SIST EN IEC 60749-15:2020
(Main)Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
IEC 60749-15:2020 is available as IEC 60749-15:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3, Terms and definitions;
- clarification of the use of a soldering iron for producing the heating effect;
- inclusion an option to use accelerated ageing.
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage (IEC 60749-15:2020)
Dispositifs à semiconducteurs - Méthodes d’essai mécaniques et climatiques - Partie 15: Résistance à la température de soudage pour dispositifs par trous traversants (IEC 60749-15:2020)
IEC 60749-15:2020 est disponible sous forme de IEC 60749-15:2020 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L'IEC 60749-15:2020 décrit un essai utilisé pour déterminer si les dispositifs à semiconducteurs encapsulés utilisés pour le montage par trous traversants peuvent résister aux effets de la température à laquelle ils sont soumis pendant le brasage de leurs broches en utilisant le brasage à la vague. Dans le but d'établir une procédure d'essai normalisée pour les méthodes les plus reproductibles, la méthode d'immersion dans la brasure est utilisée en raison de ses conditions plus contrôlables. Cette procédure détermine si les dispositifs sont capables de résister à la température de brasage rencontrée lors d'opérations de fabrication des cartes à câblage imprimé, sans endommager leurs caractéristiques électriques ou leurs connexions internes. Cet essai est destructif et il peut être utilisé en vue de la qualification, de l’acceptation de lots et pour contrôler les produits.
La chaleur du brasage se propage dans le boîtier du dispositif par les broches de l'autre côté de la carte. Cette procédure ne simule pas l'exposition à la chaleur du brasage à la vague ou à la chaleur de refusion sur le même côté de la carte que le corps du boîtier. La présente édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- ajout de l'Article 3, Termes et définitions;
- clarification sur l'utilisation d'un fer à braser pour produire un effet thermique;
- ajout d'une option relative à l'utilisation du vieillissement accéléré.
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 15. del: Odpornost proti spajkalni temperaturi za elemente, montirane v skoznjih luknjah (IEC 60749-15:2020)
General Information
Relations
Overview
EN IEC 60749-15:2020 (CLC adoption of IEC 60749-15:2020) specifies a reproducible test method to assess the resistance to soldering temperature of encapsulated solid‑state devices intended for through‑hole mounting. The standard defines a controlled solder dip procedure that determines whether devices can withstand the thermal stresses encountered during printed wiring board assembly (wave soldering conditions), without degradation of electrical characteristics or internal connections. The test is intentionally destructive and intended for qualification, lot acceptance and product monitoring.
Key topics and technical requirements
- Test method: Solder dip immersion is used because it provides more controllable and reproducible thermal exposure than full wave simulation. The heat is conducted through the leads into the package from solder on the reverse side of the board.
- Solder types and temperatures:
- Sn–Pb solder: 260 ± 5 °C
- Pb‑free solder: 270 ± 5 °C
- Immersion parameters (from Table 1):
- Number of immersions: ≤ 2
- Immersion/emersion rate: 25 ± 6 mm/s
- Dwell time in solder: Sn–Pb: 10 s; Pb‑free: 7 s (tolerances typically +2 s / −1 s)
- Apparatus and materials:
- Solder pot sized to contain ≥1 kg solder and permit full lead immersion without bottom contact.
- Mechanical dipping device to control immersion/emersion rates and dwell time.
- Specified solder alloys (e.g., Sn60Pb40 or Sn63Pb37 for Sn–Pb) and appropriate flux.
- Optional heatsinks or shielding attached as required by product specification.
- Additional procedural elements:
- Pre‑conditioning and optional accelerated ageing may be used.
- Clarified allowance for use of a soldering iron to produce heating effects where applicable.
- Pass/fail criteria based on degradation of electrical characteristics or internal connections (see relevant clauses).
Applications and users
- Target users:
- Semiconductor device manufacturers performing qualification and lot acceptance testing.
- PCB assembly and reliability engineers evaluating device robustness to soldering heat.
- Test laboratories offering standardized mechanical/climatic tests for through‑hole components.
- Practical uses:
- Verifying thermal robustness for legacy through‑hole parts and mixed‑technology boards.
- Supporting reliability claims for devices supplied to aerospace, industrial, automotive and consumer electronics sectors where through‑hole assembly is used.
- Comparing performance of Sn–Pb vs. Pb‑free solder processes during product design and process validation.
Related standards
- IEC 60068‑2‑20 (Test T: solderability and resistance to soldering heat)
- IEC 60749‑3 (External visual examination)
- IEC 60749‑8 (Sealing)
Keywords: EN IEC 60749‑15:2020, resistance to soldering temperature, through‑hole mounted devices, solder dip test, solderability, Pb‑free solder, semiconductor test methods.
