IEC 60191-6-12:2011

IEC 60191-6-12 ®
Edition 2.0 2011-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Mechanical standardization of semiconductor devices –
Part 6-12: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Design guidelines for fine-pitch land
grid array (FLGA)
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-12: Règles générales pour la préparation des dessins d'encombrement
des boîtiers des dispositifs à semiconducteurs à montage en surface – Lignes
directrices de conception pour les boîtiers matriciels à plots et à pas fins (FLGA)

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IEC 60191-6-12 ®
Edition 2.0 2011-06
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Mechanical standardization of semiconductor devices –
Part 6-12: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Design guidelines for fine-pitch land
grid array (FLGA)
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-12: Règles générales pour la préparation des dessins d'encombrement
des boîtiers des dispositifs à semiconducteurs à montage en surface – Lignes
directrices de conception pour les boîtiers matriciels à plots et à pas fins (FLGA)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX R
ICS 31.080.01 ISBN 978-2-88912-527-2

– 2 – 60191-6-12 © IEC:2011
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Terminal position numbering . 6
5 Nominal package dimension . 6
6 Outline drawings and principle dimensions . 7
7 Dimensions . 10

Figure 1 – Flange-type FLGA . 6
Figure 2 – Rectangle-type FLGA . 6
Figure 3 – Flange-type FLGA . 7
Figure 4 – Rectangle-type FLGA . 8
e
Figure 5 – Mechanical gauge drawing . 9
f
Figure 6 – Pattern of terminal position area . 9

Table 1 – Group 1: Dimensions appropriate to mounting and interchangeability . 10
Table 2 – Group 2: Dimensions and tolerances . 14
Table 3 – Combination list of D, E, M , and M – e = 0,80mm pitch . 15
D E
Table 4 – Combination list of D, E, M , and M – e = 0,65 mm pitch . 16
D E
Table 5 – Combination list of D, E, M , and M – e = 0,50 mm pitch . 17
D E
Table 6 – Combination list of D, E, M , and M – e = 0,40 mm pitch . 18
D E
Table 7 – Combination list of D, E, M , and M – e = 0,30 mm pitch . 19
D E
60191-6-12 © IEC:2011 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-12: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guidelines for fine-pitch land grid array (FLGA)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-12 has been prepared by subcommittee 47D: Mechanical
standardization of semiconductor devices, of IEC technical committee 47: Semiconductor
devices.
This second edition of IEC 60191-6-12 cancels and replaces the first edition, published in
2002 and constitutes a technical revision. This edition includes the following significant
changes with respect to the previous edition:
a) scope is expanded so that this standard include the square type FLGA. The title of this
standard has been changed accordingly: “Rectangular type” has been deleted from the
title.
b) ball pitch of 0,3 mm has been added;
c) datum is changed from the body datum to the ball datum;
d) combination lists of D, E, M , and M have been revised.
D E
– 4 – 60191-6-12 © IEC:2011
The text of this standard is based on the following documents:
CDV Report on voting
47D/784/CDV 47D/795/RVC
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 60191 series, under the general title Mechanical
standardization of semiconductor devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
60191-6-12 © IEC:2011 – 5 –
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-12: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guidelines for fine-pitch land grid array (FLGA)

1 Scope
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended
variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or
less.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60191(all parts), Mechanical standardization of semiconductor devices
IEC 60191-6, Mechanical standardization of semiconductor devices – Part 6: General rules for
the preparation of outline drawings of surface mounted semiconductor device packages
3 Terms and definitions
For the purposes of this document, the terms and definitions given IEC 60191 series and the
following apply.
3.1
fine-pitch land grid array
FLGA
package with metal lands on one side of a substrate in a matrix of at least three rows and
three columns on a pitch of 0,8 mm or less, wherein the maximum standoff height is 0,10 mm
or less
NOTE Terminals may be missing from some row-column intersections.
3.2
flange-type FLGA
FLGA with a package outline (length, width) defined by a package flange part, mostly
substrate, extending outward beyond the perimeter of a molded part or of a flip-chip-bonded
part
NOTE Flange-type FLGA, shown in Figure 1, is generally cut by singulation press, thus resulting in larger
dimensional errors than the singulation by dicing saw

– 6 – 60191-6-12 © IEC:2011
IEC  1163/11
Figure 1 – Flange-type FLGA
3.3
rectangle-type FLGA
FLGA with a package outline (length, width) defined by a molded part with no extending
flange part
NOTE Rectangle-type FLGA, shown in Figure 2, is generally cut by dicing, thus resulting in less dimensional
errors than the singulation by press machine.

