EN IEC 60749-15:2020

SLOVENSKI STANDARD
01-december-2020
Nadomešča:
SIST EN 60749-15:2011
SIST EN 60749-15:2011/AC:2011
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 15. del:
Odpornost proti spajkalni temperaturi za elemente, montirane v skoznjih luknjah
(IEC 60749-15:2020)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to
soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15:
Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage (IEC
60749-15:2020)
Dispositifs à semiconducteurs - Méthodes d’essai mécaniques et climatiques - Partie 15:
Résistance à la température de soudage pour dispositifs par trous traversants (IEC
60749-15:2020)
Ta slovenski standard je istoveten z: EN IEC 60749-15:2020
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 60749-15

NORME EUROPÉENNE
EUROPÄISCHE NORM
September 2020
ICS 31.080.01 Supersedes EN 60749-15:2010 and all of its
amendments and corrigenda (if any)
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 15: Resistance to soldering temperature for through-hole
mounted devices
(IEC 60749-15:2020)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 15: Résistance à la Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur
température de brasage pour dispositifs par trous bei Bauelementen zur Durchsteckmontage
traversants (IEC 60749-15:2020)
(IEC 60749-15:2020)
This European Standard was approved by CENELEC on 2020-08-18. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60749-15:2020 E

European foreword
The text of document 47/2630/FDIS, future edition 3 of IEC 60749-15, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-15:2020.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-05-18
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2023-08-18
document have to be withdrawn
This document supersedes EN 60749-15:2010 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 60749-15:2020 was approved by CENELEC as a European
Standard without any modification.

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-20 - Environmental testing - Part 2-20: Tests - - -
Test T: Test methods for solderability and
resistance to soldering heat of devices
with leads
IEC 60749-3 - Semiconductor devices - Mechanical and EN 60749-3 -
climatic test methods - Part 3: External
visual examination
IEC 60749-8 - Semiconductor devices - Mechanical and EN 60749-8 -
climatic test methods - Part 8: Sealing

IEC 60749-15 ®
Edition 3.0 2020-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –

Part 15: Resistance to soldering temperature for through-hole mounted devices

Dispositifs à semiconducteurs – Méthodes d'essais mécaniques

et climatiques –
Partie 15: Résistance à la température de brasage pour dispositifs par trous

traversants
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-8604-3

– 2 – IEC 60749-15:2020 © IEC 2020
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 6
4.1 Solder pot . 6
4.2 Dipping device . 6
4.3 Heatsinks or shielding . 6
5 Materials . 7
5.1 Solder . 7
5.2 Flux . 7
6 Procedure . 7
6.1 Test method . 7
6.2 Ageing and pre-conditioning of specimens . 7
6.3 Preparation of the solder bath . 7
6.4 Use of flux . 7
6.5 Solder dip . 8
6.6 Precautions . 8
6.7 Measurements . 8
6.8 Failure criteria . 8
7 Summary . 8
Bibliography . 9

Table 1 – Parameters for solder dipping. 6

IEC 60749-15:2020 © IEC 2020 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 15: Resistance to soldering temperature
for through-hole mounted devices

FOREWORD
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