IEC 60191-6-4:2003

INTERNATIONAL IEC
STANDARD
60191-6-4
First edition
2003-06
Mechanical standardization of
semiconductor devices –
Part 6-4:
General rules for the preparation of
outline drawings of surface mounted
semiconductor device packages –
Measuring methods for package
dimensions of ball grid array (BGA)
Normalisation mécanique des dispositifs
à semiconducteurs –
Partie 6-4:
Règles générales pour la préparation des dessins
d'encombrement des dispositifs à semiconducteurs
à montage en surface –
Méthodes de mesure pour les dimensions des boîtiers
matriciels à billes
Reference number
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INTERNATIONAL IEC
STANDARD
60191-6-4
First edition
2003-06
Mechanical standardization of
semiconductor devices –
Part 6-4:
General rules for the preparation of
outline drawings of surface mounted
semiconductor device packages –
Measuring methods for package
dimensions of ball grid array (BGA)
Normalisation mécanique des dispositifs
à semiconducteurs –
Partie 6-4:
Règles générales pour la préparation des dessins
d'encombrement des dispositifs à semiconducteurs
à montage en surface –
Méthodes de mesure pour les dimensions des boîtiers
matriciels à billes
 IEC 2003  Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch  Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale
P
International Electrotechnical Commission
Международная Электротехническая Комиссия
For price, see current catalogue

– 2 – 60191-6-4  IEC:2003(E)
CONTENTS
FOREWORD . 3
1 Scope . 4
2 Normative references. 4
3 Terms and definitions. 4
4 Reference character and drawings. 5
4.1 Ball grid array package (BGA) Type 1 – Ball datum . 5
4.2 Ball grid array package (BGA) Type 2 – Body datum . 6
Measuring method. 7
5.1 Datum S as pertaining to ball coplanarity. 7
5.2 Datum A, B . 7
5.3 Definition of specified dimensions and measuring method . 9
5.4 Profile of a package edge surface v .11
5.5 Mounting height A.12
5.6 First stand-off A1 .12
5.7 Second stand-off A4 .13
5.8 Ball diameter b .14
5.9 Ball centre position X.14
5.10 Ball coplanarity y .16
5.11 Package top flatness y1.16
Figure 1 – BGA package Type 1 – Ball datum . 5
Figure 2 – BGA package Type 2 – Body datum . 6
Figure 3 – Datum S . 7
Figure 4 – Datum A, B – Type 1 . 8
Figure 5 – Centre of ball centres (for an even number). 8
Figure 6 – Centre of ball centres (for an odd number) . 8
Figure 7 – Datum A – Type 2. 9
Figure 8 – Datum B – Type 2. 9
Figure 9 – Tolerance w.10
Figure 10 – Measuring method of tolerance w .10
Figure 11 – Profile of a package edge surface v.11
Figure 12 – Measuring method of package edge surface v .11
Figure 13 – Mounting height A .12
Figure 14 – First stand-off A1.12
Figure 15 – Measuring method of stand-off A1 .13
Figure 16 – Second stand-off A4 .13
Figure 17 – Measuring method of stand-off A4 .14
Figure 18 – Ball diameter b .14
Figure 19 – Ball centre position X .15
Figure 20 – Theoretically correct ball centre.15
Figure 21 – Measuring method of ball centre position X .15
Figure 22 – Ball coplanarity y .16
Figure 23 – Package top flatness y1.16

60191-6-4  IEC:2003(E) – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION
OF SEMICONDUCTOR DEVICES –
Part 6-4: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Measuring methods for package dimensions of ball grid array (BGA)
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60191-6-4 has been prepared by subcommittee 47D: Mechanical
standardization of semiconductor devices, of IEC technical committee 47: Semiconductor
devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47D/531/FDIS 47D/546/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until 2006.
At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

– 4 – 60191-6-4  IEC:2003(E)
MECHANICAL STANDARDIZATION
OF SEMICONDUCTOR DEVICES –
Part 6-4: General rules for the preparation of outline drawings
of surface mounted semiconductor device packages –
Measuring methods for package dimensions of ball grid array (BGA)
1 Scope
This part of IEC 60191 covers the requirements for the measuring methods of ball grid array
(BGA) dimensions.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60191-6:1990, Mechanical standardization of semiconductor devices – Part 6: General
rules for the preparation of outline drawings of surface mounted semiconductor device
packages
3 Terms and definitions
For the purposes of this document, the definitions of IEC 60191-6 apply.
The measuring method in this standard is defined for dimension values guaranteed to users
on the basis of the following items.
1) In general, measurement may be made either by hand or automatically.
2) If a dimension is difficult to measure, the best alternative measuring method will be
defined as the preferred measuring method.

60191-6-4  IEC:2003(E) – 5 –
4 Reference character and drawings
4.1 Ball grid array package (BGA) Type 1 – Ball datum
D
w SA
X4
v
y1
S
S
y
S
e
ZD A
A1 A2
Even type
A1 A2
B
B1
B3
Odd type
B4
B2
A1
A2
1 2 3
A3
A4
∅b
M
∅x S
SD
IEC  1424/03
Figure 1 – BGA package Type 1 – Ball datum
SE
A B C
e
E
ZE
A1
A w S B
– 6 – 60191-6-4  IEC:2003(E)
4.2 Ball grid array package (BGA) Type 2 – Body datum
vS
D
A
B
vS
y1
S S
y2
S
y
S
e ∅bp
∅x M
S A B
SD
ZD
∅x1 M S
1 2 3
IEC  1425/03
Figure 2 – BGA package Type 2 – Body datum
A
A1
A2
A B C
A3
SE
ZE
E
A4
e
60191-6-4  IEC:2003(E) – 7 –
5 Measuring method
5.1 Datum S as pertaining to ball coplanarity
The datum S (seating plane) can be determined by either of the following:
a) Datum S formed from the triangulation of the tallest three balls.
The tallest three balls defining the seating plane must fully encompass the projection of
the centre of gravity (COG) in order to constitute a valid seating plane.
b) Datum S calculated from the LSM (least squares method) plane applies to stand-off A2,
stand-off A1, the ball centre point and coplanarity. Calculate a plane from each lowest
point of all balls based on LSM. Datum S shall be the LSM pl
...