IEC 60191-6-16:2007

IEC 60191-6-16 ®
Edition 1.0 2007-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA,
FBGA and FLGA
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-16: Glossaire des supports de test et de déverminage pour les BGA,
LGA, FBGA et FLGA
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IEC 60191-6-16 ®
Edition 1.0 2007-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –

Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA,

FBGA and FLGA
Normalisation mécanique des dispositifs à semiconducteurs –

Partie 6-16: Glossaire des supports de test et de déverminage pour les BGA,

LGA, FBGA et FLGA
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX L
ICS 31.080.01 ISBN 978-2-83220-233-3

– 2 – 60191-6-16  IEC:2007
INTERNATIONAL ELECTROTECHNICAL COMMISSION
______________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-16: Glossary of semiconductor tests and burn-in sockets
for BGA, LGA, FBGA and FLGA
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-16 has been prepared by subcommittee 47D: Mechanical
standardization of semiconductor devices, of IEC technical committee 47: Semiconductor
devices.
This bilingual version (2012-07) corresponds to the monolingual English version, published in
2007-04. The text of this standard is based on the following documents:
FDIS Report on voting
47D/679/FDIS 47D/683/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.
This publication has been drafted in accordance with the ISO/IEC Directive, Part 2.

60191-6-16  IEC:2007 – 3 –
A list of all the parts of the IEC 60191 series, under the general title Mechanical
standardization of semiconductor devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 4 – 60191-6-16  IEC:2007
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-16: Glossary of semiconductor tests and burn-in sockets
for BGA, LGA, FBGA and FLGA
1 Scope
This part of IEC 60191 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and
FLGA. This standard intends to establish definitions and unification of terminology relating to
tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60191-1:1966, Mechanical standardization of semiconductor devices – Part 1:
Preparation of outline drawings of semiconductor devices
IEC 60191-2:1966, Mechanical standardization of semiconductor devices – Part 2:
Dimensions
IEC 60191-3:1999, Mechanical standardization of semiconductor devices – Part 3: General
rules for the preparation of outline drawings of integrated circuits
IEC 60191-4:1999, Mechanical standardization of semiconductor devices – Part 4: Coding
system and classification into forms of package outlines for semiconductor devices
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
NOTE 1 Long terms are indicated in two lines.
NOTE 2 A symbol indicates the dimensional symbol in drawing.
NOTE 3 A dash (-) in the columns of “Drawing part” and “Symbol” indicates no correspondence to symbols or
drawing parts.
60191-6-16  IEC:2007 – 5 –
3.1 General
Table 1 – General
No. Term Definition Symbol Drawing part
101 IC socket connector to electrically connect and mechanically hold IC - -
package
102 production socket socket used in the production of PCB assemblies for - -
electrical equipment to facilitate package replacement
103 test and burn-in socket socket mainly used for electrical characteristics test, burn-in - -
and reliability test of package with its production process.
Designed for reliable contact, durable actuation and high
environmental operating temperature
104 clamshell type socket socket having a style that surrounds the package with hinged - Figure 1
base and lid
105 open-top type socket socket having a style to load/unload package from the top - Figure 2
opening of socket by pressing down the cover mechanism
3.2 Clamshell type
Table 2 – Clamshell type
No. Term Definition Symbol Drawing part
201 base base part to hold contacts and other socket parts and to be - Figure 1(1)
assembled on PCB
202 lid part making a pair with base whose function is to hold the - Figure 1(2)
package
203 latch latch to fix the cover with base at closed position - Figure 1(3)
204 hinge hinge to join base and lid - Figure 1(4)
205 alignment plate supporting part to align terminals with through holes on PCB - Figure 1(5)
for ease of socket terminal insertion
206 alignment pin pin mounted on socket to define relative position of socket - Figure 1(6)
with PCB
207 contact electrically connecting part of socket consisting of contact - Figure 1(7)
point with package lead and terminal portion to be soldered
on PCB
208 contact point section of the contact making connection with package - Figure 1,(8)
209 terminal electrical connector protruding from socket base in order to - Figure 1(9)
solder on PCB. Part of the contact
210 platform part to hold package - Figure 1(10)
211 pusher part to hold package and to maintain stable contact of - Figure 1(11)
package leads with socket contacts
212 package guide guide for package established in socket to align package - Figure 1(12)
leads with socket contact
213 mounting flange flange to mount socket on PCB - Figure 1(13)
214 socket width socket width excluding mounting flange W Figure 1
215 maximum socket width maximum socket width including mounting flange W Figure 1
216 socket length socket length excluding protrusion of the latch at its closed L Figure 1
position
217 maximum socket length maximum socket length including protrusion of the latch at its L Figure 1
closed position
218 latch moving distance distance of the latch movement beyond socket length Figure 1
L
– 6 – 60191-6-16  IEC:2007
Table 2 – Clamshell type (continued)
No. Term Definition Symbol Drawing part
219 socket height distance from socket mounting plane to the lid top surface at A Figure 1
its closed position
220 maximum socket height distance from socket mounting plane to the lid top surface A Figure 1
including protruded section with its closed position
221 maximum height with maximum socket height from its mounting plane with the lid Figure 1
A
opened lid at fully open position including protrusions
222 lid open angle angle of the lid at fully open position θ Figure 1
223 base width width of socket base W Figure 1
224 base length length of socket base L Figure 1
225 seating plane height height from socket mounting surface to the platform top A Figure 1
surface
226 terminal length length from socket mounting plane to terminal tip Figure 1
A
60191-6-16  IEC:2007 – 7 –
3.3 Open-top type
Table 3 – Open-top type
No. Term Definition Symbol Drawing part
301 base base part to hold contacts and other socket parts and to be - Figure 2(1)
assembled on PCB
302 cover part to actuate the pusher and contact point of the contact - Figure 2(2)
303 bumper protective part surrounding the base - Figure 2,(3)
304 alignment plate supporting part to align terminals with through holes on PCB - Figure 2(4)
for ease of socket terminal insertion
305 alignment pin pin mounted on socket to define relative position of socket - Figure 2(5)
with PCB
306 contact electrically connecting part of socket consisting of contact - Figure 2 (6)
point with package lead and terminal portion to be soldered

on PCB
307 contact point section of the contact making a connection with package - Figure 2(7)
308 terminal electrical connector protruding from socket base in order to - Figure 2(8)
solder on PCB, a part of contact
309 platform part to hold package. In case of the open top type socket, - Figure 2(9)
this functionality is likely built in main body of socket
310 pusher part to hold package and to maintain stable contact of - Figure 2(10)
package leads with socket contacts
311 package guide guide for package established in socket to align package - Figure 2(11)
leads with socket contact
312 retainer part to retain package - Figure 2(12)
313 socket width socket width excluding bumper and others W Figure 2
314 maximum socket width maximum socket width including bumper and others W Figure 2
315 socket length socket length excluding bumper and others L Figure 2
316 maximum socket length maximum socket length including bumper and others L Figure 2
317 socket height height of socket from its mounting plane A Figure 2
318 end stroke height distance from socket mounting plane to top surface of the A Figure 2
cover in its fully depressed position
319 seating plane height distance from socket mounting plane to top surface of the A Figure 2
platform without package
320 terminal length length from socket mounting plane to terminal tip A Figure 2
– 8 – 60191-6-16  IEC:2007
3.4 Printed circuit board
Table 4 – Printed ci
...