EN 61191-2:2017
(Main)Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F; b) some of the terminology used in the document has been updated; c) references to IEC standards have been corrected; d) five termination styles have been added.
Elektronikaufbauten auf Leiterplatten - Teil 2: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Oberflächenmontage
Ensembles de cartes imprimées - Partie 2: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surface
L’IEC 61191-2:2017 spécifie les exigences relatives aux connexions brasées pour montage en surface. Les exigences se rapportent aux ensembles intégrant uniquement le montage en surface ou aux portions d’ensembles pour montage en surface incluant d’autres technologies associées (par exemple montage par trous traversants, montage à puce, à borne, etc.). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente: a) mise à jour des exigences pour qu’elles soient conformes aux critères d’acceptation de l’IPC‑A-610F; b) mise à jour d’une partie de la terminologie utilisée dans le présent document; c) correction des références aux normes IEC; d) ajout de cinq styles de terminaisons.
Sestavi plošč tiskanih vezij - 2. del: Področna specifikacija - Zahteve za površinsko nameščene spajkane sestave
Ta del standarda IEC 61191 določa zahteve za površinsko nameščene spajkane sestave. Zahteve se nanašajo na sestave, ki so v celoti nameščeni na površino, ali na dele sestavov, nameščene na površino, ki vključujejo druge povezane tehnologije (npr. nameščanje skozi luknjice, nameščanje čipov, nameščanje priključkov itd.).
General Information
Relations
Standards Content (Sample)
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.Elektronikaufbauten auf Leiterplatten - Teil 2: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in OberflächenmontageEnsembles de cartes imprimées - Partie 2: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surfacePrinted board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies31.190Sestavljeni elektronski elementiElectronic component assemblies31.180SORãþHPrinted circuits and boardsICS:Ta slovenski standard je istoveten z:EN 61191-2:2017SIST EN 61191-2:2018en01-januar-2018SIST EN 61191-2:2018SLOVENSKI
STANDARDSIST EN 61191-2:20141DGRPHãþD
EUROPEAN STANDARD NORME EUROPÉENNE EUROPÄISCHE NORM
EN 61191-2
October 2017 ICS 31.190; 31.240
Supersedes
EN 61191-2:2013
English Version
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017)
Ensembles de cartes imprimées - Partie 2: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage pour montage en surface (IEC 61191-2:2017)
Elektronikaufbauten auf Leiterplatten -
Teil 2: Rahmenspezifikation - Anforderungen an gelötete Baugruppen in Oberflächenmontage (IEC 61191-2:2017) This European Standard was approved by CENELEC on 2017-06-27. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique Europäisches Komitee für Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17,
B-1000 Brussels © 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN 61191-2:2017 E SIST EN 61191-2:2018
The following dates are fixed: • latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2018-04-13 • latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-10-13
This document supersedes EN 61191-2:2013.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.
Endorsement notice The text of the International Standard IEC 61191-2:2017 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated:
IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58. IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1. IEC 61188-5-2 NOTE Harmonized as EN 61188-5-2. IEC 61188-5-3 NOTE Harmonized as EN 61188-5-3. IEC 61188-5-4 NOTE Harmonized as EN 61188-5-4. IEC 61188-5-5 NOTE Harmonized as EN 61188-5-5. IEC 61188-5-6 NOTE Harmonized as EN 61188-5-6. IEC 61188-7 NOTE Harmonized as EN 61188-7. IEC 61189-2 NOTE Harmonized as EN 61189-2. IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2. IEC 61193-1 NOTE Harmonized as EN 61193-1. IEC 61193-3 NOTE Harmonized as EN 61193-3. IEC 62326-1 NOTE Harmonized as EN 62326-1. IEC 62326-4 NOTE Harmonized as EN 62326-4. IEC 62326-4-1 NOTE Harmonized as EN 62326-4-1. ISO 9001 NOTE Harmonized as EN ISO 9001. SIST EN 61191-2:2018
(normative)
Normative references to international publications
with their corresponding European publications
The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
NOTE 1 Where an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies.
NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu.
Publication Year Title EN/HD Year
IEC 60194 -
Printed board design, manufacture and assembly - Terms and definitions EN 60194 -
IEC 61191-1 -
Printed board assemblies -
Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies EN 61191-1 -
IPC-A-610 -
Acceptability of Electronics Assemblies - -
IEC 61191-2 Edition 3.0 2017-05 INTERNATIONAL STANDARD
Printed board assemblies –
Part 2: Sectional specification – Requirements for surface mount soldered assemblies
INTERNATIONAL ELECTROTECHNICAL COMMISSION
ICS 31.190; 31.240
ISBN 978-2-8322-4322-0
– 2 – IEC 61191-2:2017 © IEC 2017 CONTENTS FOREWORD . 5 1 Scope . 7 2 Normative references . 7 3 Terms and definitions . 7 4 General requirements . 7 5 Surface mounting of components . 7 5.1 General . 7 5.2 Alignment requirements . 8 5.3 Process control . 8 5.4 Surface mounted component requirements . 8 5.5 Flatpack lead forming . 8 5.5.1 General . 8 5.5.2 Surface mounted device lead bends . 8 5.5.3 Surface mounted device lead deformation . 9 5.5.4 Flattened leads . 9 5.5.5 Dual-in-line packages (DIPs) . 9 5.5.6 Parts not configured for surface mounting . 9 5.6 Small devices with two terminations . 9 5.6.1 General . 9 5.6.2 Stack mounting . 9 5.6.3 Devices with external deposited elements . 9 5.7 Lead component body positioning . 10 5.7.1 General . 10 5.7.2 Axial-leaded components . 10 5.7.3 Other components . 10 5.8 Parts configured for butt lead mounting . 10 5.9 Non-conductive adhesive coverage limits . 10 6 Acceptance requirements . 10 6.1 General . 10 6.2 Control and corrective actions . 10 6.3 Surface soldering of leads and terminations . 11 6.3.1 General . 11 6.3.2 Solder fillet height and heel fillets . 11 6.3.3 Flat ribbon L and gull-wing leads . 12 6.3.4 Round or flattened (coined) leads . 13 6.3.5 J leads . 14 6.3.6 Rectangular or square end component . 15 6.3.7 Cylindrical end-cap terminations . 16 6.3.8 Bottom only terminations . 17 6.3.9 Castellated terminations . 18 6.3.10 Butt joints . 19 6.3.11 Inward L-shaped ribbon leads . 20 6.3.12 Flat lug leads . 21 6.3.13 Ball grid array . 22 6.3.14 Column grid array . 23 6.3.15 Bottom termination components . 24 SIST EN 61191-2:2018
IEC 61191-2:2017 © IEC 2017 – 3 –
6.3.16 Components with bottom thermal plane terminations (D-Pak) . 24 6.3.17 P-style terminations . 26 6.4 General post-soldering requirements applicable to all surface-mounted assemblies . 26 6.4.1 Dewetting . 26 6.4.2 Leaching . 26 6.4.3 Pits, voids, blowholes, and cavities . 26 6.4.4 Solder wicking . 27 6.4.5 Solder webs and skins . 27 6.4.6 Bridging . 27 6.4.7 Degradation of marking . 27 6.4.8 Solder spikes . 27 6.4.9 Disturbed joint . 27 6.4.10 Component damage. 27 6.4.11 Open circuit, non-wetting . 27 6.4.12 Component tilting. 27 6.4.13 Non-conducting adhesive encroachment . 28 6.4.14 Open circuit, no solder available . 28 6.4.15 Component on edge . 28 7 Rework and repair . 28 Annex A (normative)
Placement requirements for surface mounted devices . 30 A.1 General . 30 A.2 Component positioning . 30 A.3 Small devices incorporating two terminations . 30 A.3.1 Metallization coverage over the land (side-to-side) . 30 A.3.2 Metallization coverage over the land (end) . 30 A.4 Mounting of cylindrical end-cap devices (MELFs) . 30 A.5 Registration of castellated chip carrier
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