CLC/TR 62258-4:2007

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Semiconductor die products - Part 4: Questionnaire for die users and suppliers (IEC/TR
62258-4:2007)
Halbleiter-Chip-Erzeugnisse - Teil 4: Fragebogen für Chip-Anwender und -Lieferanten
(IEC/TR 62258-4:2007)
Produits a puce de semi-conducteur - Partie 4: Questionnaire pour les utilisateurs et les
fournisseurs de puces (IEC/TR 62258-4:2007)
Ta slovenski standard je istoveten z: CLC/TR 62258-4:2007
ICS:
31.080.99 Drugi polprevodniški elementi Other semiconductor devices
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

TECHNICAL REPORT
CLC/TR 62258-4
RAPPORT TECHNIQUE
October 2007
TECHNISCHER BERICHT
ICS 31.080.99
English version
Semiconductor die products -
Part 4: Questionnaire for die users and suppliers
(IEC/TR 62258-4:2007)
Produits à puce de semi-conducteur -  Halbleiter-Chip-Erzeugnisse -
Partie 4: Questionnaire Teil 4: Fragebogen für Chip-Anwender
pour les utilisateurs und -Lieferanten
et les fournisseurs de puces (IEC/TR 62258-4:2007)
(CEI/TR 62258-4:2007)
This Technical Report was approved by CENELEC on 2007-09-01.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Cyprus, the
Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. CLC/TR 62258-4:2007 E

Foreword
The text of document 47/1884/DTR, future edition 1 of IEC/TR 62258-4, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC Parallel Unique Acceptance Procedure and
was approved by CENELEC as CLC/TR 62258-4 on 2007-09-01.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the Technical Report IEC/TR 62258-4:2007 was approved by CENELEC as a Technical Report
without any modification.
__________
- 3 - CLC/TR 62258-4:2007
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.

NOTE  When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD
applies.
Publication Year Title EN/HD Year
IEC 60050 Series International Electrotechnical Vocabulary – –

IEC 62258-1 2005 Semiconductor die products - EN 62258-1 2005
Part 1: Requirements for procurement and
use
IEC 62258-2 2005 Semiconductor die products - EN 62258-2 2005
Part 2: Exchange data formats
IEC/TR 62258-4
Edition 1.0 2007-08
TECHNICAL
REPORT
Semiconductor die products –
Part 4: Questionnaire for die users and suppliers

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
R
ICS 31.080.99 ISBN 2-8318-9281-3

– 2 – TR 62258-4 © IEC:2007(E)
CONTENTS
FOREWORD.3
INTRODUCTION.5

1 Scope.6
2 Normative references.6
3 Terms and definitions .6
4 General .6
5 Data exchange .7

Annex A Customer questionnaire on die devices.8

Table A.1 – Basic data .9
Table A.2 – Bare die and wafers.10
Table A.3 – Die and wafers with connection structures .11
Table A.4 – Minimally-packaged die devices.12
Table A.5 – Quality, reliability and storage .12
Table A.6 – Terminal data .14
Table A.7 – Terminal geometries.15
Table A.8 – Polygon vertices .15
Table A.9 – Fiducial definitions.16
Table A.10 – Fiducial positions.17
Table A.11 – Simulator data .17
Table A.12 – Group defintions .18
Table A.13 – Permutations .19

TR 62258-4 © IEC:2007(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
______________
SEMICONDUCTOR DIE PRODUCTS –
Part 4: Questionnaire for die users and suppliers

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. However, a
technical committee may propose the publication of a technical report when it has collected
data of a different kind from that which is normally published as an International Standard, for
example "state of the art".
IEC 62258-4, which is a technical report, has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this technical report is based on the following documents:
Enquiry draft Report on voting
47/1884/DTR 47/1909/RVC
Full information on the voting for the approval of this technical report can be found in the report
on voting indicated in the above table.

– 4 – TR 62258-4 © IEC:2007(E)
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The list of all the parts of IEC 62258, under the general title Semiconductor die products, can
be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

TR 62258-4 © IEC:2007(E) – 5 –
INTRODUCTION
This technical report is based on the work carried out in the ESPRIT 4th Framework Project
GOODDIE which resulted in the publication of the ES 59008 series of European specifications.
Organizations that helped prepare this document included the ESPRIT ENCAST and ENCASIT
projects, the Die Products Consortium, JEITA, JEDEC and ZVEI.

– 6 – TR 62258-4 © IEC:2007(E)
SEMICONDUCTOR DIE PRODUCTS –
Part 4: Questionnaire for die users and suppliers

1 Scope
This part of IEC 62258 has been developed to facilitate the production, supply and use of
semiconductor die products, including
• wafers;
• singulated bare die;
• die and wafers with attached connection structures;
• minimally or partially encapsulated die and wafers.
This technical report contains a questionnaire, based on the requirements of other parts of IEC
62258, which may be used in negotiations and contracts between suppliers and purchasers of
die devices. It is intended to assist all those involved in the supply chain for die devices to
comply with the requirements of the IEC 62258-1 and IEC 62258-2 standards.
It should be recognized that the tables contained in this technical report form a checklist of
information that can potentially be supplied and that it may not be relevant or possible to
complete all fields. Different markets may require different subsets of the information
requested herein.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60050, International Electrotechnical Vocabulary
IEC 62258-1:2005, Semiconductor die products – Part 1: Requirements for procurement and
use
IEC 62258-2:2005, Semiconductor die products – Part 2: Exchange data formats
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60050 and IEC
62258-2 apply.
4 General
To comply with IEC 62258-1, that standard requires that suppliers of die devices furnish
information which is necessary and sufficient for users of the devices at all stages of design,
procurement, manufacture and test of the products containing them. The questionnaire in
Annex A provides a pro forma that can form a standard basis for supplying such information
and is intended as an aid to compliance with the standard.
Where references are made in this technical report to clauses in IEC 62258-1 and IEC
62258-2, these references are only to the clauses in the 2005 editions. The tables in the

TR 62258-4 © IEC:2007(E) – 7 –
annexes contain requirements for information that is not yet covered by those parts of the
standard but which will be included in future issues. Furthermore, some of the terminology may
not be exactly in accordance with those standards: for example, the term “pad” is replaced by
“terminal” in this technical report.
Whilst it is expected that much of the information supplied will be in the public domain and
available from such sources as manufacturers’ data sheets, neith
...