IEC  1164/11
Figure 2 – Rectangle-type FLGA
4 Terminal position numbering
When a package is viewed from the terminal side with the index corner in the bottom left
corner position, terminal rows are lettered from bottom to top starting with A, then B, C,,,, AA,
AB, etc,, whereas terminal columns are numbered from left to right starting with 1. Terminal
positions are designated by a row-column grid system and shown as alphanumeric
identification, e.g., A1, B1.
The letters I, O, Q, S, X and Z shall not be used for naming the terminal rows.
5 Nominal package dimension
A nominal package dimension is defined as “the package width (E) × length (D)”, which is
expressed in the tenths place in millimeter.

60191-6-12 © IEC:2011 – 7 –
6 Outline drawings and principle dimensions
The FLGA outline is shown in Figures 3 and 4.

E
B
b
Top view
y
S
a
S
y
CZ
Side view
e
D
C
B
A
1 2 3 4
d c
(Z )
E n × ∅b
x M
S A M B M
x
M S
Bottom view
IEC  1165/11
NOTE For footnotes relating to this figure, see Figure 4.
Figure 3 – Flange-type FLGA
(Z )
e
D
D
A
A
A
– 8 – 60191-6-12 © IEC:2011
E
B
b
Top view
y
S
a
S
y
CZ
Side view
e
D
C
B
A
1 2 3 4
d
c
(Z )
E n × ∅b
x M
S A M B M
Bottom view x M S
IEC  1166/11
NOTES relating to Figures 3 and 4:
a
Datum S is defined as the seating plane on which a package free stands by contact of the balls.
b
The hatched zone is an index-marking area, where whole index mark will be basically contained in 1/16 of the
body size, In case it is physically difficult, index mark can extend more than 1/16 but no more than a quarter of
the body size.
c
True positional tolerances of terminals, x and x , are applied to all terminals.
1 2
d
The terminal diameter b is the maximum diameter of individual balls as measured in the plane parallel to the
seating plane.
e
An array of terminal-existence areas with regard to the datum S, A, and B is shown in the mechanical gauge
drawing in Figure 5.
f
The array of terminal-existence areas with regard to the datum S is shown in Figure 6.
Figure 4 – Rectangle-type FLGA
e
(Z )
D
D
A
A
A
60191-6-12 © IEC:2011 – 9 –
E
max
e e
∅b
3 ∅b
IEC  1167/11 IEC  1168/11
NOTE The symbols in this figure are explained in IEC 60191-6.
e f
Figure 5 – Mechanical gauge drawing Figure 6 – Pattern of terminal position area

