EN 62258-2:2005

SLOVENSKI SIST EN 62258-2:2006

STANDARD
februar 2006
Polprevodniški izdelki – 2. del: Izmenjava podatkovnih formatov (IEC 62258-
2:2005)
Semiconductor die products – Part 2: Exchange data formats (IEC 62258-2:2005)
ICS 31.080.99; 31.200 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 62258-2
NORME EUROPÉENNE
EUROPÄISCHE NORM June 2005
ICS 31.080.99 Supersedes ES 59008-6-1:1999

English version
Semiconductor die products
Part 2: Exchange data formats
(IEC 62258-2:2005)
Produits de matrice de semi-conducteur Halbleiter-Chip-Erzeugnisse
Partie 2: Formats de données d'échange Teil 2: Datenaustausch-Formate
(CEI 62258-2:2005) (IEC 62258-2:2005)

This European Standard was approved by CENELEC on 2005-06-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Central Secretariat: rue de Stassart 35, B - 1050 Brussels

© 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.

Ref. No. EN 62258-2:2005 E
Foreword
The text of document 47/1809/FDIS, future edition 1 of IEC 62258-2, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 62258-2 on 2005-06-01.
This Part of EN 62258 should be read in conjunction with EN 62258-1.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2006-03-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2008-06-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 62258-2:2005 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 62258-2:2005
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
1)
IEC 62258-1 - Semiconductor die products EN 62258-1 -
Part 1: Requirements for procurement
and use
IEC 61360-1 2002 Standard data element types with EN 61360-1 2002
associated classification scheme for
electric components
Part 1: Definitions - Principles and
methods
IEC 61360-2 2002 Part 2: EXPRESS dictionary schema EN 61360-2 2002

IEC 61360-4 1997 Part 4: IEC reference collection of EN 61360-4 1997
standard data element types, component
classes and terms
ISO 6093 1985 Information processing - Representation - -
of numerical values in character strings
for information interchange
ISO 8601 2004 Data elements and interchange formats - - -
Information interchange - Representation
of dates and times
ISO 10303-21 2002 Industrial automation systems and - -
integration - Product data representation
and exchange
Part 21: Implementation methods: Clear
text encoding of the exchange structure

1)
To be published.
INTERNATIONAL IEC
STANDARD 62258-2
First edition
2005-06
Semiconductor die products –
Part 2:
Exchange data formats
 IEC 2005  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale XB
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue

– 2 – 62258-2  IEC:2005(E)
CONTENTS
FOREWORD.5

INTRODUCTION.7
1 Scope.8
2 Normative references.8
3 Terms and definitions .9
4 Requirements .9
5 Device Data eXchange format (DDX) file goals and usage.9
6 DDX file format and file format rules .10
7 DDX file content.10
7.1 DDX file content rules .10
7.2 DDX DEVICE block syntax.12
7.3 DDX data syntax.13
8 Definitions of DEVICE block parameters .14
8.1 BLOCK_CREATION_DATE Parameter.15
8.2 BLOCK_VERSION Parameter .15
8.3 VERSION Parameter .15
8.4 DEVICE_FORM Parameter .15
8.5 DEVICE_NAME Parameter .15
8.6 DIE_MASK_REVISION Parameter .16
8.7 MANUFACTURER Parameter .16
8.8 DIE_NAME Parameter .16
8.9 DIE_PACKAGED_PART_NAME Parameter.16
8.10 FUNCTION Parameter.16
8.11 DATA_SOURCE Parameter .17
8.12 DATA_VERSION Parameter .17
8.13 GEOMETRIC_UNITS Parameter.17
8.14 GEOMETRIC_VIEW Parameter .17
8.15 SIZE Parameter.18
8.16 THICKNESS Parameter .18
8.17 GEOMETRIC_ORIGIN Parameter .18
8.18 SIZE_TOLERANCE Parameter .20
8.19 THICKNESS_TOLERANCE Parameter.20
8.20 TERMINAL_COUNT Parameter .20
8.21 TERMINAL_TYPE_COUNT Parameter.21
8.22 CONNECTION_COUNT Parameter.21
8.23 TERMINAL_TYPE Parameter.21
8.24 TERMINAL Parameter .23
8.25 IC_TECHNOLOGY Parameter .26
8.26 DIE_SEMICONDUCTOR_MATERIAL Parameter .26
8.27 DIE_SUBSTRATE_MATERIAL Parameter.26
8.28 DIE_SUBSTRATE_CONNECTION Parameter .26
8.29 DIE_PASSIVATION_MATERIAL Parameter .27
8.30 DIE_TERMINAL_MATERIAL Parameter .27
8.31 DIE_BACK_DETAIL Parameter .28

62258-2  IEC:2005(E) – 3 –
8.32 WAFER_SIZE Parameter.28
8.33 MAX_TEMP Parameter.28
8.34 POWER_RANGE Parameter.28
8.35 TEMPERATURE_RANGE Parameter .28
8.36 Simulator MODEL FILE Parameter.29
8.37 Simulator MODEL FILE DATE Parameter.29
8.38 Simulator NAME Parameter .29
8.39 Simulator VERSION Parameter.29
8.40 Simulator COMPLIANCE Parameter.30
8.41 DIE_DELIVERY_FORM Parameter .30
8.42 PACKING_CODE Parameter.30
8.43 BUMP_MATERIAL Parameter .30
8.44 BUMP_HEIGHT Parameter .30
8.45 BUMP_HEIGHT_TOLERANCE Parameter.31
8.46 MPD_PACKAGE_MATERIAL Parameter .31
8.47 MPD_PACKAGE_STYLE Parameter .31
8.48 MPD_DELIVERY_FORM Parameter.31
8.49 MPD_CONNECTION_TYPE Parameter.32
8.50 MPD_CONNECTION_MATERIAL Parameter.32
8.51 FIDUCIAL_TYPE Parameter .32
8.52 FIDUCIAL Parameter.33
8.53 WAFER_DIE_STEP_SIZE Parameter .35
8.54 WAFER_GROSS_DIE_COUNT Parameter.35
8.55 WAFER_INDEX Parameter.35
8.56 WAFER_RETICULE_STEP_SIZE Parameter .35
8.57 WAFER_RETICULE_GROSS_DIE_COUNT Parameter .36
9 DDX EXPRESS model schema .36
9.1 Type definitions .36
9.2 File structure .40
9.3 Device names.40
9.4 Device block.40
9.5 Die size .41
9.6 Bare or bumped die type.42
9.7 Bare die type .42
9.8 Bumped bare die type.42
9.9 Lead-frame die type.
...