus
e / e  or    e / e
D E
NOTE 3 The pattern of terminal position areas does not include tolerances stemming from mounting substrates
(printed board) design and placement machine accuracy.
3.5
coplanarity of terminals
profile tolerance controlling the location of the crowns of the bottom terminals with respect to
the seating plane
NOTE In all the other cases, the requirement for coplanarity of terminals is clarified by a note.
3.6
datum
geometrical established planes for controlling the tolerance zone
NOTE Datum S should be established by seating plane.
4 Design rules
The outline drawing of a surface-mounted semiconductor device package shall comprise in
the given sequence:
– the drawing (strictly speaking);
– the tables of dimensions;
– the notes to the tables and the drawings;
– the codification.
The drawing shall conform with the general rules for drawings laid down in IEC 60191-1,
Clause 4 and Clause 5, as well as with the specific definitions of Clause 3 above.
The following, Clause 5 and Clause 6 give, respectively, the tables of dimensions to be
specified and the notes to be called, where relevant. Supplementary dimensions and notes
may be added when required.
– 8 – 60191-6 © IEC:2009
The codification of package outlines shall be in accordance with IEC 60191-4.
5 Dimensions to be specified
Crosses in the Table 1 and Table 2 indicate where values have to be specified. In the
auxiliary right-hand column, a code indicates for which outline families each dimension is
generally relevant, as follows:
L: leaded packages packages with gull-wing leads for example; QFP, SOP,TSOP
F: folded lead packages packages with J-bent leads for example; QFJ, SOJ
P: leadless packages packages with no leads for example; QFN
B: ball grid array packages packages with ball leads for example; BGA
6 Notes
Notes referred to in the tables and in the drawings appear after Table 2; in the auxiliary right-
hand column, a code indicates for which outline families each note is generally relevant (with
the same code as in Clause 5 above).
For each particular outline package or package family, the applicable notes shall be
numbered sequentially from 1 in the order they are in the tables and then on the drawing.

60191-6 © IEC:2009 – 9 –
Table 1 – Dimensions to be specified for Group 1

Group 1 includes dimensions and numerals associated with
mounting of packages and kinds of packages. The
dimensions and numerals belonging to the group mean
values guaranteed to users and imply that mechanical

compatibility of mounting of packages can be recognized.
Concerned
family
Ref. Min. Nom. Max. Notes
n - x - 2 LFPB
nD - x - 3 LFP
nE - x - 3 LFP
A - - x LFPB
A1 x - x LFB
A2 - x - LF
A3 - - 4 LF
x(∗)
bp x - x 4 LFP
∅bp x [x] x 4 B
∅b x - x 4 B
C x - x LF
D x x x 4 LFPB
E x x x 4 LFPB
e - x(∗) - 4 LFPB
f - - x LF
HD x x x 4 LF
HE x x x 4 LF
h x - x F
k x - x P
k1 x - x P
Lp x - x 4 LFP
t - - x LF
v - - x B
w - - x B
x - - x LFPB
x1 - - x B
y - - x LFPB
y1 - - x B
θ x - x L
– 10 – 60191-6 © IEC:2009
Table 2 – Dimensions to be specified for Group 2

Group 2 includes dimensions that do not belong to Group 1, but
are associated with the fabrication of packages and dimensions
of terminal position areas. The group is to achieve its own
original purpose as an industry standard. The group belongs to
the dimensions and numerals of external shapes of packages
useful for design and manufacture and the dimensions of

terminal position areas that can be referenced to in fabrications
of mounting boards. Therefore, external dimensions of a
package shall have nominal design values specified thereto.
Concerned
family
Ref. Min. Nom. Max. Notes
b1 - x - LF
b2 x - x F
b3 - - [x] 4 LFPB
c1 - x - LF
eD - x - 4 FP
eE - x - 4 FP
L - x - LF
L1 - x - F
L2 - x - F
l1 - - [x] 4 LFP
SD - x - B
SE - x - B
ZD - x - LFPB
ZE - x - LFPB
G1D - x - L
G1E - x - L
h - x - F
60191-6 © IEC:2009 – 11 –
Explanation of the symbols and notes to the tables

Explanation of the symbols
(∗) means true geometrical position
[ ] values given within square brackets are calculated values
means in this drawing that the distance from the seating plane to the
y S
nearest point of each terminal should not exceed y mm
projected tolerance zone (see ISO 1101, Clause 13)
P
NOTES
1 All dimensions are in millimetres.
2 n refers to the total number of terminal positions.
3 nD refers to the number of terminal positions on one side of the package in
the direction of dimension D.
nE refers to the number of terminal positions on one side of the package in the direction
of dimension E.
4 Check of the dimensions and positions of package terminal is validly performed when it
is ensured that these terminal fit with the pattern of terminal position
areas. This can be carried out by means of an appropriate gauge.

