EN 61191-3:2017

SLOVENSKI STANDARD
01-februar-2018
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SIST EN 61191-3:2001
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Printed board assemblies - Part 3: Sectional specification - Requirements for through-
hole mount soldered assemblies
Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an
gelötete Baugruppen in Durchsteckmontage
Ensembles de cartes imprimées - Partie 3: Spécification intermédiaire - Exigences
relatives à l'assemblage par brasage de trous traversants
Ta slovenski standard je istoveten z: EN 61191-3:2017
ICS:
31.180 7LVNDQDYH]MD7,9LQWLVNDQH Printed circuits and boards
SORãþH
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN 61191-3
NORME EUROPÉENNE
EUROPÄISCHE NORM
September 2017
ICS 31.240 Supersedes EN 61191-3:1998
English Version
Printed board assemblies - Part 3: Sectional specification -
Requirements for through-hole mount soldered assemblies
(IEC 61191-3:2017)
Ensembles de cartes imprimées - Partie 3: Spécification Elektronikaufbauten auf Leiterplatten - Teil 3:
intermédiaire - Exigences relatives à l'assemblage par Rahmenspezifikation - Anforderungen an gelötete
brasage de trous traversants Baugruppen in Durchsteckmontage
(IEC 61191-3:2017) (IEC 61191-3:2017)
This European Standard was approved by CENELEC on 2017-07-04. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels
© 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 61191-3:2017 E
European foreword
The text of document 91/1375/CDV, future edition 2 of IEC 61191-3, prepared by
IEC/TC 91 "Electronics assembly technology" was submitted to the IEC-CENELEC parallel vote and
approved by CENELEC as EN 61191-3:2017.

The following dates are fixed:
(dop) 2018-04-04
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2020-07-04
standards conflicting with the
document have to be withdrawn
This document supersedes EN 61191-3:1998.

Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 61191-3:2017 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20.
IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58.
IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1.
IEC 61188-5-2 NOTE Harmonized as EN 61188-5-2.
IEC 61188-5-3 NOTE Harmonized as EN 61188-5-3.
IEC 61188-5-4 NOTE Harmonized as EN 61188-5-4.
IEC 61188-5-6 NOTE Harmonized as EN 61188-5-5.
IEC 61188-7 NOTE Harmonized as EN 61188-7.
IEC 61189-2 NOTE Harmonized as EN 61189-2.
IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2.
IEC 61193-1 NOTE Harmonized as EN 61193-1.
IEC 61193-3 NOTE Harmonized as EN 61193-3.
IEC 62326-1 NOTE Harmonized as EN 62326-1.
IEC 62326-4 NOTE Harmonized as EN 62326-4.

IEC 62326-4-1 NOTE Harmonized as EN 62326-4-1.
ISO 9001 NOTE Harmonized as EN ISO 9001.

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following documents, in whole or in part, are normatively referenced in this document and are
indispensable for its application. For dated references, only the edition cited applies. For undated
references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant

EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194 -  Printed board design, manufacture and - -
assembly - Terms and definitions
IEC 61191-1 2013 Printed board assemblies -- Part 1: EN 61191-1 2013
Generic specification - Requirements for
soldered electrical and electronic
assemblies using surface mount and
related assembly technologies
IPC-A-610 -  Acceptability of Electronics Assemblies - -

IEC 61191-3 ®
Edition 2.0 2017-05
INTERNATIONAL
STANDARD
Printed board assemblies –
Part 3: Sectional specification – Requirements for through-hole mount soldered

assemblies
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.240 ISBN 978-2-8322-4397-8

– 2 – IEC 61191-3:2017 © IEC 2017

CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General requirements . 6
5 Through-hole mounting of components . 7
5.1 General . 7
5.2 Placement accuracy . 7
5.3 Through-hole component requirements . 7
5.3.1 Lead preforming . 7
5.3.2 Tempered leads . 7
5.3.3 Lead forming requirements . 7
5.3.4 Stress relief requirements . 8
5.3.5 Lead termination requirements . 8
6 Acceptance requirements . 10
6.1 General . 10
6.2 Control and corrective actions . 10
6.2.1 General . 10
6.2.2 Interfacial connections (vias) . 10
6.3 Through-hole component lead soldering . 11
6.3.1 General . 11
6.3.2 Clinched leads . 12
6.3.3 Exposed basis metal . 13
7 Rework of unsatisfactory solder connections . 13
Annex A (normative) Placement requirements for through-hole mount devices . 14
A.1 General . 14
A.2 Horizontal mounting, free-standing . 14
A.3 Axial lead components . 14
A.4 Radial lead components . 14
A.5 Perpendicular mounting, free-standing . 14
A.5.1 General . 14
A.5.2 Mounting of components . 14
A.5.3 Radial lead components . 15
A.6 Side- and end-mounting . 15
A.7 Supported component mounting . 16
A.7.1 General . 16
A.7.2 Stand-off positioning . 16
A.7.3 Non-resilient footed stand-offs . 17
A.8 Stress relief lead configuration . 17
A.9 Flat pack lead configuration . 17
Bibliography . 19

