CLC/SR 47 - Semiconductor devices

2017-04-21: EN 62830-2:2017 is withdrawn (in accordance with BT decision D153/059, IEC 62830 series is listed in Part 2 of the CENELEC list of exemptions from parallel procedures (i.e. the list of IEC documents that are used as such in Europe))

IEC 62830-2:2017 describes procedures and definitions for measuring the thermo power of thin films used in micro-scale thermoelectric energy generators, micro heaters and micro coolers. This part of IEC 62830 specifies the methods of tests and the characteristic parameters of the thermoelectric properties of wire, bulk and thin films which have a thickness of less than 5 mm and energy harvesting devices that have thermoelectric thin films, in order to accurately evaluate their performance and practical uses. This part of IEC 62830 is applicable to energy harvesting devices for consumer, general industries, military and aerospace applications without any limitations of device technology and size.

IEC 60749-26:2013 establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD). The purpose (objective) of this standard is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of component type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels. ESD testing of semiconductor devices is selected from this test method, the machine model (MM) test method (see IEC 60749-27) or other ESD test methods in the IEC 60749 series. The HBM and MM test methods produce similar but not identical results; unless otherwise specified, this test method is the one selected. This edition includes the following significant technical changes with respect to the previous edition: a) descriptions of oscilloscope and current transducers have been refined and updated; b) the HBM circuit schematic and description have been improved; c) the description of stress test equipment qualification and verification has been completely re-written; d) qualification and verification of test fixture boards has been revised; e) a new section on the determination of ringing in the current waveform has been added; f) some alternate pin combinations have been included; g) allowance for non-supply pins to stress to a limited number of supply pin groups (associated non-supply pins) and allowance for non-supply to non-supply (i.e., I/O to I/O) stress to be limited to a finite number of 2 pin pairs (coupled non-supply pin pairs); h) explicit allowance for HBM stress using 2 pin HBM testers for die only shorted supply groups.

This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).

IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include: - editorial change in the scope; - addition of lead-free solder chemical composition specification.

IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows: - to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C; - reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1; - update for lead-free solder; - correct certain errors in the original Edition 1.

note: "corrigendum issued February 2011 (on the three language versions)

Establishes a standard procedure for testing and classifying semiconductor devices according to their susceptibility to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD). The objective is to provide reliable, repeatable HBM ESD test results so that accurate classifications can be performed. This test method is applicable to all semiconductor devices and is classified as destructive.

This part of EN 62047 defines terms for micro-electromechanical devices including the process of production of such devices.

This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including - wafers - singulated bare die - die and wafers with attached connection structures - minimally or partially encapsulated die and wafers This standard defines the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products. It covers the requirements for data, including product identity, product data, die mechanical information, test, quality, assembly and reliability information, handling, shipping and storage information.

This part of EN 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to - singulated bare die, - minimally or partially encapsulated die and wafers. This standard specifies the data formats that may be used for the exchange of data covered by other parts in the EN 62258 series as well as definitions of all parameters used according to the principles and methods of EN 61360-1, EN 61360-2 and EN 61360-4. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between the die manufacturer and the CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, fin accordance with ISO 10303-21 and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. This standard reflects the DDX data format: version 1.2.1.

Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.

Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.

Superseded by CLC/TR 62258-4:2013 * IEC/TR published without FDIS stage

Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.

Supersedes ES 59008-4-2:2000

Covers the I-test and the overvoltage latch-up testing of integrated circuits. The purpose of this test is to establish a method for determining integrated circuit latch-up characteristics and to define latch-up failure criteria. Latch-up characteristics are used in determining product reliability and minimizing No Trouble Found and Electrical Overstress failures due to latch-up.

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Used to determine the susceptibility of semiconductor devices to degradation in the neutron environment. Applicable to integrated circuits and discrete semiconductor devices.

Provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.

Provides a test procedure for defining requirements for testing packaged semiconductor integrated circuits and discrete semiconductor devices for ionizing radiation (total dose) effects from a cobalt-60 gamma ray source. Proposes an accelerated annealing test for estimating low dose rate ionizing radiation effects on devices. This annealing test is important for low dose rate or certain other applications in which devices may exhibit significant time-dependent effects. It is intended for military- and space-related applications.

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

Describes a test to determine the effect of variable frequency vibration, within the specified frequency range, on internal structural elements. This is a destructive test. It is normally applicable to cavity-type packages.

Describes a salt atmosphere test that determines the resistance of semiconductor devices to corrosion. It is an accelerated test that simulates the effects of severe sea-coast atmosphere on all exposed surfaces. It is only applicable to those devices specified for a marine environment. The salt atmosphere test is considered destructive.

Aims at testing and measuring the water vapour and other gas content of the atmosphere inside a metal or ceramic hermetically sealed device. Applicable to semiconductor devices sealed in such a manner but generally only used for high reliability applications such as military or aerospace.

Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive.

Aims at testing and determining the effect on all semiconductor electronic devices of storage at elevated temperature without electrical stress applied. This test is considered non-destructive.

Provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments.

Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.

EN following parallel vote * Superseded by EN 60749 series

D129/C113: BTTF 97-1 disbanded * Superseded by 62258 series

D129/C113: BTTF 97-1 disbanded * Superseded by 62258 series

D129/C113: BTTF 97-1 disbanded * Superseded by 62258 series

D129/C113: BTTF 97-1 disbanded * Superseded by 62258 series

EN 165000 series supersedes EN 163000, CECC 63 000 & 64 000 series * D96/132: CECC/SC 47AX disbanded