Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Design guide: Method for determination of forced air-cooling structure

IEC/TS 62610-2:2011 provides for compatible methods of forced air cooled cabinets assembled with associated subracks and/or chassis in accordance with IEC 60297 and IEC 60917 series. This design guide contains the following: Thermal interfaces of subrack and/or chassis based equipment in a cabinet; reference temperature; preferred airflow conditions; airflow volume conditions and standard air. Also included are procedures for determining compatible forced airflow conditions in a cabinet by applying typical thermal interface conditions. The drawings used are not intended to indicate product design. They are explanatory indications for determining forced air-cooling structure. The terminology used complies with IEC 60917-1.

Structures mécaniques pour équipments électroniques - Gestion thermique pour les armoires conformes aux séries CEI 60297 et CEI 60917 - Partie 2: Guide de conception: Méthode pour la détermination de la structure de refroidissement par ventilation forcée

La CEI/TS 62610-2:2011 fournit des méthodes compatibles destinées aux armoires à refroidissement par ventilation forcée assemblées contenant des bacs à cartes et/ou des châssis associés conformes aux séries de normes CEI 60297 et CEI 60917. Le présent guide de conception contient ce qui suit: Interfaces thermiques d'équipements constitués de bacs à cartes et/ou de châssis à l'intérieur d'une armoire; température de référence; conditions préférentielles de circulation d'air; conditions de volume de circulation d'air; air normal. Également inclus sont des procédures pour déterminer les conditions de circulation d'air forcée compatibles à l'intérieur d'une armoire en appliquant les conditions d'interface thermique types. Les dessins utilisés ne sont pas destinés à indiquer la conception des produits. Ils n'ont qu'une vocation explicative pour la détermination de la structure de refroidissement par ventilation forcée. La terminologie utilisée est conforme à la CEI 60917-1.

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Status
Published
Publication Date
25-Jul-2011
Current Stage
DELPUB - Deleted Publication
Completion Date
16-May-2018
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IEC TS 62610-2:2011 - Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Design guide: Method for determination of forced air-cooling structure Released:7/26/2011
English and French language
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IEC/TS 62610-2 ®
Edition 1.0 2011-07
TECHNICAL
SPECIFICATION
SPÉCIFICATION
TECHNIQUE
Mechanical structures for electronic equipment – Thermal management for
cabinets in accordance with IEC 60297 and IEC 60917 series –
Part 2: Design guide: Method for the determination of forced air-cooling
structure
Structures mécaniques pour équipements électroniques – Gestion thermique
pour les armoires conformes aux séries CEI 60297 et CEI 60917 –
Partie 2: Guide de conception: Méthode pour la détermination de la structure
de refroidissement par ventilation forcée

IEC/TS 62610-2:2011
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IEC/TS 62610-2 ®
Edition 1.0 2011-07
TECHNICAL
SPECIFICATION
SPÉCIFICATION
TECHNIQUE
Mechanical structures for electronic equipment – Thermal management for
cabinets in accordance with IEC 60297 and IEC 60917 series –
Part 2: Design guide: Method for the determination of forced air-cooling
structure
Structures mécaniques pour équipements électroniques – Gestion thermique
pour les armoires conformes aux séries CEI 60297 et CEI 60917 –
Partie 2: Guide de conception: Méthode pour la détermination de la structure
de refroidissement par ventilation forcée

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX Q
ICS 31.240 ISBN 978-2-88912-588-3

– 2 – TS 62610-2  IEC:2011
CONTENTS
FOREWORD . 3

INTRODUCTION . 5

1 Scope and object . 6

2 Thermal interfaces . 6

2.1 Baseline thermal conditions . 6

2.2 Reference temperature . 6

2.3 Syntax of surfaces of a generic subrack, chassis or cabinet . 7

2.4 Preferred airflow conditions . 8
2.5 Cabinet airflow volume and temperature rise management . 9
3 Forced air thermal flow chart for cabinet equipment . 10
3.1 General . 10
3.2 Evaluation of the actual thermal performance of subrack or chassis . 11
3.3 Cabinet airflow considerations . 11
3.4 Arrangement of subracks and/or chassis equipment within the cabinet . 11
3.5 Selection of cabinet mounted forced air device(s) . 12
3.6 Thermal operating environment . 12
Annex A (informative) Limitation of application and background information . 14
Bibliography . 16

Figure 1 – Syntax of surfaces of a forced air cooled generic subrack or chassis to be
mounted into a cabinet . 7
Figure 2 – Syntax of surfaces of a forced air cooled generic cabinet . 7
Figure 3 – Preferred air flow patterns . 9
Figure 4 – Air flow volume management . 10
Figure 5 – Forced air thermal flow chart for cabinet equipment . 11
Figure 6 – Thermal operating environment (Cabinet sectional side view) . 12
Figure 7 – Example of effect of reference temperature on cabinet operating
temperature range . 13
Figure A.1 – Thermal network model for a plug-in unit in subrack or chassis . 15

Table 1 – Preferred airflow pattern . 8

TS 62610-2  IEC:2011 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT –

THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE

WITH IEC 60297 AND IEC 60917 SERIES –

Part 2: Design guide: Method for the determination

of forced air-cooling structure

FOREWORD
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• the required support cannot be obtained for the publication of an International Standard,
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• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC 62610-2 TS Ed.1.0, which is a technical specification, has been prepared by
subcommittee 48D: Mechanical structures for electronic equipment, of IEC technical

– 4 – TS 62610-2  IEC:2011
committee 48: Electromechanical components and mechanical structures for electronic

equipment.
The text of this technical specification is based on the following documents:

Enquiry draft Report on voting

48D/459/DTS 48D/470/RVC
Full information on the voting for the approval of this technical specification can be found in

the report on voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of IEC 62610 series, under the general title Mechanical structures for
electronic equipment – Thermal management for cabinets in accordance with IEC 60297 and
IEC 60917 series, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicate
...

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