Figure 1 – Lead bends . 8
Figure 2 – Hole obstruction . 10
Figure 3 – Through-hole component lead soldering . 11

IEC 61191-3:2017 © IEC 2017 – 3 –
Figure 4 – Lead-to-land fillet requirements for clinched leads and wires in non-plated
through-holes . 11
Figure 5 – Lead-to-land fillet requirements for clinched leads and wires in plated
through-holes . 12
Figure A.1 – Mounting of free-standing components . 14
Figure A.2 – Typical configuration of components with dual non-axial leads . 15
Figure A.3 – Mounting of components with dual non-axial leads . 15
Figure A.4 – Side mounting . 15
Figure A.5 – End mounting. 16
Figure A.6 – Mounting with footed stand-offs . 16
Figure A.7 – Non-resilient footed stand-offs . 17
Figure A.8 – Acceptable lead configurations . 17
Figure A.9 – Configuration of ribbon leads for through-hole mounting . 18

Table 1 – Plated through-holes with component leads, minimum acceptable
1)
conditions . 12
Table 2 – Through-hole solder joint defects . 13

– 4 – IEC 61191-3:2017 © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARD ASSEMBLIES –
Part 3: Sectional specification – Requirements
for through-hole mount soldered assemblies

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61191-3 has been prepared by WG 2: Requirements for electronics
assemblies, of IEC technical committee 91: Electronics assembly technology.
This second edition cancels and replaces the first edition published in 1998. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) The requirements have been updated to be compliant with the acceptance criteria in
IPC-A-610F.
IEC 61191-3:2017 © IEC 2017 – 5 –
The text of this standard is based on the following documents:
CDV Report on voting
91/1375/CDV 91/1435/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 61191 series, published under the general title Printed board
assemblies, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – IEC 61191-3:2017 © IEC 2017
PRINTED BOARD ASSEMBLIES –
Part 3: Sectional specification – Requirements
for through-hole mount soldered assemblies

1 Scope
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The
requirements pertain to those assemblies that totally use through-hole mounting technology
(THT), or the THT portions of those assemblies that include other related technologies (i.e.
surface mount, chip mounting, terminal mounting).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 61191-1:2013, Printed board assemblies – Part 1: Generic specification – Requirements
for soldered electrical and electronic assemblies using surface mount and related assembly
technologies
IPC-A-610, Acceptability of Electronic Assemblies
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60194 apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
THT
through-hole technology
technology that permits an electrical connection of components to a conductive pattern by the
use of plated or non-plated holes with annular rings in the mounting substrate
4 General requirements
Requirements of IEC 61191-1 are a mandatory part of this specification. Workmanship shall
meet the requirements of IPC-A-610 in accordance with the classification requirements of this
document.
IEC 61191-3:2017 © IEC 2017 – 7 –
5 Through-hole mounting of components
5.1 General
This clause covers the assembly of components with leads inserted into through-holes and
soldered by machine and/or manual processes.
5.2 Placement accuracy
Placement accuracy for components inserted either manually or by machine methods shall be
sufficient to insure that components are properly positioned after soldering. If suitable process
controls are not in place to ensure compliance with this requirement and the intent of Annex
A, the detailed requirements of Annex A shall be applicable.
5.3 Through-hole component requirements
5.3.1 Lead preforming
Part and component leads shall be pre-formed to the final configuration, excluding the final
clinch or retention bend, before assembly or installation.
5.3.2 Tempered leads
When it is necessary to cut tempered leads, the governing work instructions shall specify
cutting tools that do not impart detrimental shocks to internal connections of the components.
5.3.3 Lead forming requirements
Leads shall be formed in such a manner that the lead-to-body seal is not damaged or
degraded. Leads shall extend at least one lead d
...