IEC 62779-1:2016

IEC 62779-1 ®
Edition 1.0 2016-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Semiconductor interface for human body
communication –
Part 1: General requirements
Dispositifs à semiconducteurs – Interface à semiconducteurs pour les
communications via le corps humain –
Partie 1: Exigences générales
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé Fax: +41 22 919 03 00
CH-1211 Geneva 20 info@iec.ch
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing 20 000 terms and definitions in
Technical Specifications, Technical Reports and other English and French, with equivalent terms in 15 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.

IEC publications search - www.iec.ch/searchpub IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a 65 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and

CISPR.
IEC Just Published - webstore.iec.ch/justpublished

Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: csc@iec.ch.
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Catalogue IEC - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
Application autonome pour consulter tous les renseignements
Le premier dictionnaire en ligne de termes électroniques et
bibliographiques sur les Normes internationales,
électriques. Il contient 20 000 termes et définitions en anglais
Spécifications techniques, Rapports techniques et autres
et en français, ainsi que les termes équivalents dans 15
documents de l'IEC. Disponible pour PC, Mac OS, tablettes
langues additionnelles. Egalement appelé Vocabulaire
Android et iPad.
Electrotechnique International (IEV) en ligne.

Recherche de publications IEC - www.iec.ch/searchpub
Glossaire IEC - std.iec.ch/glossary
La recherche avancée permet de trouver des publications IEC 65 000 entrées terminologiques électrotechniques, en anglais
en utilisant différents critères (numéro de référence, texte, et en français, extraites des articles Termes et Définitions des
comité d’études,…). Elle donne aussi des informations sur les publications IEC parues depuis 2002. Plus certaines entrées
projets et les publications remplacées ou retirées. antérieures extraites des publications des CE 37, 77, 86 et

CISPR de l'IEC.
IEC Just Published - webstore.iec.ch/justpublished

Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications IEC. Just
Published détaille les nouvelles publications parues. Si vous désirez nous donner des commentaires sur cette
Disponible en ligne et aussi une fois par mois par email. publication ou si vous avez des questions contactez-nous:
csc@iec.ch.
IEC 62779-1 ®
Edition 1.0 2016-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Semiconductor interface for human body

communication –
Part 1: General requirements
Dispositifs à semiconducteurs – Interface à semiconducteurs pour les

communications via le corps humain –

Partie 1: Exigences générales
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-3176-0

– 2 – IEC 62779-1:2016 © IEC 2016
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references. 6
3 Terms, definitions and letter symbols . 6
3.1 General terms . 6
3.2 Rating and characteristics . 7
3.2.1 Input characteristics . 7
3.2.2 Transfer characteristics . 7
3.3 Letter symbols . 9
4 General requirements for HBC semiconductor interface . 9
4.1 General specifications . 9
4.1.1 General . 9
4.1.2 Function . 9
4.1.3 Implementation types . 10
4.2 Constructional specifications . 10
4.3 Electrical specifications . 11
4.3.1 General . 11
4.3.2 Power supply characteristics . 11
4.3.3 Power supply type . 11
4.3.4 Dynamic characteristics of analog front end . 11
4.3.5 CDR circuit interface . 11
4.3.6 Modem interface . 12
4.3.7 Limiting values . 12
4.3.8 Temperatures . 12
4.4 Operating specifications . 12
4.4.1 Application . 12
4.4.2 Grounding condition . 13
4.4.3 Contact condition . 13
Annex A (informative) General description of HBC . 14
Annex B (informative) Generation of powerline noise signal in HBC . 15
Annex C (informative) Calculation of sensitivity level . 16
Bibliography . 17

Figure 1 – Definition of cut-off frequency and bandwidth . 8
Figure 2 – Block diagram (example) . 10
Figure A.1 – HBC applications . 14
Figure B.1 – Coupling of electromagnetic fields and the human body . 15

Table 1 – Letter symbols . 9

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR HUMAN BODY COMMUNICATION –

