ES 59008-5-3:2001

SLOVENSKI STANDARD
SIST-TS ES 59008-5-3:2007
01-januar-2007
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Data requirements for semiconductor die -- Part 5-3: Particular requirements and
recommendations for die types - Minimally-packaged die
Ta slovenski standard je istoveten z: ES 59008-5-3:2001
ICS:
31.080.01
SIST-TS ES 59008-5-3:2007 en
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

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EUROPEAN SPECIFICATION ES 59008-5-3
SPÉCIFICATION EUROPÉENNE
EUROPÄISCHE SPEZIFIKATION November 2001
English version
Data requirements for semiconductor die
Part 5-3: Particular requirements and recommendations for die types -
Minimally-packaged die
This European Specification was approved by CENELEC on 2001-08-21.
CENELEC members are required to announce the existence of this ES in the same way as for an EN and
to make the ES available promptly at national level in an appropriate form. It is permissible to keep
conflicting national standards in force.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands,
Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2001 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. ES 59008-5-3:2001 E

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ES 59008-5-3:2001 - 2 -
Foreword
This European Specification has been prepared by the CENELEC BTTF 97-1, Known Good Die.
It was submitted to the National Committees for comments and was agreed at the CENELEC
BTTF 97-1 meeting on 2001-08-21.
The following date was fixed:
- latest date by which the existence of the ES
has to be announced at national level (doa)  2002-02-01
The structure of this European Specification is as follows:
ES 59008 Data requirements for semiconductor die
Part 1 General requirements
Part 2 Vocabulary
Part 3 Mechanical, material and connectivity requirements
Part 4 Specific requirements and recommendations
Part 4-1 Test and quality
Part 4-2 Handling and storage
Part 4-3 Thermal
Part 4-4 Electrical simulation
Part 5 Particular requirements and recommendations for die types
Part 5-1 Bare die
Part 5-2 Bare die with added connection structures
Part 5-3 Minimally packaged die
Part 6 Exchange data formats and data dictionary
Part 6-1 Data exchange - DDX
Part 6-2 Data dictionary

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- 3 - ES 59008-5-3:2001
Introduction
This European Specification has been developed to facilitate the selection of unpackaged and
minimally packaged semiconductor die, with or without connection structures in order to save
both design and procurement time.
It is a data specification which defines the requirements of
- product identity,
- product data,
- die mechanical information,
- test, quality and reliability information,
- handling, storage and mounting information,
- thermal data and electrical simulation data.
This document was prepared by CENELEC Task Force CLC/BTTF 97-1 Known Good Die.
Other organisations that helped prepare it were: the ESPRIT GOOD-DIE projects, EECA,
Sematech, DPC and EIAJ.
th
This specification was derived from the work carried out in the ESPRIT 4 Framework project
GOOD-DIE. This project was set up to develop a database for the selection of unpackaged and
minimally packaged semiconductor die, with or without connection structures, and for the
downloading of information to CAD design stations to facilitate the layout and simulation of
MCMs and hybrid circuits. During the early part of the GOOD-DIE project the need was
identified for a standard way of presenting information for the selection and procurement of
these components.

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ES 59008-5-3:2001 - 4 -
1 Scope
This European Specification specifies requirements for the exchange of data pertaining to bare
semiconductor die with or without connection structures, and minimally-packaged
semiconductor die.
This specification also gives recommendations for general industry good practice for handling
bare die, with or without connection structures and minimally-packaged die.
ES 59008-5-3 specifies particular requirements and recommendations for minimally-packaged
die (MPD) that are not contained elsewhere in this series of specifications.
This specification is for use by semiconductor manufacturers, suppliers, die processors and
users of semiconductor die.
ES 59008-5-3 is to be read in conjunction with ES 59008-1, General requirements, with and
ES 59008-3, Mechanical, material and connectivity requirements, and, where relevant, with
ES 59008-4-1, ES 59008-4-2, ES 59008-4-3 and ES 59008-4-4.
2 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of ES 59008-5-3.
ES 59008 Data requirements for semiconductor die
ES 59008-1 Part 1: General requirements
ES 59008-2 Part 2: Vocabulary
ES 59008-3 Part 3: Mechanical, material and connectivity requirements
ES 59008-4-1 Part 4-1: Specific requirements and recommendations - Test and quality
ES 59008-4-2 Part 4-2: Specific requirements and recommendations - Handling and
storage
ES 59008-4-3 Part 4-3: Specific requirements and recommendations - Thermal
ES 59008-4-4 Part 4-4: Specific requirements and recommendations - Electrical simulation
IPC/JEDEC J-STD-033 Standard for Handling, Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices"
3 Definitions
For the purposes of this European Specification, the definitions given in ES 59008-2,
Vocabulary, and the following shall apply.
3.1
interposer
a material placed between two surfaces, giving electrical insulation, mechanical strength,
and/or controlled mechanical separation. It may be used as a mechanism for redistributing
electrical connections and/or allowing for differing thermal expansions between adjacent
surfaces

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- 5 - ES 59008-5-3:2001
4 Conformity levels
Conformity levels do not apply to this part of ES 59008 except where any item in this part of
the standard is already covered by ES 59008-3, ES 59008-4-1, ES 59008-4-2, ES 59008-4-3 or
ES 59008-4-4. This part provides recommendations for good industry practice when
exchanging information about minimally-packaged die (MPD). All information specific to MPD
is included in this part and may be used as a basis for a detailed supplier or user specification.
5 Specific recommendations – Design, selection, test and quality
This clause covers classes of information specifically related to the testing performed on the
MPD by the supplier or related to the quality of the device supplied.
It should be assumed that the specification for the MPD will be treated as that usually given
for a packaged product, and that standard test and quality routines, as for packaged product,
will apply. As such, only details specific to MPD are covered here.
5.1 Encapsulation material
Information should be given on the nature of the material used for encapsulating the MPD and
details of the encapsulation coverage and/or areas of coverage if the die is not fully or
uniformly encapsulated.
5.2 Distor
...