Frequently Asked Questions
SIST EN IEC 60749-15:2020 is a standard published by the Slovenian Institute for Standardization (SIST). Its full title is "Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)". This standard covers: <!-- NEW! -->IEC 60749-15:2020 is available as <a href="https://webstore.iec.ch/publication/67331">IEC 60749-15:2020 RLV</a> which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.</br></br>IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3, Terms and definitions; - clarification of the use of a soldering iron for producing the heating effect; - inclusion an option to use accelerated ageing. <ol style="list-style-type:lower-alpha"> </ol>
<!-- NEW! -->IEC 60749-15:2020 is available as <a href="https://webstore.iec.ch/publication/67331">IEC 60749-15:2020 RLV</a> which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.</br></br>IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering. In order to establish a standard test procedure for the most reproducible methods, the solder dip method is used because of its more controllable conditions. This procedure determines whether devices are capable of withstanding the soldering temperature encountered in printed wiring board assembly operations, without degrading their electrical characteristics or internal connections. This test is destructive and may be used for qualification, lot acceptance and as a product monitor. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board. This procedure does not simulate wave soldering or reflow heat exposure on the same side of the board as the package body. This edition includes the following significant technical changes with respect to the previous edition: - inclusion of new Clause 3, Terms and definitions; - clarification of the use of a soldering iron for producing the heating effect; - inclusion an option to use accelerated ageing. <ol style="list-style-type:lower-alpha"> </ol>
SIST EN IEC 60749-15:2020 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.
SIST EN IEC 60749-15:2020 has the following relationships with other standards: It is inter standard links to SIST EN 60749-15:2011/AC:2011, SIST EN 60749-15:2011. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
You can purchase SIST EN IEC 60749-15:2020 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of SIST standards.
Standards Content (Sample)
SLOVENSKI STANDARD
01-december-2020
Nadomešča:
SIST EN 60749-15:2011
SIST EN 60749-15:2011/AC:2011
Polprevodniški elementi - Metode za mehansko in klimatsko preskušanje - 15. del:
Odpornost proti spajkalni temperaturi za elemente, montirane v skoznjih luknjah
(IEC 60749-15:2020)
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to
soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
Halbleiterbauelemente - Mechanische und klimatische Prüfverfahren - Teil 15:
Beständigkeit gegen Löttemperatur bei Bauelementen zur Durchsteckmontage (IEC
60749-15:2020)
Dispositifs à semiconducteurs - Méthodes d’essai mécaniques et climatiques - Partie 15:
Résistance à la température de soudage pour dispositifs par trous traversants (IEC
60749-15:2020)
Ta slovenski standard je istoveten z: EN IEC 60749-15:2020
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN IEC 60749-15
NORME EUROPÉENNE
EUROPÄISCHE NORM
September 2020
ICS 31.080.01 Supersedes EN 60749-15:2010 and all of its
amendments and corrigenda (if any)
English Version
Semiconductor devices - Mechanical and climatic test methods -
Part 15: Resistance to soldering temperature for through-hole
mounted devices
(IEC 60749-15:2020)
Dispositifs à semiconducteurs - Méthodes d'essais Halbleiterbauelemente - Mechanische und klimatische
mécaniques et climatiques - Partie 15: Résistance à la Prüfverfahren - Teil 15: Beständigkeit gegen Löttemperatur
température de brasage pour dispositifs par trous bei Bauelementen zur Durchsteckmontage
traversants (IEC 60749-15:2020)
(IEC 60749-15:2020)
This European Standard was approved by CENELEC on 2020-08-18. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the
Netherlands, Norway, Poland, Portugal, Republic of North Macedonia, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland,
Turkey and the United Kingdom.
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2020 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 60749-15:2020 E
European foreword
The text of document 47/2630/FDIS, future edition 3 of IEC 60749-15, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 60749-15:2020.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2021-05-18
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2023-08-18
document have to be withdrawn
This document supersedes EN 60749-15:2010 and all of its amendments and corrigenda (if any).
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice
The text of the International Standard IEC 60749-15:2020 was approved by CENELEC as a European
Standard without any modification.
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod),
the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available
here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-20 - Environmental testing - Part 2-20: Tests - - -
Test T: Test methods for solderability and
resistance to soldering heat of devices
with leads
IEC 60749-3 - Semiconductor devices - Mechanical and EN 60749-3 -
climatic test methods - Part 3: External
visual examination
IEC 60749-8 - Semiconductor devices - Mechanical and EN 60749-8 -
climatic test methods - Part 8: Sealing
IEC 60749-15 ®
Edition 3.0 2020-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 15: Resistance to soldering temperature for through-hole mounted devices
Dispositifs à semiconducteurs – Méthodes d'essais mécaniques
et climatiques –
Partie 15: Résistance à la température de brasage pour dispositifs par trous
traversants
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-8604-3
– 2 – IEC 60749-15:2020 © IEC 2020
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 6
4.1 Solder pot . 6
4.2 Dipping device . 6
4.3 Heatsinks or shielding . 6
5 Materials . 7
5.1 Solder . 7
5.2 Flux . 7
6 Procedure . 7
6.1 Test method . 7
6.2 Ageing and pre-conditioning of specimens . 7
6.3 Preparation of the solder bath . 7
6.4 Use of flux . 7
6.5 Solder dip . 8
6.6 Precautions . 8
6.7 Measurements . 8
6.8 Failure criteria . 8
7 Summary . 8
Bibliography . 9
Table 1 – Parameters for solder dipping. 6
IEC 60749-15:2020 © IEC 2020 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 15: Resistance to soldering temperature
for through-hole mounted devices
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote interna
...