Part 1: General requirements
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62779-1 has been prepared by IEC technical
committee 47:Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47/2267/FDIS 47/2277/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – IEC 62779-1:2016 © IEC 2016
A list of all parts in the IEC 62779 series, published under the general title Semiconductor
devices – Semiconductor interface for human body communication, can be found on the IEC
website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
INTRODUCTION
The IEC 62779 series is composed of three parts as follow:
• IEC 62779-1 defines general requirements of a semiconductor interface for human body
communication. It includes general and functional specifications of the interface.
• IEC 62779-2 defines a measurement method on electrical performances of an electrode
that constructs a semiconductor interface for human body communication.
• IEC 62779-3 defines functional type of a semiconductor interface for human body
communication, and operational conditions of the interface.
IEC 60748-4 gives requirements on interface integrated circuits for semiconductor devices.
Especially, Chapter III, Section 7 in this standard is applied to interface circuits for a
communication network using a general channel, such as wire or wireless. However, a
channel for HBC is the human body whose channel properties, such as signal loss and delay
profile, are different from the general channel, so Chapter III, Section 7 can’t be applied to an
interface for HBC. Furthermore, a standard on a communication protocol for body area
network (BAN) − IEEE 802.15.6, which includes a communication protocol for HBC was
published in 2012. A common interface for HBC should be defined to secure communication
compatibility between various devices that are implemented on/inside the human body or
embedded in peripheral equipments.

___________
To be published.
– 6 – IEC 62779-1:2016 © IEC 2016
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR HUMAN BODY COMMUNICATION –

Part 1: General requirements
1 Scope
This part of IEC 62779 defines general requirements for a semiconductor interface used in
human body communication (HBC). It includes general and functional specifications of the
interface, as well as limiting values and its operating conditions.
NOTE Additional information on HBC is provided in Annex A.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
None.
3 Terms, definitions and letter symbols
For the purposes of this document, the following terms and definitions apply.
3.1 General terms
3.1.1
HBC semiconductor interface
semiconductor interface to process an electrical signal that is transmitted to the human body
or received from the human body while located between the human body and HBC modem;
implemented on/inside the human body and embedded in peripheral equipment
Note 1 to entry: HBC semiconductor interface consists of an electrode and analog front end. The HBC modem
converts data into an electrical signal and sends it to the electrode, or receives an electrical signal from the analog
front end and converts it into data.
Note 2 to entry: This note applies to the French language only.
3.1.2
electrode
physical structure to transmit an electrical signal between an analog front end and the human
body while attached to or located near the human body
Note 1 to entry: An electrode transfers an electrical signal to be transmitted to a non-metallic transmission
channel, the human body. It also transfers an electrical signal received from the human body to the analog front
end.
3.1.3
analog front end
semiconductor integrated circuit to recover original data from a receiving signal transmitted
through the human body
Note 1 to entry: Analog front end includes a powerline noise reduction filter, a signal amplifier, a high-pass filter,
a comparator and a clock and data recovery (CDR) circuit to recover original data transmitted through a non-

metallic transmission channel. Also, it generates control signals to control operations of each component in the
analog front end.
3.1.4
powerline noise reduction filter
circuit component in an analog front end to remove a powerline noise signal included in a
receiving signal by an antenna function of the human body
Note 1 to entry: Additional information on generation of a powerline noise signal is provided in Annex B.
3.1.5
comparator
circuit component in an analog front end to compare two signals and switch its output signal
to indicate which is larger
3.1.6
CDR circuit
circuit component in an analog front end to generate a clock from a receiving signal and align
phase of the receiving signal to the generated clock
3.2 Rating and characteristics
3.2.1 Input characteristics
3.2.1.1
supply voltage
V
S
supply voltage to operate a HBC semiconductor interface
3.2.1.2
normal mode supply current
I
S
total supply current during normal mode of a HBC semiconductor interface
3.2.1.3
disabled mode supply current
I
DISABLED
total supply current during disabled mode of a HBC semiconductor interface
3.2.1.4
input impedance
Z
I
impedance seen by the human body into a HBC semiconductor interface
Note 1 to entry: Input impedance depends on input impedances of a powerline noise reduction filter, signal
amplifier and high-pass filter.
Note 2 to entry: A powerline noise reduction filter removes a high-power noise signal which can saturate the
active components in the interface.
3.2.2 Transfer characteristics
3.2.2.1
sensitivity level
SL
signal’s minimum voltage at an input of a HBC semiconductor interface that is required to
produce a signal having a specified signal-to-noise ratio at an output
Note 1 to entry: Additional information on the sensitivity level is provided in Annex C.
Note 2 to entry: This note applies to the French language only.