– 12 – 60191-6 © IEC:2009
Annex A
(informative)
Illustration of the rules
The above rules are illustrated by examples of application to several package families.
A.1 Structures of the examples
– Gull-wing lead package with two parallel rows of terminals (see Clause A.2);
– gull-wing lead package with two parallel rows of terminals (TSOP Type 2)(see Clause A.3);
– gull-wing lead package with one row of terminals on each of four sides (see Clause A.4);
– J-bend lead package with two parallel rows of terminals (see Clause A.5);
– J-bend lead package with one row of terminals on each of four sides (see Clause A.6);
– leadless package (see Clause A.7);
– ball grid array package (see Clause A.8).

60191-6 © IEC:2009 – 13 –
Reference plane
Side view
P Projected zone
A3
Lp
S
Seating plane
Bottom view
Lp × bp : terminal projection
zone (hatched)
IEC  2240/09
Figure A.1a
Reference plane
Side view
P A3 Projected zone
Lp
S
Seating plane
Lp × bp: terminal projection
Bottom view
zone (hatched)
IEC  2241/09
Figure A.1b
Figure A.1 – Illustrations of terminal projection zone

IEC  2242/09
Figure A.2 – Isometric view of an example of gauge

bp
bp
– 14 – 60191-6 © IEC:2009
A.2 Gull-wing lead package with two parallel rows of terminals (SOP, TSOP
Type 2)
A
n  n-1
n/2-1
n4 n3
n1
n2
1 2 n/2
Terminal 1
B
index area
IEC  2243/09
Figure A.3a – Top view
D
Seating plane
S
e
y S
ZD
bp
x
M P S A-B
IEC  2244/09
Figure A.3b – Side view
G1E
P
θ
bp
L1
b1
Lp
L
IEC  2246/09
IEC  2245/09
Figure A.3c – Lead section Figure A.3d – Lead side view

e
b3
IEC  2247/09
Figure A.4 – Pattern of terminal position areas

Date 2009
c1
l1
c
HEmin
-2Lpmax
HEmax
E
HE
A3
A1
A2
A
60191-6 © IEC:2009 – 15 –
Group 1 includes dimensions and numerals associated with mounting of packages and
kinds of packages. The dimensions and numerals belonging to the group mean values
guaranteed to users and imply that mechanical compatibility of mounting of packages
can be recognized.
Ref. Min. Nom. Max. Notes
n - x - 2
A - - x
A1 x - x
A2 - x -
A3 - x(∗) - 3
bp x - x 3
c x - x
D x x x
E x x x
e - x(∗) - 3
HE x x x 3
Lp x - x 3
x - - x
y - - x
θ x - x 3
Group 2 includes dimensions that do not belong to Group 1, but are associated with the
fabrication of packages and dimensions of terminal position areas. The group is to
achieve its own original purpose as an industry standard. The group belongs to the
dimensions and numerals of external shapes of packages useful for design and
manufacture and the dimensions of terminal position areas that can be referenced to in
fabrications of mounting boards. Therefore, external dimensions of a package shall
have nominal design values specified thereto.

Ref. Min. Nom. Max. Notes
b1 - x -
b3 - - x 3
c1 - x -
L - x -
L1 - x -
l1 - - x 3
( ZD ) - x -
G1E - x -
– 16 – 60191-6 © IEC:2009
Explanation of the symbols
(∗)  means true geometrical position
[ ]   values given within square brackets are calculated values
P means projected tolerance zone (see ISO 1101, Clause 13)

means in this drawing that the distance from the seating plane to the
y S
nearest point of each terminal should not exceed y mm

NOTES
1 All dimensions are in millimetres.
2 n refers to the total number of terminal positions.
3 Check of the dimensions and positions of package terminal is validly performed
when it is ensured that these terminal fit with the pattern of terminal position areas.
This can be carried out by means of an appropriate gauge.

