EN 60749-7:2002

SLOVENSKI SIST EN 60749-7:2004

STANDARD
julij 2004
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal
moisture content measurement and the analysis of other residual gases (IEC 60749-
7:2002)
ICS 31.080.01 Referenčna številka
©  Standard je založil in izdal Slovenski inštitut za standardizacijo. Razmnoževanje ali kopiranje celote ali delov tega dokumenta ni dovoljeno

EUROPEAN STANDARD EN 60749-7
NORME EUROPÉENNE
EUROPÄISCHE NORM August 2002
ICS 31.080.01 Partly supersedes EN 60749:1999 + A1:2000 + A2:2001
English version
Semiconductor devices -
Mechanical and climatic test methods
Part 7: Internal moisture content measurement and
the analysis of other residual gases
(IEC 60749-7:2002)
Dispositifs à semiconducteurs - Halbleiterbauelemente -
Méthodes d'essais mécaniques Mechanische und klimatische
et climatiques Prüfverfahren
Partie 7: Mesure de la teneur en humidité Teil 7: Messung des inneren
interne et analyse des autres gaz Feuchtegehaltes und Analyse
résiduels von anderen Restgasen
(CEI 60749-7:2002) (IEC 60749-7:2002)
This European Standard was approved by CENELEC on 2002-07-02. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic,
Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta,
Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 60749-7:2002 E
Foreword
The text of document 47/1597/FDIS, future edition 1 of IEC 60749-7, prepared by IEC TC 47,
Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by
CENELEC as EN 60749-7 on 2002-07-02.
This mechanical and climatic test method, as it relates to the internal moisture content measurement and
the analysis of other residual gases, is a complete rewrite of the test contained in clause 8, chapter 3 of
EN 60749:1999.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2003-04-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2005-07-01
Annexes designated "normative" are part of the body of the standard.
In this standard, annex ZA is normative.
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 60749-7:2002 was approved by CENELEC as a European
Standard without any modification.
__________
- 3 - EN 60749-7:2002
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
This European Standard incorporates by dated or undated reference, provisions from other
publications. These normative references are cited at the appropriate places in the text and the
publications are listed hereafter. For dated references, subsequent amendments to or revisions of any
of these publications apply to this European Standard only when incorporated in it by amendment or
revision. For undated references the latest edition of the publication referred to applies (including
amendments).
NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
1)
IEC 60749-8 - Semiconductor devices – Mechanical
and climatic test methods
Part 8: Sealing
1)
To be published.
NORME CEI
INTERNATIONALE IEC
60749-7
INTERNATIONAL
Première édition
STANDARD
First edition
2002-04
Dispositifs à semiconducteurs –
Méthodes d'essais mécaniques et climatiques –
Partie 7:
Mesure de la teneur en humidité interne
et analyse des autres gaz résiduels
Semiconductor devices –
Mechanical and climatic test methods –
Part 7:
Internal moisture content measurement
and the analysis of other residual gases
 IEC 2002 Droits de reproduction réservés  Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite ni No part of this publication may be reproduced or utilized in any
utilisée sous quelque forme que ce soit et par aucun procédé, form or by any means, electronic or mechanical, including
électronique ou mécanique, y compris la photocopie et les photocopying and microfilm, without permission in writing from
microfilms, sans l'accord écrit de l'éditeur. the publisher.
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Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch  Web: www.iec.ch
CODE PRIX
H
PRICE CODE
Commission Electrotechnique Internationale
International Electrotechnical Commission
Международная Электротехническая Комиссия
Pour prix, voir catalogue en vigueur
For price, see current catalogue

60749-7  IEC:2002 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 7: Internal moisture content measurement
and the analysis of other residual gases
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-7 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47/1597/FDIS 47/1612/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This mechanical and climatic test method, as it relates to the internal moisture content
measurement and the analysis of other residual gases, is a complete rewrite of the test
contained in clause 8, chapter 3 of IEC 60749.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.

60749-7  IEC:2002 – 5 –
The committee has decided that the contents of this publication will remain unchanged until
2007. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
The contents of the corrigendum of August 2003 have been included in this copy.