– 8 – IEC 62779-1:2016 © IEC 2016
3.2.2.2
dynamic range
DR
ratio of a signal’s maximum voltage at an input of a HBC semiconductor interface that can be
tolerated without signal distortion to a minimum that is required to have a specific signal-to-
noise ratio at an output
Note 1 to entry: Dynamic range depends on a minimum drive level of a comparator and a signal gain of a signal
amplifier. Additional information on the sensitivity level is provided in Annex C.
Note 2 to entry: This note applies to the French language only.
3.2.2.3
voltage gain
G
V
increasing amount of a signal’s voltage that is gained as passing through a signal amplifier
and a high-pass filter without being attenuated or removed intentionally
3.2.2.4
lower cut-off frequency
f
CUT,LOWER
lower frequency where a receiving signal is attenuated by 3 dB as passing through a high-
pass filter
3.2.2.5
upper cut-off frequency
f
CUT,UPPER
upper frequency where a receiving signal is attenuated by 3 dB as passing through a high-
pass filter
3.2.2.6
bandwidth
BW
frequency range width over which signals having corresponding frequencies pass through a
signal amplifier and a high-pass filter without being attenuated or removed intentionally (see
Figure 1)
SB PB SB
3 dB
BW
f f Frequency
cut, LOWER cut, UPPER
IEC
Key
G SB Stop Band
v
Voltage Gain
PB Pass Band BW Bandwidth
f Upper Cut-off Frequency f Lower Cut-off Frequency
cut.LOWER cut.UPPER
Figure 1 – Definition of cut-off frequency and bandwidth
Note 1 to entry: This note applies to the French language only.
G (unit: V/V)
V
3.2.2.7
lock range
LR
frequency range’s width over which the CDR circuit can be locked
Note 1 to entry: This note applies to the French language only.
3.3 Letter symbols
All the letter symbols related to input and transfer characteristics are summarized in Table 1
below.
Table 1 – Letter symbols
Name and designation Letter symbol
supply voltage V
S
normal mode supply current I
S
disabled mode supply current I
DISABLED
input impedance Z
I
sensitivity level SL
dynamic range DR
G
voltage gain
V
lower cut-off frequency f
CUT,LOWER
upper cut-off frequency f
CUT,UPPER
bandwidth BW
lock range LR
4 General requirements for HBC semiconductor interface
4.1 General specifications
4.1.1 General
General specifications to specify functional and external requirements for HBC semiconductor
interface shall be given.
4.1.2 Function
4.1.2.1 Category
If an interface has a functional or electrical category, it shall be stated.
4.1.2.2 Functional description
A general description of the function performed by the interface shall be given.
4.1.2.3 Block diagram
The overall structure of the interface to realize the function shall be given. Details of the
structure shall be given using a block diagram (see example in Figure 2).

– 10 – IEC 62779-1:2016 © IEC 2016
COM CDRC
RS
Human HBC
body PNRF SA HPF modem
CS
TS
HBC interface
IEC
Key
PNRF Powerline Noise Reduction Filter SA Signal Amplifier
HPF High Pass Filter COM Comparator
CDRC Clock and Data Recovery Circuit CS Control Signal
RS Receiving Signal TS Transmitting Signal