60191-6 © IEC:2009 – 17 –
A.3 Gull-wing lead package with two parallel rows of terminals (TSOP Type 1)

HD
D
n
n-1
A 2 B
Terminal 1
index area
n/2
n/2+1
IEC  2248/09
Figure A.5a – Top view
E
Seating plane
S
y
e S
bp
ZE
M S A-B
x P
IEC  2249/09
Figure A.5b – Side view
G1D
P
θ
bp
b1
L1
Lp
L
IEC  2251/09
IEC  2250/09
Figure A.5c – Lead section Figure A.5d – Lead side view

l1
HDmin-2Lpmax
HDmax
IEC  2252/09
Figure A.6 – Pattern of terminal position areas

Date 2009
c1
c
e b3
A3
A1
A2
A
– 18 – 60191-6 © IEC:2009
Group 1 includes dimensions and numerals associated with the mounting of packages
and kinds of packages. The dimensions and numerals belonging to the group means
values guaranteed to users and imply that mechanical compatibility of mounting of
packages can be recognized.
Ref. Min. Nom. Max. Notes
n - x - 2
A - - x
A1 x - x
A2 - x -
A3 - x(∗) - 3
bp x - x 3
c x - x
D x x x
E x x x
e - x(∗) - 3
HD x x x 3
Lp x - x 3
x - - x
y - - x
θ x x
Group 2 includes dimensions that do not belong to Group 1, but are associated with the
fabrication of packages and dimensions of terminal position areas. The group is to
achieve its own original purpose as an industry standard. The group belongs to the
dimensions and numerals of external shapes of packages useful for design and
manufacture and the dimensions of terminal position areas that can be referenced to in
fabrications of mounting boards. Therefore, external dimensions of a package shall
have nominal design values specified thereto.
Ref. Min. Nom. Max. Notes
b1 - x -
b3 - - x 3
c1 - x -
eD - x - 3
L - x -
l1 - - x 3
( ZE ) - x -
G1D - x -
60191-6 © IEC:2009 – 19 –
Explanation of the symbols
(∗)  means true geometrical position
[ ]   values given within square brackets are calculated values

P means projected tolerance zone (see ISO 1101, Clause 13)

means in this drawing that the distance from the seating plane to the
y S
nearest point of each terminal should not exceed y mm

NOTES
1 All dimensions are in millimetres.
2 n refers to the total number of terminal positions.
3 Check of the dimensions and positions of package terminal is validly performed
when it is ensured that these terminal fit with the pattern of terminal position areas.
This can be carried out by means of an appropriate gauge.

– 20 – 60191-6 © IEC:2009
A.4 Gull-wing lead package with one row of terminals on each of four sides
(QFP)
HD
D
C
A
B
Seating plane
Terminal 1
index area S
n
1 2
e
y
bp
S
x M P S
A-B C
ZD
IEC  2254/09
IEC  2253/09
Figure A.7a – Top view Figure A.7b – Side view
G1D or G1E
bp
P
θ
b1
L1
Lp
IEC  2255/09
L IEC  2256/09
Figure A.7c – Lead section Figure A.7d – Lead side view

HDmin-2Lpmax
HDmax
IEC  2257/09
Figure A.8 – Pattern of terminal position areas

Date 2009
e
b3
c1
c
ZE
E
HE
I1
HEmin-2Lpmax
HEmax
A3
A1
A2
A
60191-6 © IEC:2009 – 21 –
Group 1 includes dimensions and numerals associated with the mounting of packages
and kinds of packages. The dimensions and numerals belonging to the group mean
values guaranteed to users and imply that mechanical compatibility of mounting of
packages can be recognized.
Ref. Min. Nom. Max. Notes
n - x - 2
nD - x - 3
nE - x - 3
A - - x
A1 x - x
A2 - x -
A3 - x(∗) - 4
bp x - x 4
c x - x
D x x x
E x x x
e - x(∗) - 4
f - - x
HD x x x 4
HE x x x 4
Lp x - x 4
x - - x
y - - x
θ x - x
Group 2 includes dimensions that do not belong to Group 1, but are associated with the
fabrication of packages and dimensions of terminal position areas. The group is to
achieve its own original purpose as an industry standard. The group belongs to the
dimensions and numerals of external shapes of packages useful for design and
manufacture and the dimensions of terminal position areas that can be referenced to in
fabrications of mounting boards. Therefore, external dimensions of a package shall
have nominal design values specified thereto.

Ref. Min. Nom. Max. Notes
b1 - x -
b3 - - x 4
c1 - x -
L - x -
L1 - x -
l1 - - x 4
( ZD ) - x -
( ZE ) - x -
G1D - x -
G1E - x -
– 22 – 60191-6 © IEC:2009
Explanation of the symbols
(∗) means true geometrical position
[ ] values given within square brackets are calculated values

P   means projected tolerance zone (see ISO 1101, Clause 13)

means in this drawing that the distance from the seating plane
y S
to the nearest point of each terminal should not exceed y mm

NOTES
1 All dimensions are in millimetres.
2 n refers to the total number of terminal positions.
3 n refers to the number of terminal positions on one side of the package in the direction
D
of dimension D.
n refers to the number of terminal positions on one side of the package in the direction
E
of dimension E.
4 Check of the dimensions and positions of package terminal is validly performed when it is
ensured that these terminal fit with the pattern of terminal position areas.
This can be carried out by means of an appropriate gauge.