e
D
max
e
– 10 – 60191-6-12 © IEC:2011
7 Dimensions
Table 1 – Group 1: Dimensions appropriate to mounting and interchangeability
Dimensions in millimeters
Term Symbol Specification Recommended
value
Package E x D A package nominal dimension is defined as “the package width (E) x
-
nominal length (D), which is expressed in the tenths place in millimeter.
dimension
-
(1) Range of D : from 1,5 to 21,0
nom
(2) Interval of D
nom
For square FLGA with D ≥ 15,0, D is an integer.
nom nom
For other FLGA, the number in the tenths place of D is either 0 or
nom
5.
(3) Tolerance of D
For Flange-type:
Package length D
When D ≤ 21,0, v = ±0,15
nom D
When D > 21,0, v = ±0,20
nom D
where v denotes a tolerance.
D
For Rectangle-type:
When D ≤12,0, v = ±0,08
nom D
When 12,0 < D ≤ 21,0, v = ±0,10
nom D
When D > 21,0, v = ±0,15
nom D
where v denotes a tolerance.
D
60191-6-12 © IEC:2011 – 11 –
Table 1 (continued)
Dimensions in millimeters
Term Symbol Specification Recommended
value
(1) Range of E : from 1,5 to 21,0
nom
(2) Interval of E
nom
For square FLGA with E ≥ 15,0, E is an integer.
nom nom
For other FLGA, the number in the tenths place of E is either 0 or
nom
5.
(3) Tolerance of “E”
For flange-type:
Package width E
-
When E ≤ 21,0, v = ±0,15
nom E
When E > 21,0, v = ±0,20
nom E
where v denotes a tolerance.
E
For rectangle-type:
When E ≤12,0, v = ±0,08
nom E
When 12,0 < E ≤ 21,0, v = ±0,10
nom E
When E > 21,0, v = ±0,15
nom E
where v denotes a tolerance.
E
A = 0,30
0,40
0,50
0,65
0,80
Maximum
A
-
profile height
1,00
1,20
1,70
2,00
“A” includes heat slug thickness, package warpage, and tilt errors.
Stand-off A max ≤ 0,10
A
1 -
height
e = 0,80
0,65
Terminal grid
0,50
e -
pitch
0,40
0,30
– 12 – 60191-6-12 © IEC:2011
Table 1 (continued)
Dimensions in millimeters
Term Symbol Specification Recommended
value
For C-FLGA:
e
min.  nom.  max.
0,80  0,45  0,50  0,55
0,65  0,35  0,40  0,45
0,50  0,25  0,30  0,35
0,40  0,20  0,25  0,30
Terminal
For P-FLGA and T-FLGA
b
diameter
e
min.  nom. max.
0,80  0,35  0,40  0,45
0,65  0,30  0,35  0,40
0,50  0,20  0,25  0,30
0,40  0,15  0,20  0,25
0,30  0,12  0,15  0,18
For flange-type:
e    x
0,80   0,20
0,65   0,20
Datum-
0,50   0,20
based
positional x
1 0,40   0,15 -
tolerance of
terminals
0,30   0,15
For rectangle-type:
x is 0,15, irrespective of e.
60191-6-12 © IEC:2011 – 13 –
Table 1 (continued)
Dimensions in millimeters
Term Symbol Specification Recommended
value
e    x
0,80   0,08
Relative
positional
0,65   0,08
x
-
tolerance of
0,50   0,05
terminals
0,40   0,05
0,30   0,03
e    y
0,80   0,10
0,65   0,10
Coplanarity y
-
0,50   0,08
0,40   0,08
0,30   0,05
Parallelism
of the top y
y = 0,20 -
surface
n = M  x M
max E D
Number of
n
(M -1) x M
terminals E D
M  x (M -1)
E D
(M -1) x (M -1)
E D
(M +1) x M
E D
Maximum
matrix size in M
D    M  x (M +1)
E D
length
(M +1) x (M +1)
E D
-
M ≤( D - b – v -X - x - 2u)/ e+1
D nom max D 1 2
M ≤( E - b – v - x - x - 2u)/ e+1
E nom max E 1 2
Maximum
u = 0,11
matrix size in M
E
width
Numbers of matrices in M and M are shown in Table 3.
E D
“u” denotes edge clearance.