NOTE 1 The powerline noise reduction filter can be removed if the noise signal does not have enough high power
to saturate the active components in the interface.
NOTE 2 The order of the components in the interface can be changed if necessary, as long as the interface
satisfies the required performances.
Figure 2 – Block diagram (example)
If applicable, control signals that are transmitted between the interface and a HBC modem
shall be defined in the block diagram.
4.1.3 Implementation types
4.1.3.1 Manufacturing and assembling technology
The manufacturing technologies for an electrode, for example metallic pattern, thin film, etc.,
and an analog front end, for example semiconductor monolithic integrated circuit, thin-film
integrated circuit, hybrid integrated circuit, module, etc, shall be stated. Details of the
semiconductor technologies shall be included.
An assembling technology between an electrode and an analog front end, for example
modularization, integration, shall be stated.
4.1.3.2 Package technology
The package type, for example ceramic, plastic or glass, shall be given.
If applicable, the IEC and/or national reference number of the outline drawing shall be stated.
4.2 Constructional specifications
The physical specifications of an electrode, for example material, dimensions, location, shall
be given.
Electrode
4.3 Electrical specifications
4.3.1 General
The electrical specifications should be given over the specified range of an operating
temperature.
4.3.2 Power supply characteristics
The following characteristics shall be given.
a) supply voltage;
b) normal mode supply current;
c) disabled mode supply current.
4.3.3 Power supply type
A type of power supply, for example an outlet or battery, shall be given.
4.3.4 Dynamic characteristics of analog front end
4.3.4.1 Powerline noise reduction filter, signal amplifier and high-pass filter
The following characteristics shall be given with respect to the corresponding component in a
powerline noise reduction filter, signal amplifier and high-pass filter.
a) input impedance at a powerline noise reduction filter;
b) sensitivity level;
c) dynamic range;
d) maximum voltage gain over a pass band;
e) minimum voltage gain over a pass band;
f) decrease rate of voltage gain over a stop band;
g) bandwidth;
h) cut-off frequency.
NOTE The powerline noise reduction filter removes a high-power noise signal which can saturate the active
components in the interface. The noise signal has the highest power usually at a powerline frequency, but if it has
the highest power at a different frequency, the noise reduction filter is replaced with the one able to remove the
corresponding noise signal.
4.3.4.2 Comparator and CDR circuit
The following characteristics shall be given with respect to the corresponding component in a
comparator and CDR circuit.
a) minimum input voltage;
b) hysteresis voltage;
c) switching threshold voltage;
d) lock range.
4.3.5 CDR circuit interface
The specifications for the input signal of a CDR circuit, for example a line code type and logic
level, shall be given.
– 12 – IEC 62779-1:2016 © IEC 2016
4.3.6 Modem interface
4.3.6.1 Data
The specifications for a data signal that are exchanged between a HBC modem and an
interface shall be given.
4.3.6.2 Clock
The specifications for a clock signal used for synchronization shall be given.
4.3.6.3 Enabling signal
The specifications for an enabling signal to enable a HBC interface shall be given.
4.3.7 Limiting values
4.3.7.1 Details to be stated
– Any dependency between the limiting values shall be specified.
– If externally connected and/or attached elements have an influence on the limiting values,
the elements and their conditions shall be specified.
– If the limiting values are exceeded for transient overload, the permissible excesses and
their durations shall be specified.
– All voltages are referenced to a specific reference terminal.
– The limiting values given shall cover an interface’s operation over the specified range of
operating temperature. If the limiting values are dependent on temperature, the
dependency shall be given.
4.3.7.2 Electrical limiting values
Limiting values of the following items shall be given:
a) supply voltage;
b) supply current – normal mode;
c) supply power;
d) input voltage at an electrode.
4.3.8 Temperatures
The following temperatures shall be given:
a) operating temperature;
b) storage temperature.
4.4 Operating specifications
4.4.1 Application
4.4.1.1 Main application
The main application shall be stated, for example file transfer, real-time audio streaming and
video download.
If there is any restriction in applications, it shall be stated.

