EN 62047-1:2006

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EUROPEAN STANDARD EN 62047-1 NORME EUROPÉENNE
EUROPÄISCHE NORM June 2006
CENELEC European Committee for Electrotechnical Standardization Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2006 CENELEC -
All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 62047-1:2006 E
ICS 31.080.99
English version
Semiconductor devices - Micro-electromechanical devices
Part 1: Terms and definitions (IEC 62047-1:2005)
Dispositifs à semiconducteurs - Dispositifs microélectromécaniques
Partie 1: Termes et définitions (CEI 62047-1:2005)
Halbleiterbauelemente - Bauteile der Mikrosystemtechnik
Teil 1: Begriffe und Definitionen
(IEC 62047-1:2005)
This European Standard was approved by CENELEC on 2006-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.

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Foreword The text of the International Standard IEC 62047-1:2005, prepared by IEC TC 47, Semiconductor devices, was submitted to the Unique Acceptance Procedure and was approved by CENELEC as EN 62047-1 on 2006-06-01 without any modification. The following dates were fixed: – latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement
(dop)
2007-06-01 – latest date by which the national standards conflicting
with the EN have to be withdrawn
(dow)
2009-06-01 __________ Endorsement notice The text of the International Standard IEC 62047-1:2005 was approved by CENELEC as a European Standard without any modification. __________

NORME INTERNATIONALECEIIEC INTERNATIONAL STANDARD 62047-1Première éditionFirst edition2005-09 Dispositifs à semiconducteurs – Dispositifs microélectromécaniques – Partie 1: Termes et définitions
Semiconductor devices – Micro-electromechanical devices – Part 1: Terms and definitions
Pour prix, voir catalogue en vigueur For price, see current catalogue IEC 2005
Droits de reproduction réservés
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Copyright - all rights reserved Aucune partie de cette publication ne peut être reproduite ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie et les microfilms, sans l'accord écrit de l'éditeur. No part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission,
3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch
Web: www.iec.ch CODE PRIX PRICE CODE T Commission Electrotechnique InternationaleInternational Electrotechnical Commission

62047-1  IEC:2005 – 3 –
CONTENTS FOREWORD.5
1 Scope.9 2 Terms and definitions.9 2.1 General terms.9 2.2 Terms relating to science and engineering.11 2.3 Terms relating to material science.13 2.4 Terms relating to functional element.15 2.5 Terms relating to machining technology.25 2.6 Terms relating to bonding and assembling technology.37 2.7 Terms relating to evaluation technology.41 2.8 Terms relating to application technology.43
Annex A (informative)
Standpoint and criteria in editing this glossary.49

62047-1  IEC:2005 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION ____________
SEMICONDUCTOR DEVICES – MICRO-ELECTROMECHANICAL DEVICES –
Part 1: Terms and definitions
FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62047-1 has been prepared by IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47/1821/FDIS 47/1840/RVD
Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

62047-1  IEC:2005 – 7 –
IEC 62047 consists of the following parts, under the general title Semiconductor devices − Micro-electromechanical devices: Part 1: Terms and definitions Part 2: Tensile testing methods of thin film materials (in preparation) Part 3: Thin film standard test piece for tensile testing (in preparation) The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data related to the specific publication. At this date, the publication will be
• reconfirmed, • withdrawn, • replaced by a revised edition, or • amended.

62047-1  IEC:2005 – 9 –
SEMICONDUCTOR DEVICES – MICRO-ELECTROMECHANICAL DEVICES –
Part 1: Terms and definitions
1 Scope This part of IEC 62047 defines terms for micro-electromechanical devices including the process of production of such devices. 2 Terms and definitions For the purposes of this document, the following definitions apply. 2.1 General terms 2.1.1
micro-electromechanical device microsized device, in which sensors, actuators, mechanical components and/or electric circuits are integrated 2.1.2
MEMS microsized electromechanical systems, in which sensors, actuators and/or electric circuits are integrated on a chip using a semiconductor process NOTE MEMS is an acronym standing for "micro-electromechanical systems". The term MEMS is mostly used in the United States. In general, this term means technologies to realize microstructures, sensors, and actuators by using silicon process technology, though it is occasionally used in some other meanings. 2.1.3
MST technologies to realize microelectrical, optical and machinery systems and even their components by using micromachining NOTE MST is an acronym standing for microsystem technologies. The term MST is mostly used in Europe. 2.1.4
micromachine miniaturized devices the components of which are several millimeters or smaller in size, or a microsystem that consists of an integration of such devices NOTE The term 'micromachine' has a broad sense from a functional device such as sensor that utilizes the micromachine technology to a completed system. A molecular machine called a nanomachine is also included. Such industrial applications are expected as inspection and repair systems for piping or confined spaces, and micro-factories, which consume less energy. In the medical field, micromachines are expected to replace ordinary surgery by less invasive treatment from the inside of the body. Research and development for the realization of micromachines is divided into two approaches: micro-electromechanical systems (MEMS) using semiconductor manufacturing processes, and miniaturization of the existing machine technologies.

62047-1  IEC:2005 – 11 –
2.1.5
micromachine technology technology relating to micromachines NOTE Micromachine-related technologies are extremely diversified. In the fundamental technology field, micromachine technologies include: design, material, processing, functional element, system control, energy supply, bonding and assembly, electrical circuit, and evaluation as well as micro-science and engineering such as thermodynamics and tribology in a microscale. Micromachine technologies have two aspects: technologies required to realize micromachines, and technologies required to apply such technical seeds to other industrial fields. 2.2 Terms relating to science and engineering 2.2.1
micro-science and engineering science and engineering for the microscopic world of micromachines NOTE When mechanical systems are miniaturized, various physical parameters change. Two cases prevail: 1) these changes can be predicted by extrapolating the changes of the macro-world, and 2) the peculiarity of the microscopic world becomes apparent and extrapolation is not possible. In the latter case, it is necessary to establish new theoretical and empirical equations for the explanation of phenomena in the microscopic world. Moreover, new methods of analyses and syntheses to deal with engineering problems must be developed. Material science, fluid dynamics, thermodynamics, tribology, control engineering, and kinematics can be systematized as micro-sciences and engineering supporting micromechatronics. 2.2.2
scale effect changes of various effects on the objects behaviour or the properties caused by the change of the object's dimension NOTE The volume of an object is proportional to the third power of its dimension, while the surface area is proportional to the second power. As a result, effect of surface force becomes larger than that of the body force in the microscopic world. For example, the dominant force in the motion of microscopic object is not the inertial force but the electrostatic force or viscous force. Material properties of microscopic objects are also affected by the internal material structure and surface, and, as a result, characteristic values are sometimes different from those of bulks. Frictional properties in the microscopic world also differ from that in the macroscopic world. Therefore, those effects must be considered cautiously while designing a micromachine. 2.2.3
mesotribology tribology applying to the intermediate mesoscopic area between the microscopic world and the macroscopic world NOTE Tribology deals with friction and wear in the macroscopic world. On the other hand, two major topics of microtribology research are the investigation of tribology phenomena on an atomic or molecular scale, and the quantification of characteristics in friction or wear. If the macro-characteristics generated on both surfaces undergoing relative motion are traced to where they originate, the minimum unit of the atomic or molecule cluster causing those characteristics is reached. Observation on a finer scale reaches a boundary at which these characteristic
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