EN IEC 61191-1:2018

SLOVENSKI STANDARD
01-februar-2020
Nadomešča:
SIST EN 61191-1:2014
Sestavi plošč tiskanih vezij - 1. del: Rodovna specifikacija - Zahteve za spajkane
električne in elektronske sestave, ki uporabljajo tehnologije površinske montaže in
sorodne tehnologije
Printed board assemblies - Part 1: Generic specification - Requirements for soldered
electrical and electronic assemblies using surface mount and related assembly
technologies
Elektronikaufbauten auf Leiterplatten - Teil 1: Fachgrundspezifikation - Anforderungen an
gelötete elektrische und elektronische Baugruppen unter Verwendung der
Oberflächenmontage und verwandter Montagetechniken
Ensembles de cartes imprimées - Partie 1: Spécification générique - Exigences relatives
aux ensembles électriques et électroniques brasés utilisant les techniques de montage
en surface et associées
Ta slovenski standard je istoveten z: EN IEC 61191-1:2018
ICS:
31.180 Tiskana vezja (TIV) in tiskane Printed circuits and boards
plošče
31.190 Sestavljeni elektronski Electronic component
elementi assemblies
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 61191-1

NORME EUROPÉENNE
EUROPÄISCHE NORM
November 2018
ICS 31.190; 31.240 Supersedes EN 61191-1:2013
English Version
Printed board assemblies - Part 1: Generic specification -
Requirements for soldered electrical and electronic assemblies
using surface mount and related assembly technologies
(IEC 61191-1:2018)
Ensembles de cartes imprimées - Partie 1: Spécification Elektronikaufbauten auf Leiterplatten - Teil 1:
générique - Exigences relatives aux ensembles électriques Fachgrundspezifikation - Anforderungen an gelötete
et électroniques brasés utilisant les techniques de montage elektrische und elektronische Baugruppen unter
en surface et associées Verwendung der Oberflächenmontage und verwandter
(IEC 61191-1:2018) Montagetechniken
(IEC 61191-1:2018)
This European Standard was approved by CENELEC on 2018-10-19. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 61191-1:2018 E

