IEC 60191-2:1966/AMD5:2002
(Amendment)Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
Amendement 5 - Normalisation mécanique des dispositifs à semiconducteurs. Deuxième partie: Dimensions
General Information
- Status
- Published
- Publication Date
- 11-Feb-2002
- Technical Committee
- SC 47D - Semiconductor devices packaging
- Drafting Committee
- WG 1 - TC 47/SC 47D/WG 1
- Current Stage
- PPUB - Publication issued
- Start Date
- 15-Feb-2002
- Completion Date
- 12-Feb-2002
Overview
IEC 60191-2:1966/AMD5:2002 is an important international standard issued by the International Electrotechnical Commission (IEC) focused on the mechanical standardization of semiconductor devices, specifically addressing dimensions in Part 2. Amendment 5 (2002) updates and supplements the original 1966 publication, reflecting decades of advancement and collaboration among international electrotechnical committees. The standard sets internationally recognized mechanical dimension specifications that promote interchangeability, consistency, and automated handling of semiconductor devices.
The IEC 60191-2 series plays a critical role in defining device outline drawings, case outlines, and base drawings for a variety of semiconductor devices, ensuring components meet precise dimensional criteria for compatibility across manufacturers and applications.
Key Topics
Mechanical Standardization Philosophy: Emphasizes international cooperation, precise dimension specification, and systematic review of existing standards to maintain relevancy and promote unification.
Device Outline Drawings (Chapter I): Includes a comprehensive catalog of standardized semiconductor package outlines (e.g., dual in-line packages, small-signal transistors, integrated circuits, optoelectronic devices) coded by IEC number and country of origin.
Types of Semiconductor Devices: Classification of devices generally mounted in standardized packages such as signal diodes, rectifiers, thyristors, transistors (signal, power, microwave), optoelectronics, and integrated circuits.
Dimension Recommendations: Defines exact dimensional values and tolerances for device outlines, bases, cases, and gauges, allowing for precise mechanical design and automated assembly processes.
Obsolete Drawings Management: Describes the process for removing unsupported package outlines, transferring them to an obsolete list with specific timelines to ensure the standards remain current and practical.
Amendment Integration: Guidance on updating IEC 60191-2 publications with new pages and revised title or preface pages, facilitating systematic document management.
Applications
IEC 60191-2:1966/AMD5:2002 standard serves multiple practical roles across the semiconductor industry and allied sectors:
Electronic Component Manufacturing: Enables manufacturers to produce semiconductor devices with standardized mechanical dimensions to ensure interoperability and compliance.
Automated Assembly Lines: Facilitates design of automated pick-and-place machinery and automated soldering processes by defining exact mechanical tolerances and package outlines.
Quality Control and Testing: Provides standardized outlines and gauges for inspection and quality assurance of semiconductor components.
Design and Engineering: Guides engineers in designing printed circuit boards (PCBs) and packages compatible with widely accepted mechanical standards, accelerating product development.
International Trade and Compliance: Assists in harmonizing national and regional semiconductor standards with international norms, reducing trade barriers and fostering global cooperation.
Supply Chain Standardization: Promotes consistent device specifications across suppliers and end-users, streamlining procurement and inventory management.
Related Standards
The IEC 60191-2:1966/AMD5:2002 ties into a broader framework of semiconductor standardization, including:
IEC 60191 (General series): The overarching standard for mechanical standardization of semiconductor devices covering various parts and amendments beyond dimensions.
ISO/IEC Joint Standards: Collaborative standards developed by IEC and the International Organization for Standardization (ISO) relating to semiconductor device packaging and testing.
Other IEC Technical Committees Standards: Standards developed by IEC Technical Committee 47, focusing on semiconductor devices and associated mechanical and electrical characteristics.
National Equivalent Standards: Regional and national equivalents adopting IEC 60191-2 dimensions as foundational references, facilitating global interoperability.
By adhering to IEC 60191-2:1966/AMD5:2002, manufacturers, designers, and quality professionals ensure semiconductor devices meet rigorous international mechanical standards that support precision, reliability, and global compatibility-cornerstones for advancing electronics technology worldwide.
Frequently Asked Questions
IEC 60191-2:1966/AMD5:2002 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions". This standard covers: Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
IEC 60191-2:1966/AMD5:2002 is classified under the following ICS (International Classification for Standards) categories: 31.080.01 - Semiconductor devices in general. The ICS classification helps identify the subject area and facilitates finding related standards.