60749-7  IEC:2002 – 7 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –
Part 7: Internal moisture content measurement
and the analysis of other residual gases
1 Scope
The purpose of this part of IEC 60749 is to test and measure the water vapour and other gas
content of the atmosphere inside a metal or ceramic hermetically sealed device. It is
applicable to semiconductor devices sealed in such a manner but generally only used for high
reliability applications such as military or aerospace. It can be destructive (Methods 1 and 2)
or non-destructive (Method 3).
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60749-8, Semiconductor devices – Mechanical and climatic test methods – Part 8:
1)
Sealing
3 Test apparatus
The apparatus for testing the internal water vapour content and that of other gases shall be as
follows for the chosen method.
3.1 Method 1
Method 1 measures the water vapour content of the device atmosphere by mass spectro-
metry. The apparatus for method 1 shall consist of:
a) A mass spectrometer capable of reproducibly detecting the specified moisture content for
a given volume package with a factor of ten sensitivity safety margin (i.e. for a specified
– 2)
limit of 5 000 × 10 by volume , 0,01 ml, the mass spectrometer shall demonstrate a
–6
500 × 10 by volume or less absolute sensitivity to moisture for a package volume of
0,01 ml). The smallest volume shall be considered the worst case. The calibration of the
mass spectrometer shall be accomplished at the specified moisture limit (±20 %) using a
package simulator which has the capability of generating at least three known volumes of
gas ±10 % on a repetitive basis by means of a continuous sample volume purge of known
moisture content ±10 %. Moisture content shall be established by the standard generation
techniques (i.e. double pressure, divided flow, or cryogenic method). The absolute
moisture shall be measured by a moisture dew point analyzer. The calibration operation
shall be performed:
− every day for the spectrometer measurement calibration;
− every year for the absolute moisture generator (connected to the simulator) versus the
national standards.
———————
1)
To be published.
2)
parts per million by volume (ppmv)

60749-7  IEC:2002 – 9 –
Gas analysis results obtained by this method shall be considered valid only in the
moisture range or limit bracketed by at least two (volume or concentration) calibration
–6 –6
points (i.e. 5 000 × 10 by volume between 0,01 ml and 0,1 ml or 1 000 × 10 by volume
–6
to 5 000 × 10 by volume between 0,01 ml to 0,1 ml). A best fit curve shall be used
between volume calibration points. Corrections of sensitivity factors deviating greater than
10 % from the mean between calibration points shall be required.
b) A vacuum opening chamber which can contain the device and a vacuum transfer passage
connecting the device to the mass spectrometer of 3.1a). The transfer passage shall be
maintained at 125 °C ± 5 °C. The fixturing in the vacuum opening chamber shall position
the specimen as required by the piercing arrangement of 3.1c) and maintain the device at
100 °C ± 5 °C for a minimum of 10 min prior to piercing.
c) A piercing arrangement functioning within the opening chamber or transfer passage of
3.1b), which can pierce the specimen housing (without breaking the mass spectrometer
chamber vacuum and without disturbing the package sealing medium), thus allowing the
specimen internal gases to escape into the chamber and mass spectrometer.
NOTE A sharp-pointed piercing tool, actuated from outside the chamber wall via a bellows to permit movement,
should be used to pierce both metal and ceramic packages. For ceramic packages, the package lid or cover should
be locally thinned by abrasion to facilitate localized piercing but care should be taken to ensure that the package
remains hermetic.
3.2 Method 2
Method 2 measures the water vapour content of the device atmosphere by integrating
moisture picked up by a dry carrier gas at 50 °C. The apparatus for Method 2 shall consist of:
a) An integrating electronic detector and moisture sensor capable of reproducibly detecting a

–6 –6
water vapour content of 300 × 10 ± 50 × 10 by volume moisture for the package volume
being tested. This shall be determined by dividing the absolute sensitivity in micrograms
H O by the computed weight of the gas in the device under test, and then correcting to
parts per million by volume (ppmv).
b) A piercing chamber or enclosure, connected to the integrating detector of 3.2a), which will
contain the device specimen and maintain its temperature at 100 °C ± 5 °C during
measurements. The chamber shall position the specimen as required by the piercing
arrangement. The piercing mechanism shall open the package in a manner which will
allow the contained gas to be purged out by the carrier gas or removed by evacuation. The
sensor and connection to the piercing chamber will be maintained at a temperature of
50 °C ± 2 °C.
3.3 Method 3
Method 3 measures the water vapour content of the device atmosphere by mea
...