– 14 – 60191-6-12 © IEC:2011
Table 2 – Group 2: Dimensions and tolerances
Dimensions in millimeters
Term Symbol Specification Recommended
value
Overhang
(Z ) = {D - (M - 1) x e } /2
D nom D
dimension in (Z ) -
D
(Z ) is a reference value.
D
length
Overhang
(Z ) = {E - (M - 1) x e } /2
E nom E
dimension in (Z ) -
E
(Z ) is a reference value.
E
width
Datum- defined
terminal- b b = b + x -
3 3 max 1
existence area
Relative
terminal- b b = b + x -
4 4 max 2
existence area
60191-6-12 © IEC:2011 – 15 –
Table 3 – Combination list of D, E, M , and M – e = 0,80mm pitch
D E
D or E
nom nom
M or M M -1 or M -1 M +1 or M +1
Square body Rectangular body
D E D E D E
（D = E ） （D ≠ E ）
nom nom nom nom
1,5 1,5 - - 2
2,0 2,0
2 - 3
2,5 2,5
3,0 3,0
3 2 4
3,5 3,5
4,0 4,0 4 3 5
4,5 4,5
5 4 6
5,0 5,0
5,5 5,5 6 5 7
6,0 6,0
7 6 8
6,5 6,5
7,0 7,0
8 7 9
7,5 7,5
8,0 8,0 9 8 10
8,5 8,5
10 9 11
9,0 9,0
9,5 9,5 11 10 12
10,0 10,0
12 11 13
10,5 10,5
11,0 11,0
13 12 14
11,5 11,5
12,0 12,0 14 13 15
12,5 12,5
15 14 16
13,0 13,0
13,5 13,5 16 15 17
14,0 14,0
17 16 18
14,5 14,5
15,0 15,0
18 17 19
－ 15,5
16,0 16,0 19 18 20
－ 16,5
20 19 21
17,0 17,0
－ 17,5 21 20 22
18,0 18,0
22 21 23
－ 18,5
19,0 19,0
23 22 24
－ 19,5
20,0 20,0 24 23 25
－ 20,5
25 24 26
21,0 21,0
– 16 – 60191-6-12 © IEC:2011
Table 4 – Combination list of D, E, M , and M – e = 0,65 mm pitch
D E
D or E
nom nom
M or M M -1 or M -1 M +1 or M +1
Square body Rectangular body
D E D E D E
（D = E ） （D ≠ E ）
nom nom nom nom
1,5 1,5 - - 2
2,0 2,0 2 - 3
2,5 2,5
3 2 4
3,0 3,0
3,5 3,5 4 3 5
4,0 4,0 5 4 6
4,5 4,5 6 5 7
5,0 5,0
7 6 8
5,5 5,5
6,0 6,0 8 7 9
6,5 6,5 9 8 10
7,0 7,0
10 9 11
7,5 7,5
8,0 8,0 11 10 12
8,5 8,5 12 11 13
9,0 9,0
13 12 14
9,5 9,5
10,0 10,0 14 13 15
10,5 10,5 15 14 16
11,0 11,0 16 15 17
11,5 11,5
17 16 18
12,0 12,0
12,5 12,5 18 17 19
13,0 13,0 19 18 20
13,5 13,5
20 19 21
14,0 14,0
14,5 14,5 21 20 22
15,0 15,0 22 21 23
15,5
16,0 23 22 24
16,0
－ 16,5 24 23 25
17,0 17,0 25 24 26
－ 17,5 26 25 27
18,0
18,0 27 26 28
18,5
19,0 19,0 28 27 29
－ 19,5 29 28 30
20,0
20,0 30 29 31
20,5
21,0 21,0 31 30 32
60191-6-12 © IEC:2011 – 17 –
Table 5 – Combination list of D, E, M , and M – e = 0,50 mm pitch
D E
D or E
nom nom
M or M M -1 or M -1 M +1 or M +1
Square body Rectangular body
D E D E D E
(D = E ） （D ≠ E ）
nom nom nom nom
1,0 1,0 - - 2
1,5 1,5 2 - 3
2,0 2,0 3 2 4
2,5 2,5 4 3 5
3,0 3,0 5 4 6
3,5 3,5 6 5 7
4,0 4,0 7 6 8
4,5 4,5 8 7 9
5,0 5,0 9 8 10
5,5 5,5 10 9 11
6,0 6,0 11 10 12
6,5 6,5 12 11 13
7,0 7,0 13 12 14
7,5 7,5 14 13 15
8,0 8,0 15 14 16
8,5 8,5 16 15 17
9,0 9,0 17 16 18
9,5 9,5 18 17 19
10,0 10,0 19 18 20
10,5 10,5 20 19 21
11,0 11,0 21 20 22
11,5 11,5 22 21 23
12,0 12,0 23 22 24
12,5 12,5 24 23 25
13,0 13,0 25 24 26
13,5 13,5 26 25 27
14,0 14,0 27 26 28
14,5 14,5 28 27 29
15,0 15,0 29 28 30
－ 15,5 30 29 31
16,0 16,0 31 30 32
－ 16,5 32 31 33
17,0 17,0 33 32 34
－ 17,5 34 33 35
18,0 18,0 35 34 36
－ 18,5 36 35 37
19,0 19,0 37 36 38
－ 19,5 38 37 39
20,0 20,0 39 38 40
－ 20,5 40 39 41
21,0 21,0 41 40 42
– 18 – 60191-6-12 © IEC:2011
Table 6 – Combination list of D, E, M , and M –
...