IEC 60191-2:1966/AMD5:2002 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
NORME CEI
INTERNATIONALE IEC
60191-2
INTERNATIONAL
AMENDEMENT 5
STANDARD
AMENDMENT 5
2002-02
Amendement 5
Normalisation mécanique des dispositifs
à semiconducteurs –
Partie 2:
Dimensions
Amendment 5
Mechanical standardization of semiconductor
devices –
Part 2:
Dimensions
Les feuilles de cet amendement sont à insérer dans la
Publication 60191-2
The sheets contained in this amendment are to be
inserted in Publication 60191-2
CODE PRIX
PRICE CODE F
Pour prix, voir catalogue en vigueur
For price, see current catalogue
60191-2 Amend. 5 © CEI/IEC:2002
INSTRUCTIONS POUR L’INSERTION DES INSTRUCTIONS FOR THE INSERTION
NOUVELLES PAGES DANS LA CEI 60191-2 OF NEW PAGES IN IEC 60191-2
Remplacer la page de titre existante par la Replace the existing title page with the new title
nouvelle page de titre. page.
Retirer la page 60191 IEC I existante Remove the existing page 60191 IEC I
contenant la préface et la remplacer par la containing the preface and insert in its place
nouvelle page 60191 IEC I contenant la the new page 60191 IEC I containing the
préface à l'amendment 5 (2002). preface to Amendment 5 (2002).
Chapitre I: Chapter I:
Ajouter les nouvelles feuilles suivantes: Add the following new sheets:
60191 IEC I-165E - a/b/c/d/e/f 60191 IEC I-165E - a/b/c/d/e/f
NORME
CEI
INTERNATIONALE IEC
60191-2
INTERNATIONAL
Première édition
First edition
STANDARD
Modifiée selon les Compléments:
Amended in accordance with Supplement:
A (1967), B (1969), C (1970), D (1971), E (1974), F (1976),
G (1978), H (1978), J (1980), K (1981), L (1982), M (1983),
N (1987), P (1988), Q (1990), R (1995), S (1995), T(1995),
U(1997), V(1998), W(1999), X(1999), Y(2000), Z(2000)
et/and Amendement/Amendment 1 (2001), 2(2001), 3(2001),
4(2001), 5(2002)
Normalisation mécanique des dispositifs
à semiconducteurs –
Partie 2:
Dimensions
Mechanical standardization of semiconductor
devices –
Part 2:
Dimensions
IEC 2002 Droits de reproduction réservés Copyright - all rights reserved
Aucune partie de cette publication ne peut être reproduite No part of this publication may be reproduced or utilized in
ni utilisée sous quelque forme que ce soit et par aucun any form or by any means, electronic or mechanical,
procédé, électronique ou mécanique, y compris la photo- including photocopying and microfilm, without permission
copie et les microfilms, sans l'accord écrit de l'éditeur. in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
Commission Electrotechnique Internationale
International Electrotechnical Commission
Международная Электротехническая Комиссия
COMMISSION ÉLECTROTECHNIQUE INTERNATIONAL
INTERNATIONALE ELECTROTECHNICAL COMMISSION
PUBLICATION 191-2 PUBLICATION 191-2
NORMALISATION MÉCANIQUE MECHANICAL STANDARDIZATION
DES DISPOSITIFS À OF SEMICONDUCTOR
SEMICONDUCTEURS DEVICES
PART 2: DIMENSIONS
DEUXIÈME PARTIE: DIMENSIONS
SOMMAIRE CONTENTS
PRÉAMBULE FOREWORD
PRÉFACE PREFACE
CONCEPTION DE LA NORMALISATION PHILOSOPHY OF MECHANICAL STAN-
MÉCANIQUE . Chapitre 00 DARDIZATION . Chapter 00
VALEURS RECOMMANDÉES POUR CER- RECOMMENDED VALUES FOR CERTAIN
TAINES DIMENSIONS DE DESSINS DE DIMENSIONS OF DRAWINGS OF SEMI-
DISPOSITIFS À SEMICONDUCTEURS. Chapitre 0 CONDUCTOR DEVICES . Chapter 0
DESSINS D'ENCOMBREMENTS. Chapitre I DEVICE OUTLINE DRAWINGS . Chapter I
TYPES DE DISPOSITIFS À SEMICONDUC- TYPES OF SEMICONDUCTOR DEVICES
TEURS GÉNÉRALEMENT MONTÉS GENERALLY MOUNTED IN THE
DANS LES BOÎTIERS DU CHAPITRE I PACKAGES OF CHAPTER I
DESSINS D'EMBASES. Chapitre II BASE DRAWINGS. Chapter II
DESSINS DE BOÎTIERS . Chapitre III CASE OUTLINE DRAWINGS. Chapter III
DESSINS DE CALIBRES . Chapitre IV GAUGE DRAWINGS . Chapter IV
TABLEAUX MONTRANT LES ASSOCIA- TABLES SHOWING ASSOCIATIONS BE-
TIONS ENTRE LES BOÎTIERS ET LES TWEEN CASE OUTLINES AND BASES. Chapter V
EMBASES . Chapitre V
DESSINS OBSOLÈTES OBSOLETE DRAWINGS
COMPLÉMENTS AUX LISTES DE CODES ADDITIONS TO THE LISTS OF
NATIONAUX FIGURANT SUR LES NATIONAL CODES APPEARING ON
FEUILLES DES NORMES DE THE STANDARD SHEETS OF
LA PUBLICATION 191-2 DE LA CEI IEC PUBLICATION 191-2
SUPPRESSIONS DANS LES LISTES DELETIONS TO THE LISTS OF
DE CODES NATIONAUX FIGURANT NATIONAL CODES APPEARING ON
SUR LES FEUILLES DE NORMES DE THE STANDARD SHEETS OF
LA PUBLICATION 191-2 DE LA CEI IEC PUBLICATION 191-2