60191-6 © IEC:2009 – 23 –
A.5 J-bend lead package with two parallel rows of terminals (SOJ)

A1
D
A2
A
n/2+1
n
Terminal 1
index area
n/2
L
B
IEC  2258/09 A
IEC  2259/09
Figure A.9a – Top view Figure A.9b – Side view

Seating plane
S
e
y
S
ZD x
M S A-B
IEC  2260/09
Figure A.9c – Side view
b2
P
bp
b1
Lp
t
M P S A-B
bp
IEC  2263/09
IEC  2261/09
IEC  2262/09
Figure A.9d – Lead shape Figure A.9e – Lead side view Figure A.9f – Lead
section
e
b3
IEC  2264/09
Figure A.10 – Pattern of terminal position areas

Date 2009
E
L1
L2
l1
HE
A3
eE
eE
c1
c
– 24 – 60191-6 © IEC:2009
Group 1 includes dimensions and numerals associated with the mounting of packages
and kinds of packages. The dimensions and numerals belonging to the group mean
values guaranteed to users and imply that mechanical compatibility of mounting of
packages can be recognized.
Ref. Min. Nom. Max. Notes
n - x - 2
A - - x
A1 x - x
A2 - x -
A3 - - 3
x(∗)
bp x - x 3
b2 x - x
c x - x
D x x x
E x x x
e - - 3
x(∗)
HE x x x
Lp x - x 3
t - - x
x - - x
y - - x
Group 2 includes dimensions that do not belong to Group 1, but are associated with
the fabrication of packages and dimensions of terminal position areas. The group is to
achieve its own original purpose as an industry standard. The group belongs to the
dimensions and numerals of external shapes of packages useful for design and
manufacture and the dimensions of terminal position areas that can be referenced to in
fabrications of mounting boards. Therefore, external dimensions of a package shall
have nominal design values specified thereto.

Ref. Min. Nom. Max. Degrees Notes
b1 - x -
b3 - - x 3
c1 - x -
eE - x - 3
L - x -
L1 - x -
L2 - x -
l1 - - x 3
( ZD ) - x -
60191-6 © IEC:2009 – 25 –
Explanation of the symbols
(∗)  means true geometrical position
[ ]   values given within square brackets are calculated values

P means projected tolerance zone (see ISO 1101, Clause 13)

means in this drawing that the distance from the seating plane to the
y
S
nearest point of each terminal should not exceed y mm

NOTES
1 All dimensions are in millimetres.
2 n refers to the total number of terminal positions.
3 Check of the dimensions and positions of package terminal is validly performed
when it is ensured that these terminal fit with the pattern of terminal position areas.
This can be carried out by means of an appropriate gauge.

– 26 – 60191-6 © IEC:2009
A.6 J-bend lead package with one row of terminals on each of four sides
(QFJ)
L
D
ZD
C
Terminal 1
index area
n
A1
A2
A
HD
IEC  2266/09
IEC  2265/09
Figure A.11a – Top view Figure A.11b – Side view

Seating plane
S
bp
x
M P A-B  C y S
S
eD
IEC  2267/09
Figure A.11c – Side view
Date 2009
E
A
h
B
ZE
HE
e
eE
60191-6 © IEC:2009 – 27 –
b2
P
bp
b1
Lp
bp
t
M P S A-B  C
IEC  2268/09
IEC  2269/09
IEC  2270/09
Figure A.11d – Lead Figure A.11e – Lead shape Figure A.11f – Lead side view
section
e
b3
eD
IEC  2271/09
Figure A.12 – Pattern of terminal position areas

