IEC 60191-6-8:2001

IEC 60191-6-8 ®
Edition 1.0 2001-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –
Part 6-8: General rules for the preparation of outline drawings of surface
mounted semiconductor device packages – Design guide for glass sealed
ceramic quad flatpack (G-QFP)
Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-8: Règles générales pour la préparation des dessins d'encombrement
des dispositifs à semiconducteurs à montage en surface – Guide de conception
pour les boîtiers plats quadrangulaires en céramique, scellement verre (G-QFP)

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IEC 60191-6-8 ®
Edition 1.0 2001-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Mechanical standardization of semiconductor devices –

Part 6-8: General rules for the preparation of outline drawings of surface

mounted semiconductor device packages – Design guide for glass sealed

ceramic quad flatpack (G-QFP)
Normalisation mécanique des dispositifs à semiconducteurs –

Partie 6-8: Règles générales pour la préparation des dessins d'encombrement

des dispositifs à semiconducteurs à montage en surface – Guide de conception

pour les boîtiers plats quadrangulaires en céramique, scellement verre (G-QFP)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX K
ICS 31.080.01 ISBN 978-2-83220-589-1

– 2 – 60191-6-8 © IEC:2001
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-8: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guide for glass sealed ceramic quad flatpack (G-QFP)

FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-8 has been prepared by subcommittee 47D: Mechanical
standardization of semiconductor devices, of IEC technical committee 47: Semiconductor
devices.
This bilingual version (2013-01) corresponds to the monolingual English version, published in
2001-08.
The text of this standard is based on the following documents:
FDIS Report on voting
47D/438/FDIS 47D/456/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
The committee has decided that the contents of this publication will remain unchanged
until 2005. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
60191-6-8 © IEC:2001 – 3 –
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-8: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Design guide for glass sealed ceramic quad flatpack (G-QFP)

1 Scope and object
This part of IEC 60191 provides the common outline drawings and dimensions for all types
of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter
called G-QFP).
The object of this design guide is to standardize outlines and obtain interchangeability of G-
QFP.
2 Normative references
The following normative documents contain provisions which, through reference in this text,
constitute provisions of this part of IEC 60191. For dated references, subsequent amend-
ments to, or revisions of, any of these publications do not apply. However, parties to
agreements based on this part of IEC 60191 are encouraged to investigate the possibility of
applying the most recent editions of the normative documents indicated below. For undated
references, the latest edition of the normative document referred to applies. Members of IEC
and ISO maintain registers of currently valid International Standards.
IEC 60191 (all parts), Mechanical standardization of semiconductor devices
3 Definitions
For the purpose of this part of IEC 60191, the following definition, as well as those given in
the other parts of this standard, apply.
3.1
G-QFP
glass sealed package with gull-wing formed terminals which are led out in four directions to
mount on PCB surface
4 Numbering of the pins
The index area is positioned at the upper left corner of the package body when it is viewed
from the seating plane. The terminal that is closest to the index corner is numbered 1, and
continued terminals that count in counter-clockwise directions are numbered 2, 3.

– 4 – 60191-6-8 © IEC:2001
E
Z
e
E
Index corner
β
Index corner
Zone of a visible index
on the top face
w M P S
Z
F
IEC  1361/01
Figure 1a
See figure 3
θ
Figure 1b
y S
IEC  1362/01
Seating plane
e
r
P
A
3 S
l
e
L
P
v M P S
L
IEC  1364/01
Figure 3
IEC  1363/01
Terminal position area
Figure 2
e
D
D
Q
c
b
Z
A D
H
D
A
A 2
60191-6-8 © IEC:2001 – 5 –
Table 1 – Group 1: Dimensions appropriate to mounting and interchangeability
Limits to be observed Recommended values for the dimensions
a
Ref. Note
Min. Nom. Max. mm
n X  1
n X  1
D
n X  1
E
A  X 2
A max. = 0,5 × m
m = 3, 4, 5, 6, 7, 8, 9, 10, 11

A1 X X X A1 0,00 0,25
min
A1 0,10 0,40
nom
A1 0,25 0,50
max
A2 X X X A2 0,51 1,01 1,51 2,01 2,51
min
A2 0,76 1,26 1,76 2,26 2,76
nom
A2 1,00 1,50 2,00 2,50 3,00
max
A2 3,01 3,51 4,01 4,51
min
A2 3,26 3,76 4,26 4,76
nom
A2 3,50 4,00 4,50 5,00
max
A i X  A i = 0,25
3 3
b X X X b b b
iei
p p min p nom p max
1,0 0,35 0,42 0,50
0,8 0,30 0,37 0,45
0,65 0,25 0,32 0,40
0,5 0,15 0,22 0,30
0,4 0,15 0,18 0,22
D X  E D  4
nom nom
K = 2, 4
5 × K – 0,8
E X  m = 3, 4, 5
Regular 6 × K – 0,8
square
7 × K – 0,8
20 + 4m – 0,8
Rectangular
7 × K – 0,8 5 × 2K – 0,8
E × D
nom nom
Square Rectangular
9,2 × 9,2 13,2 × 19,2
11,2 × 11,2 27,2 × 39,2
13,2 × 13,2
19,2 × 19,2
23,2 × 23,2
27,2 × 27,2
31,2 × 31,2
35,2 × 35,2
39,2 × 39,2
a
See notes on pages 9 and 10.
– 6 – 60191-6-8 © IEC:2001
Table 1 (continued)
Limits to be observed Recommended values for the dimensions
a
Ref. Note
Min. Nom. Max. mm
X 5
iei iei nom. = 1,0; 0,8; 0,65; 0,5; 0,4
H X X X H = D + 2L
D D nom nom nom
H = D – 0,2
D min nom
H = D + 0,2
D max nom
H X X X H = E + 2L
E E nom nom nom
H = H – 0,2
E min E nom
H = H + 0,2
E max E nom
L X L = 1,8; 2,1; 2,4
nom
L X X X L L L L
p nom p min p nom p max
1,8, 2,1 0,45 0,60 0,75
2,4 0,73 0,88 1,03
v  X v = 0,3   6
max
w  X iei w iei w  6
max max
1,0 0,20 0,5 0,10
0,8 0,16 0,4 0,10
0,65 0,13
y  X y = 0,10
max
X X X
θ θ = 0°
min
θ = 3°
nom
θ = 10°
max
a
See notes on pages 9 and 10.
60191-6-8 © IEC:2001 – 7 –
Table 2 – Group 2: Dimensions appropriate to mounting and gauging
Limits to be observed Recommended values for the dimensions
a
Ref. Note
Min. Nom. Max. mm
b = b + W
b  X 2 max p max max
b
iei
2 max
1,00 0,70
0,80 0,61
0,65 0,53
0,50 0,40
0,40 0,32
iei X
...