4.4.1.2 Compatibility
A communication standard, for example IEEE 802.15.6 standard, that is compatible to this
interface standard shall be stated. Details of the standard including its communication
protocol shall be given.
4.4.2 Grounding condition
A grounding condition of an interface, for example earth or floating grounding, shall be given.
4.4.3 Contact condition
A contact condition for an electrode, for example contact or non-contact (proximity), shall be
given.
– 14 – IEC 62779-1:2016 © IEC 2016
Annex A
(informative)
General description of HBC
In human body communication (HBC), the body of a user is used to transmit data from one
device to another, and devices can thereby communicate without a wire or wireless
technology. An electrical signal including data is transmitted through the body, so the user
simply touches the devices, and then the devices are connected to each other via touch-and-
play (TAP) technology as shown in Figure A.1.
Photo
Display photo
MPEG
Play MPEG
Documents
Display documents
Touch and Play !!
IEC
Figure A.1 – HBC applications
HBC technology is very suitable for providing a context awareness service based on TAP.
After devices are connected by touch, identification signals are transmitted through the user’s
body, so that the type of the devices is recognized by each other. A service to be provided for
the pair of the devices is determined according to the predefined context table, and then the
determined service is provided while data is transmitted through the user’s body. Various
services which can be provided for other pairs of the devices are defined in the context table,
so that a corresponding service between recognized devices can be automatically provided
without the user’s intervention. For example, when a user touches an advertisement device
with one hand while holding a PDA in the other hand, the touch is detected by the
advertisement device and the device sends information about the advertisement through the
user’s body, so the information can be downloaded into the PDA. Data communication
between multiple devices, such as body sensor network, is also possible using HBC
technology while those devices are being in contact with body. One of the devices defined as
the master device controls data transmission between other devices defined as slave devices,
so the user’s body can be shared by the multiple devices for the data communication.
A HBC interface is defined as the connection part that inputs a data signal to the human body
or outputs from the human body, while being located between a device and the human body.
An electrical signal including data passes through the HBC interface from the user’s device to
the human body, or vice versa. The HBC interface is composed of two parts: an electrode and
an analog front end. The electrode is a small piece of metal or other substance that is used to
transmit the electrical signal to the human body or to receive it from the human body, while
being in contact with the human body. The electrical signal transmitted to the human body is
attenuated and distorted as passing through the human body. The analog front end is the
circuit that restores the transmitted electrical signal from the attenuated and distorted signal.
The structure of the HBC interface varies according to the HBC application. In addition, it can
be implemented in a separable type with the user’s device or an embedded type inside the
device.
Annex B
(informative)
Generation of powerline noise signal in HBC
Electrical systems surrounding the human body radiate noise signals in the form of
electromagnetic fields (EMFs), and the electromagnetic fields are coupled with the human
body as shown in Figure B.1, so the noise signals are induced in the received electrical signal
by HBC. It has been generally accepted that a noise signal from a powerline has the largest
signal power among the noise signals, so a powerline noise reduction filter is required to
maintain a permissible signal-to-noise ratio in a HBC semiconductor interface.
A powerline noise signal usually has a very high signal level, so the powerline noise reduction
filter is comprised of passive components, such as lumped resistors or capacitors, to avoid
saturated operation of the filter. Also, the noise reduction filter is located between the
electrode and the signal amplifier to prevent saturated operation of other circuit components.
EMFs sources
Current induced
by EMFs
EMFs
EMF: Electro-magnetic field
General environment
IEC
Figure B.1 – Coupling of electromagnetic fields and the human body

– 16 – IEC 62779-1:2016 © IEC 2016
Annex C
(informative)
Calculation of sensitivity level
The sensitivity level depends on the minimum drive level of a comparator and the signal gain
of a signal amplifier as follows.
V = V – G (C.1)
sensitivity min. drive level
Here, V is the sensitivity level of a HBC semiconductor interface in dB and
sensitivity
V is the minimum input drive level of the comparator in dB. Also, G is the signal

min. drive level
gain of the signal amplifier in dB.
The sensitivity level should be designed to satisfy Formula (C.2).
V > L + V (C.2)
sensitivity body, max transmitting
Here, L is the maximum signal loss of the human body in dB and V is the
body, max transmitting
signal level of transmitting data in dB.
From the required sensitivity level of Formula (C.1), the signal gain of the signal amplifier and
the minimum input drive level of the comparator should be designed to satisfy Formula (C.1).

Bibliography
IEC 60748-4:1997, Semiconductor devices – Integrated circuits – Part 4: Interface integrated
circuits
IEC 62779 (all parts), Semiconductor devices – Semiconductor interface for human body
communication
IEEE 802.15.6:2012, Standard for Local and Metropolitan area networks – Part 15.6: Wireless
Body Area Networks
_____________
– 18 – IEC 62779-1:2016 © IEC 2016
SOMMAIRE
AVANT-PROPOS . 19
INTRODUCTION . 21
1 Domaine d’application. 22
2 Références normatives . 22
3 Termes, définitions et symboles littéraux . 22
3.1 Termes généraux . 22
3.2 Valeurs assignées et caractéristiques . 23
3.2.1 Caractéristiques d’entrée . 23
3.2.2 Caractéristiques de transfert . 24
3.3 Symboles littéraux . 25
4 Exigences générales pour une interface à semiconducteurs pour les
communications via le corps humain . 26
4.1 Spécifications générales . 26
4.1.1 Généralités . 26
4.1.2 Fonction . 26
4.1.3 Types de mises en œuvre . 27
4.2 Spécifications de construction . 27
4.3 Spécifications électriques . 27
4.3.1 Généralités . 27
4.3.2 Caractéristiques de l’alimentation . 27
4.3.3 Type d’alimentation . 27
4.3.4 Caractéristiques dynamiques de circuit analogique frontal . 27
4.3.5 Interface de circuit de récupération de données et d’horloge . 28
4.3.6 Interface de modem . 28
4.3.7 Valeurs limites . 28
4.3.8 Températures . 29
4.4 Spécifications de fonctionnement . 29
4.4.1 Application . 29
4.4.2 Condition de mise à la terre. 29
4.4.3 Condition de contact . 29
Annexe A (informative) Description générale des communications via le corps humain . 30
Annexe B (informative) Génération de signal de bruit de ligne de courant porteur dans
des communications via le corps humain . 32
Annexe C (informative) Calcul du niveau de sensibilité . 33
Bibliographie . 34