European foreword
The text of document 91/1481/CDV, future edition 3 of IEC 61191-1, prepared by IEC/TC 91
"Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 61191-1:2018.
The following dates are fixed:
• latest date by which the document has to be implemented at national (dop) 2019-07-19
level by publication of an identical national standard or by endorsement
• latest date by which the national standards conflicting with the (dow) 2021-10-19
document have to be withdrawn
This document supersedes EN 61191-1:2013.
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 61191-1:2018 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1
IEC 61188-5-2 NOTE Harmonized as EN 61188-5-2
IEC 61188-5-3 NOTE Harmonized as EN 61188-5-3
IEC 61188-5-4 NOTE Harmonized as EN 61188-5-4
IEC 61188-5-5 NOTE Harmonized as EN 61188-5-5
IEC 61188-5-6 NOTE Harmonized as EN 61188-5-6
IEC 61188-7 NOTE Harmonized as EN 61188-7
IEC 61189-2 NOTE Harmonized as EN 61189-2
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2
IEC 61193-1 NOTE Harmonized as EN 61193-1
IEC 61193-3 NOTE Harmonized as EN 61193-3
IEC 62326-1 NOTE Harmonized as EN 62326-1
IEC 62326-4 NOTE Harmonized as EN 62326-4
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60068-2-20 -  Environmental testing - Part 2-20: Tests - Test T: EN 60068-2-20 -
Test methods for solderability and resistance to
soldering heat of devices with leads
IEC 60068-2-58 -  Environmental testing - Part 2-58: Tests - Test EN 60068-2-58 -
Td: Test methods for solderability, resistance to
dissolution of metallization and to soldering heat
of surface mounting devices (SMD)
IEC 60194 -  Printed board design, manufacture and assembly - -
- Terms and definitions
IEC 60721-3-1 -  Printed board design, manufacture and assembly EN IEC 60721-3-1 -
- Terms and definitions
IEC 61189-1 -  Test methods for electrical materials, EN 61189-1 -
interconnection structures and assemblies - Part
1: General test methods and methodology
IEC 61189-3 -  Test methods for electrical materials, printed EN 61189-3 -
boards and other interconnection structures and
assemblies - Part 3: Test methods for
interconnection structures (printed boards)
IEC 61190-1-1 -  Attachment materials for electronic assembly - EN 61190-1-1 -
Part 1-1: Requirements for soldering fluxes for
high-quality interconnections in electronics
assembly
IEC 61190-1-3 -  Attachment materials for electronic assembly - EN IEC 61190-1-3 -
Part 1-3: Requirements for electronic grade
solder alloys and fluxed and non-fluxed solid
solder for electronic soldering applications
IEC 61191-2 -  Printed board assemblies - Part 2: Sectional EN 61191-2 -
specification - Requirements for surface mount
soldered assemblies
IEC 61191-3 -  Printed board assemblies - Part 3: Sectional EN 61191-3 -
specification - Requirements for through-hole
mount soldered assemblies
IEC 61191-4 -  Printed board assemblies - Part 4: Sectional EN 61191-4 -
specification - Requirements for terminal
soldered assemblies
IEC 61249-8-8 -  Materials for interconnection structures - Part 8: EN 61249-8-8 -
Sectional specification set for non-conductive
films and coatings - Section 8: Temporary
polymer coatings
IEC 61340-5-1 -  Electrostatics - Part 5-1: Protection of electronic EN 61340-5-1 -
devices from electrostatic phenomena - General
requirements
IEC/TR 61340-5-2 -  Electrostatics - Part 5-2: Protection of electronic CLC/TR 61340-5-2 -
devices from electrostatic phenomena - User
guide
IEC 61760-2 -  Surface mounting technology - Part 2: EN 61760-2 -
Transportation and storage conditions of surface
mounting devices (SMD) - Application guide
ISO 9001 2008 Quality management systems - Requirements - -
IPC-A-610 - Acceptability of Electronics Assemblies - -

IEC 61191-1 ®
Edition 3.0 2018-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 1: Generic specification – Requirements for soldered electrical and

electronic assemblies using surface mount and related assembly technologies

Ensembles de cartes imprimées –

Partie 1: Spécification générique – Exigences relatives aux ensembles

électriques et électroniques brasés utilisant les techniques de montage en

surface et associées
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.190; 31.240 ISBN 978-2-8322-5953-5

– 2 – IEC 61191-1:2018 © IEC 2018
CONTENTS
FOREWORD . 6
1 Scope . 8
2 Normative references. 8
3 Terms and definitions . 9
4 General requirements . 10
4.1 Order of precedence . 10
4.1.1 General remark . 10
4.1.2 Conflict . 10
4.1.3 Conformance documentation . 10
4.2 Interpretation of requirements . 11
4.3 Classification . 11
4.4 Defects and process indicators . 11
4.5 Process control requirements . 12
4.6 Requirements flowdown . 12
4.7 Physical designs . 12
4.7.1 New designs . 12
4.7.2 Existing designs . 12
4.8 Visual aids . 12
4.9 Proficiency of personnel . 13
4.9.1 Design proficiency . 13
4.9.2 Manufacturing proficiency. 13
4.10 Electrostatic discharge (ESD) . 13
4.11 Facilities . 13
4.11.1 General . 13
4.11.2 Environmental controls . 13
4.11.3 Temperature and humidity . 13
4.11.4 Lighting . 14
4.11.5 Field conditions . 14
4.11.6 Clean rooms . 14
4.12 Assembly tools and equipment . 14
4.12.1 General . 14
4.12.2 Process control . 14
5 Requirements of materials . 14
5.1 Overview. 14
5.2 Solder . 14
5.3 Flux . 14
5.4 Solder paste . 15
5.5 Preform solder .
...