Publication CEI 191-2 IEC Publication 191-2
Date: 1987 Date: 1987
60191-2 amend. 5 © CEI/IEC:2002
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
_________
Amendement 5 (2002) à la CEI 60191-2 (1966)
NORMALISATION MÉCANIQUE DES DISPOSITIFS
À SEMICONDUCTEURS –
Partie 2: Dimensions
AVANT-PROPOS
1) La CEI (Commission Électrotechnique Internationale) est une organisation mondiale de normalisation composée
de l'ensemble des comités électrotechniques nationaux (Comités nationaux de la CEI). La CEI a pour objet de
favoriser la coopération internationale pour toutes les questions de normalisation dans les domaines de
l'électricité et de l'électronique. A cet effet, la CEI, entre autres activités, publie des Normes internationales. Leur
élaboration est confiée à des comités d'études, aux travaux desquels tout Comité national intéressé par le sujet
traité peut participer. Les organisations internationales, gouvernementales et non gouvernementales, en liaison
avec la CEI, participent également aux travaux. La CEI collabore étroitement avec l'Organisation Internationale
de Normalisation (ISO), selon des conditions fixées par accord entre les deux organisations.
2) Les décisions ou accords officiels de la CEI concernant les questions techniques représentent, dans la mesure
du possible, un accord international sur les sujets étudiés, étant donné que les Comités nationaux intéressés
sont représentés dans chaque comité d’études.
3) Les documents produits se présentent sous la forme de recommandations internationales. Ils sont publiés
comme normes, spécifications techniques, rapports techniques ou guides et agréés comme tels par les Comités
nationaux.
4) Dans le but d'encourager l'unification internationale, les Comités nationaux de la CEI s'engagent à appliquer de
façon transparente, dans toute la mesure possible, les Normes internationales de la CEI dans leurs normes
nationales et régionales. Toute divergence entre la norme de la CEI et la norme nationale ou régionale
correspondante doit être indiquée en termes clairs dans cette dernière.
5) La CEI n’a fixé aucune procédure concernant le marquage comme indication d’approbation et sa responsabilité
n’est pas engagée quand un matériel est déclaré conforme à l’une de ses normes.
6) L’attention est attirée sur le fait que certains des éléments de la présente Norme internationale peuvent faire
l’objet de droits de propriété intellectuelle ou de droits analogues. La CEI ne saurait être tenue pour responsable
de ne pas avoir identifié de tels droits de propriété et de ne pas avoir signalé leur existence.
PRÉFACE À L'AMENDEMENT 5 (2002)
Le présent amendement a été établi par le sous-comité 47D: Normalisation mécanique des
dispositifs à semiconducteurs du comité d'études 47 de la CEI: Dispositifs à semiconducteurs.
Le texte de cette norme est issu des documents suivants:
FDIS Rapport de vote
47D/466/FDIS 47D/475/RVD
Le rapport de vote indiqué dans le tableau ci-dessus donne toute information sur le vote ayant
abouti à l'approbation de cette norme.
Date: 2002 60191-2 IEC I
Publication IEC 60191-2
60191-2 Amend. 5 © CEI/IEC:2002
INTERNATIONAL ELECTROTECHNICAL COMMISSION
_________
Amendment 5 (2002) to IEC 60191-2 (1966)
MECHANICAL STANDARDIZATION OF
SEMICONDUCTOR DEVICES –
Part 2: Dimensions
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising with
the IEC also participate in this preparation. The IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any divergence
between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the
latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject of
patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
PREFACE TO AMENDMENT 5 (2002)
This amendment has been prepared by subcommittee 47D: Mechanical standardization of
semiconductor devices of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47D/466/FDIS 47D/475/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
60191-2 IEC I
Date: 2002 Publication IEC 60191-2
60191-2 © CEI:1987
CHAPITRE 00 – CONCEPTION DE LA NORMALISATION MÉCANIQUE
1. Règles fondamentales
Lors de la réunion tenue à Montreux (juin 1981), le Comité d’Etudes n° 47 adopta les règles
fondamentales suivantes qui remplacent celles adoptées à Copenhagu
...




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