Figure 1 – Définition de la fréquence de coupure et de la largeur de bande . 25
Figure 2 – Schéma de principe (exemple) . 26
Figure A.1 – Applications de communications via le corps humain . 30
Figure B.1 – Couplage des champs électromagnétiques et du corps humain . 32

Tableau 1 – Symboles littéraux . 25

COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
____________
DISPOSITIFS À SEMICONDUCTEURS –
INTERFACE À SEMICONDUCTEURS POUR
LES COMMUNICATIONS VIA LE CORPS HUMAIN –

Partie 1: Exigences générales
AVANT-PROPOS
1) La Commission Électrotechnique Internationale (IEC) est une organisation mondiale de normalisation
composée de l'ensemble des comités électrotechniques nationaux (Comités nationaux de l’IEC). L’IEC a pour
objet de favoriser la coopération internationale pour toutes les questions de normalisation dans les domaines
de l'électricité et de l'électronique. À cet effet, l’IEC – entre autres activités – publie des Normes internationales,
des Spécifications techniques, des Rapports techniques, des Spécifications accessibles au public (PAS) et des
Guides (ci-après dénommés "Publication(s) de l’IEC"). Leur élaboration est confiée à des comités d'études, aux
travaux desquels tout Comité national intéressé par le sujet traité peut participer. Les organisations
internationales, gouvernementales et non gouvernementales, en liaison avec l’IEC, participent également aux
travaux. L’IEC collabore étroitement avec l'Organisation Internationale de Normalisation (ISO), selon des
conditions fixées par accord entre les deux organisations.
2) Les décisions ou accords officiels de l’IEC concernant les questions techniques représentent, dans la mesure
du possible, un accord international sur les sujets étudiés, étant donné que les Comités nationaux de l’IEC
intéressés sont représentés dans chaque comité d’études.
3) Les Publications de l’IEC se présentent sous la forme de recommandations internationales et sont agréées
comme telles par les Comités nationaux de l’IEC. Tous les efforts raisonnables sont entrepris afin que l’IEC
s'assure de l'exactitude du contenu technique de ses publications; l’IEC ne peut pas être tenue responsable de
l'éventuelle mauvaise utilisation ou interprétation qui en est faite par un quelconque utilisateur final.
4) Dans le but d'encourager l'uniformité internationale, les Comités nationaux de l’IEC s'engagent, dans toute la
mesure possible, à appliquer de façon transparente les Publications de l’IEC dans leurs publications nationales
et régionales. Toutes divergences entre toutes Publications de l’IEC et toutes publications nationales ou
régionales correspondantes doivent être indiquées en termes clairs dans ces dernières.
5) L’IEC elle-même ne fournit aucune attestation de conformité. Des organismes de certification indépendants
fournissent des services d'évaluation de conformité et, dans certains secteurs, accèdent aux marques de
conformité de l’IEC. L’IEC n'est responsable d'aucun des services effectués par les organismes de certification
indépendants.
6) Tous les utilisateurs doivent s'assurer qu'ils sont en possession de la dernière édition de cette publication.
7) Aucune responsabilité ne doit être imputée à l’IEC, à ses administrateurs, employés, auxiliaires ou mandataires,
y compris ses experts particuliers et les membres de ses comités d'études et des Comités nationaux de l’IEC,
pour tout préjudice causé en cas de dommages corporels et matériels, ou de tout autre dommage de quelque
nature que ce soit, directe ou indirecte, ou pour su
...