Date 2009
c1
c
L1 L2
l1
eE
A3
– 28 – 60191-6 © IEC:2009
Group 1 includes dimensions and numerals associated with the mounting of packages
and kinds of packages. The dimensions and numerals belonging to the group mean
values guaranteed to users and imply that mechanical compatibility of mounting of
packages can be recognized.
Ref. Min. Nom. Max. Notes
n - x - 2
nD - x - 3
nE - x - 3
A - - x
A1 x - x
A2 - x -
A3 - x(∗) - 4
bp x - x 4
c x - x
D x x x
E x x x
e - x(∗) - 4
HD x x x
HE x x x
Lp x - x 4
t - - x
x - - x
y - - x
Group 2 includes dimensions that do not belong to Group 1, but are associated with
the fabrication of packages and dimensions of terminal position areas. The group is to
achieve its own original purpose as an industry standard. The group belongs to the
dimensions and numerals of external shapes of packages useful for design and
manufacture and the dimensions of terminal position areas that can be referenced to in
fabrications of mounting boards. Therefore, external dimensions of a package shall
have nominal design values specified thereto.
Ref. Min. Nom. Max. Notes
b1 - x -
b2 x - x
b3 - - x 4
c1 - x -
eD - x - 4
eE - x - 4
L - x -
L1 - x -
L2 - x -
l1 - - x 4
h - x -
( ZD ) - x -
( ZE ) - x -
60191-6 © IEC:2009 – 29 –
Explanation of the symbols
(∗)  means true geometrical position
[ ]   values given within square brackets are calculated values
P means projected tolerance zone (see ISO 1101, Clause 13)

means in this drawing that the distance from the seating plane to the
y
S
nearest point of each terminal should not exceed y mm

NOTES
1 The millimetre (inch) dimensions are derived from the original inch (millimetre) dimensions.
2 n refers to the total number of terminal positions.
3 n refers to the number of terminal positions on one side of the package in the direction of
D
dimension D.
n refers to the number of terminal positions on one side of the package in the direction of
E
dimension E.
4 Check of the dimensions and positions of package terminal is validly performed when
it is ensured that these terminal fit with the pattern of terminal position areas.
This can be carried out by means of an appropriate gauge.

– 30 – 60191-6 © IEC:2009
A.7 Leadless package
E
Terminal 1
index area
Seating plane
S
y
S
IEC  2273/09
IEC  2272/09
Figure A.13a – Top View Figure A.13b – Side View

E
ZE
k
C
NOTE 5
k1
Lp
bp
x M S A-B C
IEC  2274/09
Figure A.13c – Bottom view
eE
e
l1
IEC  2275/09
Figure A.14 – Pattern of terminal position areas

Date 2009
D
eD
D
A
A
b3 e
B
e
ZD
60191-6 © IEC:2009 – 31 –
Group 1 includes dimensions and numerals associated with the mounting of packages
and kinds of packages. The dimensions and numerals belonging to the group mean
values guaranteed to users and imply that mechanical compatibility of mounting of
packages can be recognized.
Ref. Min. Nom. Max. Notes
n - x - 2
nD - x - 3
nE - x - 3
A - - x
bp x - x 4
D x x x
E x x x
e - - 4
x(∗)
Lp x - x 4
w - - x
x - - x
y - - x
Group 2 includes dimensions that do not belong to Group 1, but are associated with
the fabrication of packages and dimensions of terminal position areas. The group is to
achieve its own original purpose as an industry standard. The group belongs to the
dimensions and numerals of external shapes of packages useful for design and
manufacture and the dimensions of terminal position areas that can be referenced to in
fabrications of mounting boards. Therefore, external dimensions of a package shall
have nominal design values specified thereto.

Ref. Min. Nom. Max. Notes
b3 - - x 4
eD - x - 4
eE - x - 4
k x - x
k1 x - x
l1 - - x 4
( ZD ) - x -
( ZE ) - x -
– 32 – 60191-6 © IEC:2009
Explanation of the symbols
(∗)  means true geometrical position
[ ] values given within square brackets are calculated values

means in this drawing that the distance from the seating plane
y
S
to the nearest point of each terminal should not exceed y mm

NOTES
1 All dimensions are in millimetres.
2 n refers to the total number of terminal positions.
3  nD refers to the number of terminal positions on one side of the package in the direction
of dimension D.
nE refers to the number of terminal positions on one side of the package in the direction
of dimension E.
4 Check of the dimensions and positions of package terminal is validly performed
when it is ensured that these terminal fit with the pattern of terminal position areas.
This can be carried out by means of an appropriate gauge.
5 Length of terminal pad number 1 shall be visibly greater than the length of the other
terminal pads.
60191-6 © IEC:2009 – 33 –
A.8 Ball grid array package (BGA)
E
B
Terminal A1
index area
IEC  2276/09
Figure A.15a – Top view
y1
S
S
y cz
IEC  2277/09
Figure A.15b – Side view
1 2 3
e
(ZD)
n×∅b A A
X1 M S M M
X2 M S
IEC  2278/09
Figure A.15c – Bottom view
Dmax
e e
∅b3 ∅b4
IEC  2279/09
Figure A.16 – Pattern of terminal position areas

Date 2009
e
A
A1
(A2)
Emax
e
e
(ZE)
D
A
...