IEC 60191-6-10:2003

IEC 60191-6-10 ®
Edition 1.0 2003-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6-10: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Dimensions of P-VSON

Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-10: Règles générales pour la préparation des dessins d'encombrement
des dispositifs à semiconducteurs pour montage en surface – Dimensions des
boîtiers P-VSON
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IEC 60191-6-10 ®
Edition 1.0 2003-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –

Part 6-10: General rules for the preparation of outline drawings of surface

mounted semiconductor device packages – Dimensions of P-VSON

Normalisation mécanique des dispositifs à semiconducteurs –

Partie 6-10: Règles générales pour la préparation des dessins d'encombrement

des dispositifs à semiconducteurs pour montage en surface – Dimensions des

boîtiers P-VSON
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
M
CODE PRIX
ICS 31.080.01 ISBN 978-2-83220-520-4

– 2 – 60191-6-10  IEC:2003
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
MECHANICAL STANDARDIZATION
OF SEMICONDUCTOR DEVICES –
Part 6-10: General rules for the preparation of outline drawings of
surface mounted semiconductor device packages –
Dimensions of P-VSON
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-10 has been prepared by subcommittee 47D: Mechanical
standardization of semiconductor devices, of IEC technical committee 47: Semiconductor
devices.
This bilingual version (2012-12) corresponds to the monolingual English version, published in
2003-11.
The text of this standard is based on the following documents:
FDIS Report on voting
47D/551/FDIS 47D565/RVD
Full information on the voting for the approval of this standard can be found in the report on voting
indicated in the above table.
The French version of this standard has not been voted upon.

60191-6-10  IEC:2003 – 3 –
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until 2005.
At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
– 4 – 60191-6-10  IEC:2003
MECHANICAL STANDARDIZATION
OF SEMICONDUCTOR DEVICES –
Part 6-10: General rules for the preparation of outline drawings of
surface mounted semiconductor device packages –
Dimensions of P-VSON
1 Scope
This part of IEC 60191 provides the common outline drawings and dimensions for all types of
structures and composed materials of plastic very thin small outline non-lead package
(hereinafter called P-VSON).
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of the
referenced document (including any amendments) applies.
IEC 60191(all parts), Mechanical standardization of semiconductor devices
ISO/DIS 2692: Geometrical Product Specification (GPS) – Geometrical tolerancing – Maximum
material requirement (MMR) and least material requirement (LMR)
3 Terms and definitions
For the purposes of this document, the following definition, as well as those given in other parts
of the IEC 60191 series, apply.
3.1
P-VSON
plastic very thin-profile small outline, flat package with no leads
NOTE The package leads (terminals) are on opposite sides of the bottom of the package body and do not extend
beyond the package body.
60191-6-10 © IEC:2003 – 5 –
Drawing of Plastic non-lead packages with two parallel rows of terminals

GENERAL RULES
P-VSON Date: 2003
– 6 – 60191-6-10  IEC:2003
Drawing of Plastic non-lead packages with two parallel rows of terminals

GENERAL RULES
P-VSON Date: 2003
c
c
60191-6-10  IEC:2003 – 7 –
Drawing of Plastic non-lead packages with two parallel rows of terminals

GENERAL RULES
P-VSON Date: 2003
– 8 – 60191-6-10  IEC:2003
Table 1 – Dimensions to be specified for Group 1
Group 1 – Group 1 includes dimensions and numerals associated with mounting of packages and
different kinds of packages. The dimensions and numerals belonging to the group mean values is
guaranteed to users and imply that mechanical compatibility of mounting of packages can be recognized.
Limits to be observed Recommended values for the dimension
Name Ref. Note
mm
Min. Nom. Max.
– –
Standard n X See Table 3 9
number of
terminals
– –
Seated A X A = 1,0
max
height
–
Stand-off A X X 7
A    A
1 min. 1 max.
height
0,00     0,05
– –
Body height A X A = 0,75
2 2 nom.
–
Terminal b X X 7
e     b   b
min. max.
width plated
1,25   0,55   0,70
1,00   0,55   0,70
0,80   0,35   0,50
0,65   0,30   0,45
0,50   0,25   0,40
0,40   0,15   0,25
–
Terminal c X X
c    c
min. max.
thickness
0,09    0,25
plated
Package D X X X From 7,00 to 26,00 increment 1,00
length D = D + 0,20
max. nom.
D = D – 0,20
min. nom.
Package E X X X E From 5,00 to 13,00 increment 1,00
nom.
width E = E + 0,20
max. nom.
E = E – 0,20
min. nom.
*
– –
Terminal X( ) 4
e e =1,25;1,00; 0,80; 0,65; 0,50; 0,40
nom.
pitch
Overall H X X X H = E + 2L
E E 1 nom.
width
60191-6-10  IEC:2003 – 9 –
Table 1 (continued)
Limits to be observed
Recommended values for the dimension
Name Ref. Note
Min. Nom. Max.
mm
–
Length of L X X
e     L   L
min. max.
solder part
1,25   0,70   1,30
1,00   0,70   1,20
0,80   0,50   0,90
0,65   0,40   0,80
0,50   0,35   0,75
0,40   0,35   0,75
– –
Terminal x X X = 0,05 3
max.
position
tolerance
– –
Coplanarity y X y = 0,05 5
max.
– –
Flatness y X y = 0,10
1 1 max.
.
– 10 – 60191-6-10  IEC:2003
Table 2 – Dimensions to be specified for Group 2
Group 2 – Group 2 includes dimensions that do not belong to Group 1, but are associated with fabrication
of packages and dimensions of terminal position areas. The group is to achieve its own original purpose
as an industry standard. The group belongs to the dimensions and numerals of external shapes of
packages useful for designers and manufacturers and the dimensio
...