IEC 60191-6-3:2000

IEC 60191-6-3 ®
Edition 1.0 2000-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6-3: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Measuring methods for package
dimensions of quad flat packs (QFP)

Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-3: Règles générales pour la préparation des dessins d’encombrement
des dispositifs à semiconducteurs à montage en surface – Méthodes de mesure
pour les boîtiers plats quadrangulaires (QFP)

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IEC 60191-6-3 ®
Edition 1.0 2000-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –

Part 6-3: General rules for the preparation of outline drawings of surface

mounted semiconductor device packages – Measuring methods for package

dimensions of quad flat packs (QFP)

Normalisation mécanique des dispositifs à semiconducteurs –

Partie 6-3: Règles générales pour la préparation des dessins d’encombrement

des dispositifs à semiconducteurs à montage en surface – Méthodes de mesure

pour les boîtiers plats quadrangulaires (QFP)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX Q
ICS 31.080.01 ISBN 978-2-83220-591-4

– 2 – 60191-6-3  IEC:2000
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-3: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Measuring methods for package dimensions of quad flat packs (QFP)

FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-3 has been prepared by subcommittee 47D: Mechanical
standardization of semiconductor devices, of IEC technical committee 47: Semiconductor
devices.
This bilingual version (2013-01) corresponds to the monolingual English version, published in
2000-09.
The text of this standard is based on the following documents:
FDIS Report on voting
47D/370/FDIS 47D/388/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.

60191-6-3  IEC:2000 – 3 –
The committee has decided that the contents of this publication will remain unchanged until
2003. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
– 4 – 60191-6-3  IEC:2000
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-3: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Measuring methods for package dimensions of quad flat packs (QFP)

1 Scope
This part of IEC 60191 stipulates a method for quad flat packs (QFP) measuring dimensions
which are classified into Form E.
2 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of this part of IEC 60191. For dated references, subsequent
amendments to, or revisions of, any of these publications do not apply. However, parties to
agreements based on this part of IEC 60191 are encouraged to investigate the possibility of
applying the most recent editions of the normative documents indicated below. For undated
references, the latest edition of the normative document referred to applies. Members of IEC
and ISO maintain registers of currently valid International Standards.
IEC 60191-6:1990, Mechanical standardization of semiconductor devices – Part 6: General
rules for the preparation of outline drawings of surface mounted semiconductor device
packages
3 Definitions
For the purpose of this part of IEC 60191, the definitions of IEC 60191-6 apply.
4 Measuring methods
4.1 The measuring methods described in this standard are for dimension values
guaranteed to users on the basis of the following items.
a) In general, measuring the dimensions shall be made with the semiconductor packages
mounted on printed circuit-board as the guarantee is made to user.
b) In general, measurement may be made either by hand or automatically.
c) If a specified dimension is difficult to measure, the best alternative measuring method is
defined as the formal measuring method.
d) The dimensions that cannot be measured unless the package is destroyed may be
calculated from other dimensions or replaced by representative values.

60191-6-3  IEC:2000 – 5 –
4.2 Reference characters and drawing
HD
D
D HD
/2 /2
B
A
X4
n
t S AB
1 2
X4
e
S AB
f
Z D
b
x S AB
S
y
S
IEC  1671/2000
Figure 1
A
1 A2
A
/2 /2
HE
E
E
HE
– 6 – 60191-6-3  IEC:2000
Seating plane
Lp
L1
b
b1
IEC  1672/2000
Figure 2
θ
c
A3
c1
c
60191-6-3  IEC:2000 – 7 –
4.3 Datum
The datum shall be defined as follows.
B
|90 - β|
= γ
β
A
x S AB
S
IEC  1673/2000
Figure 3
Centres of opposite sides of a package, which are defined below, shall be connected
together. An angle β subtended by the two crossing lines shall be obtained.
A difference |90° - β| of the angle β from 90° shall be equally distributed to the sides to obtain
rectangular axes. The rectangular axes are depicted as datum lines A and B of the package.
Description of the centres of sides

Even number of leads on a package side Odd number of leads on a package side
IEC  1674/2000 IEC  1675/2000

A centre of facing sides of adjacent leads The centre of leads at a position 0,1 mm
at a position 0,1 mm inside the top of the leads inside the top of the leads
Figure 4
0.1
0,1
0,1
– 8 – 60191-6-3 © IEC:2000
4.4 Overall width HE / overall length HD / Package width D / package length E
4.4.1 Description
a) As to the overall width and overall length, all lead tops should be located within the range t
centring on the position which is at a theoretically correct distance of HE/2 or HD/2 from
the datum A or B.
b) As to the package width and length, the package end-face should be located within the
range f centring on the position which is at a theoretically correct distance of E/2 or D/2
from the datum A or B.
HD
D
H
D D
/2 /2
B
A
X4
tSAB
X4
f SAB
S
IEC  1676/2000
Figure 5
60191-6-3 © IEC:2000 – 9 –
HD /2, HE /2
D E
/2, /2
A
t
f
B
IEC  1677/2000
Figure 6
4.4.2 Measuring method
a) HE/HD
1) Put the package on the surface plate to establish the datum reference S.
2) Make the datum A and B coincide with the measuring reference.
3) Find the logically precise distances HD/2 and HE/2 from the datum A and B.
Then check if the tip of every lead on each package side is within the tolerance t
(range) specified as the centre.
b) E/D
1) Put the package on the surface plate to establish the datum reference S.
2) Make the datum A and B coincide with the measuring reference.
3) Find the theoretically precise distances D/2 and E/2 from the datum A and B.
Then check if the package edge on each package side is within the tolerance f (range)
specified as the centre.
4.5 Mounting height A
4.5.1 Description
Let the height of a package from the seating plane to the top of the package be denoted as
the mounting height. The mounting height therefore includes inclination and warping of the
package.
– 10 – 60191-6-3  IEC:200
...