EN 60749-15:2010

SLOVENSKI STANDARD
01-februar-2011
1DGRPHãþD
SIST EN 60749-15:2004
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 15. del:
Odpornost proti spajkalni temperaturi za elemente, montirane v skoznjih luknjah
(IEC 60749-15:2010)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to
soldering temperature for through-hole mounted devices (IEC 60749-15:2010)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15:
Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage (IEC
60749-15:2010)
Dispositifs à semiconducteurs - Méthodes d’essai mécaniques et climatiques - Partie 15:
Résistance à la température de soudage pour dispositifs par trous traversants (CEI
60749-15:2010)
Ta slovenski standard je istoveten z: EN 60749-15:2010
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 60749-15
NORME EUROPÉENNE
December 2010
EUROPÄISCHE NORM
ICS 31.080.01 Supersedes EN 60749-15:2003

English version
Semiconductor devices -
Mechanical and climatic test methods -
Part 15: Resistance to soldering temperature for through-hole mounted
devices
(IEC 60749-15:2010)
Dispositifs à semiconducteurs -  Halbleiterbauelemente -
Méthodes d’essai mécaniques et Mechanische und klimatische
climatiques - Prüfverfahren -
Partie 15: Résistance à la température de Teil 15: Beständigkeit gegen
soudage pour dispositifs par trous Löttemperatur bei Bauelementen zur
traversants Durchsteckmontage
(CEI 60749-15:2010) (IEC 60749-15:2010)

This European Standard was approved by CENELEC on 2010-12-10. CENELEC members are bound to comply
with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard
the status of a national standard without any alteration.

Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.

This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and notified
to the Central Secretariat has the same status as the official versions.

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus,
the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy,
Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia,
Spain, Sweden, Switzerland and the United Kingdom.

CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-15:2010 E
Foreword
The text of document 47/2067/FDIS, future edition 2 of IEC 60749-15, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-15 on 2010-12-01.
This European Standard supersedes EN 60749-15:2003.
The significant changes with respect from EN 60749-15:2003 include:
– editorial change in the scope,
– addition of lead-free solder chemical composition specification.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent
rights.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
(dop) 2011-09-01
national standard or by endorsement
– latest date by which the national standards conflicting
(dow) 2013-12-01
with the EN have to be withdrawn
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-15:2010 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following note has to be added for the standard indicated:
IEC 60068-2-20 NOTE  Harmonized as EN 60068-2-20.
__________
IEC 60749-15 ®
Edition 2.0 2010-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 15: Resistance to soldering temperature for through-hole mounted devices

Dispositifs à semiconducteurs – Méthodes d’essai mécaniques et climatiques –
Partie 15: Résistance à la température de soudage pour dispositifs par trous
traversants
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
G
CODE PRIX
ICS 31.080.01 ISBN 978-2-88912-231-8
– 2 – 60749-15 © IEC:2010
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 15: Resistance to soldering temperature
for through-hole mounted devices

FOREWORD
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