Le document SIST EN IEC 60749-15:2020 propose une norme essentielle pour les dispositifs semi-conducteurs, en se concentrant spécifiquement sur les méthodes d'essai mécaniques et climatiques, en particulier la résistance à la température de soudure pour les dispositifs montés en travers. L'étendue de cette norme est significative car elle traite de la capacité des dispositifs d'état solide encapsulés à résister aux effets de la température lors de la soudure de leurs leads, un aspect crucial dans l'assemblage de cartes de circuits imprimés. Parmi les forces notables de cette norme, le choix de la méthode de trempage à la soudure se distingue. Cette approche présente des conditions plus contrôlables, ce qui permet d'établir un protocole d'essai standardisé et reproductible. Ce test destructif, classé comme une procédure de qualification, d'acceptation de lot et de surveillance de produit, joue un rôle vital dans la préservation des caractéristiques électriques et des connexions internes des dispositifs lors des opérations de soudage. En ajoutant des clarifications importantes, notamment sur l'utilisation d'un fer à souder pour induire l'effet de chauffage et l'inclusion d'une option pour un vieillissement accéléré, cette édition améliore considérablement la précision et l'application pratique de la norme. De plus, l'ajout d'une nouvelle clause pour les termes et définitions contribue à une meilleure compréhension et à une application uniforme de la norme dans l'industrie. Ainsi, la SIST EN IEC 60749-15:2020 se positionne comme une référence incontournable pour les professionnels du secteur, garantissant la fiabilité et la durabilité des dispositifs semi-conducteurs face aux défis des températures de soudure rencontrées lors de leur montage. Ce document est crucial pour toute entreprise préoccupée par la qualité et la performance des composants électroniques.
SIST EN IEC 60749-15:2020は、スルーホールマウントデバイスのための半導体デバイスに関する機械的および気候試験方法の標準の重要な一部を形成しています。この標準は、リードのはんだ付け中にデバイスが受ける温度に耐えられるかを評価する際の試験方法を規定しています。特に、波はんだ付けを用いた場合において、封入された固体状態デバイスがどのように影響を受けるかを確認することができます。標準では、最も再現性のある方法のためのテスト手順を確立しており、はんだ浸漬法が選ばれています。この方法は、制御可能な条件下で評価を行うため、信頼性があります。 この標準の主な強みは、印刷回路基板の組立作業において遭遇するはんだ付け温度に対し、デバイスが電気的特性や内部接続を劣化させることなく耐えられるかを判断する点です。試験は破壊的な性質を持ち、製品の適格性評価やロット受け入れ、さらには製品監視にも利用できます。この場合、熱は基板の裏側からリードを通じてデバイスパッケージに導かれますが、パッケージ本体と同じ側での波はんだ付けや再フロー加熱のシミュレーションは行いません。 SIST EN IEC 60749-15:2020の最新版は、前の版に対して重要な技術的変更をいくつか含んでおり、新しい条項（Clause 3）による用語の定義が追加され、はんだごてを使用して熱効果を生じさせる方法が明確化されています。また、加速老化を使用するオプションも追加されており、これにより試験の柔軟性が高まっています。 このように、SIST EN IEC 60749-15:2020は、半導体デバイスの信頼性を確保するために不可欠な標準であり、業界のニーズに適した試験方法を提供することで、材料の品質を向上させることに寄与しています。
The SIST EN IEC 60749-15:2020 standard provides a comprehensive framework for evaluating the resistance of through-hole mounted semiconductor devices to soldering temperatures. Its primary focus is on ensuring that encapsulated solid-state devices can endure the thermal stresses encountered during soldering processes, particularly wave soldering. By utilizing the solder dip method for testing, the standard emphasizes the establishment of controllable and reproducible testing conditions, which is a significant strength in ensuring the reliability and uniformity of test results across different applications. One of the strengths of this standard is the clear delineation of the testing procedure, which targets the assessment of devices in a manner that effectively simulates the stressors they will face during printed wiring board assembly operations. The inclusion of detailed terms and definitions in the newly added Clause 3 enhances clarity and aids in the standardized communication of testing processes among professionals in the field. Additionally, the standard provides flexibility by incorporating options for using a soldering iron to generate the necessary heating effects and allows for accelerated ageing as part of the assessment. These adaptations reflect the standard’s relevance in a rapidly evolving technological landscape where performance and reliability are paramount. Overall, the SIST EN IEC 60749-15:2020 standard not only sets a benchmark for the soldering temperature resistance of through-hole mounted devices but also addresses the industry's need for rigorous testing methodologies, ensuring that devices maintain their electrical characteristics and internal integrity even under significant thermal stress. Its methodical approach, along with the incorporation of essential updates compared to previous editions, affirms the standard's critical role in semiconductor device quality assurance.
