IEC 62137-1-5:2009

IEC 62137-1-5 ®
Edition 1.0 2009-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology – Environmental and endurance test methods for
surface mount solder joints –
Part 1-5: Mechanical shear fatigue test

Technologie du montage en surface – Méthodes d'essais d'environnement et
d'endurance des joints brasés montés en surface –
Partie 1-5: Essai de fatigue par cisaillement mécanique

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IEC 62137-1-5 ®
Edition 1.0 2009-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Surface mounting technology – Environmental and endurance test methods for
surface mount solder joints –
Part 1-5: Mechanical shear fatigue test

Technologie du montage en surface – Méthodes d'essais d'environnement et
d'endurance des joints brases montes en surface –
Partie 1-5: Essai de fatigue par cisaillement mécanique

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
S
CODE PRIX
ICS 31.190 ISBN 978-2-88910-628-8
– 2 – 62137-1-5 © IEC:2009
CONTENTS
FOREWORD.3
INTRODUCTION.5
1 Scope.6
2 Normative references .7
3 Terms and definitions .8
4 Test equipment and materials.8
4.1 Test equipment for mechanical shear fatigue testing .8
4.2 Test substrate .8
4.3 Solder alloy .9
4.4 Solder paste.9
4.5 Reflow soldering equipment .9
5 Mounting .9
6 Test conditions .10
6.1 Pre-treatment .10
6.2 Test procedures .10
6.3 Judging criteria.10
7 Items to be included in the test report.11
8 Items to be given in the product specification .11
Annex A (normative) Mechanical shear fatigue test equipment.12
Annex B (normative) Mechanical shear fatigue test procedure .15
Annex C (informative) Evaluation of mechanical properties of a single solder joint by
mechanical shear fatigue test .17
Bibliography.21

Figure 1 – Image drawing on evaluation area of joint strength.6
Figure 2 – Schematic illustrations of thermomechanical and mechanical fatigue for
solder joints .7
Figure 3 – A typical temperature profile taken by reflow soldering equipment.10
Figure A.1 – Sample structures of shear fatigue jig .13
Figure B.1 – Example of set-up for electrical resistance measuring.16
Figure C.1 – Schematic illustration of the single solder joint for mechanical fatigue
testing .18
Figure C.2 – Schematic illustration of fixing jig for soldering of the single solder joint .18
Figure C.3 – Schematic illustration of the shear fatigue jig.19
Figure C.4 – Relationship between reaction forces and the number of cycles during a
fatigue test.20
Figure C.5 – Relationship between the displacement range and fatigue life .20

62137-1-5 © IEC:2009 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE MOUNTING TECHNOLOGY –
ENVIRONMENTAL AND ENDURANCE TEST METHODS
FOR SURFACE MOUNT SOLDER JOINTS –

Part 1-5: Mechanical shear fatigue test

FOREWORD
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International Standard IEC 62137-1-5 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/826/FDIS 91/841/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 62137-1-5 © IEC:2009
A list of all parts of the IEC 62137 series, under the general title Surface mounting
technology – Environmental and endurance test methods for surface mount solder joints, can
be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
62137-1-5 © IEC:2009 – 5 –
INTRODUCTION
The mechanical properties of lead-free solder joints between leads and lands on a printed
wiring board are not the same with tin-lead-containing solder joints, due to their solder
compositions. Thus, it becomes important to test the mechanical properties of solder joints of
...