Die Norm SIST EN IEC 60749-15:2020, die sich mit den mechanischen und klimatischen Prüfmethoden für Halbleiterbauelemente befasst, bietet eine umfassende Grundlage zur Bewertung der Widerstandsfähigkeit von durchsteckmontierten Geräten gegenüber Lötbedingungen. Der Anwendungsbereich dieser Norm ist äußerst relevant, da sie eine standardisierte Prüfmethodik für die Lötbeständigkeit bereitstellt, die für die Qualitätssicherung und Zuverlässigkeit von elektronischen Bauteilen entscheidend ist. Eine der Stärken dieser Norm ist die Verwendung der Lötstauchmethode, die aufgrund ihrer kontrollierbaren Bedingungen die reproducibelsten Ergebnisse liefert. Diese Methode ermöglicht es, festzustellen, ob die getesteten Bauteile die Löttemperaturen, die während der Montage von gedruckten Schaltungen auftreten, ohne Beeinträchtigung ihrer elektrischen Eigenschaften oder internen Verbindungen überstehen können. Da es sich um einen zerstörerischen Test handelt, ist die Durchführung der Prüfungen sowohl für die Qualifizierung als auch für die Abnahme von Lotschüssen und als Produktüberwachung von großer Bedeutung. Die jüngste Ausgabe enthält bedeutende technische Änderungen, die ihre Relevanz unterstreichen. Dazu gehören die Einführung eines neuen Abschnitts für Begriffe und Definitionen sowie eine Klarstellung zur Verwendung von Lötkolben, um den Wärmeeffekt zu erzeugen. Außerdem wird eine Option zur Verwendung beschleunigter Alterung eingeführt, was die Anwendungsmöglichkeiten der Norm weiter erweitern und eine realistischere Einschätzung der Produktlebensdauer ermöglichen kann. Zusammenfassend lässt sich sagen, dass die SIST EN IEC 60749-15:2020 eine wesentliche Norm für die Halbleiterindustrie darstellt, die eine sorgfältige Prüfung der Belastbarkeit von durchsteckmontierten Geräten in Bezug auf Löttemperaturen beinhaltet. Die Norm fördert die Verbesserung der Qualität und Zuverlässigkeit von elektronischen Produkten auf einem zunehmend wettbewerbsintensiven Markt.
SIST EN IEC 60749-15:2020 표준은 반도체 장치의 기계적 및 기후적 시험 방법을 다루고 있으며, 특히 관통형 장치에 대한 납땜 온도 저항 시험을 규정하고 있습니다. 이 표준의 주된 목적은 관통형 장치에 사용되는 인캡슐화된 고체 상태 장치가 납땜 과정 중 경험하는 열 효과를 견딜 수 있는지를 결정하는 테스트 방법을 제시하는 것입니다. 이 표준의 주요 강점 중 하나는 가장 재현 가능한 시험 방법을 위한 표준화된 절차를 제공한다는 점입니다. 따라서 납땜 Dip 방법을 채택하여 보다 통제된 조건에서 테스트를 수행할 수 있으며, 이를 통해 인쇄 회로 기판 조립 과정에서 encountered 하는 납땜 온도에 장치가 견딜 수 있는지를 평가합니다. 또한, 이 테스트는 파괴적인 방법으로 수행되며, 자격 확인, 배치 수용, 그리고 제품 모니터링 용도로 사용될 수 있습니다. 이 표준은 이전 판과 비교할 때 다음과 같은 주요 기술적 변경 사항을 포함하고 있어 더욱 향상된 신뢰성을 제공합니다: - 새로운 조항 3, 용어 및 정의 포함; - 납땜 효과를 생성하기 위한 납땜 인두 사용에 대한 명확화; - 가속 노화 사용 옵션의 포함. SIST EN IEC 60749-15:2020 표준은 반도체 장치의 품질 보증 및 신뢰성 평가에 있어 매우 중요하며, 전세계적으로 통용되는 기술적 가이드라인으로서의 역할을 수행하고 있습니다. 이 표준은 현대 전자 기기에서의 적합성과 효율성을 보장하는 데 필수적입니다.
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