EN 16602-70-08:2015

SLOVENSKI STANDARD
01-april-2015
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Space product assurance - Manual soldering of high-reliability electrical connections
Raumfahrtproduktsicherung - Manuelles Löten von hoch-zuverlässigen elektrischen
Verbindungen
Assurance produit des projets spatiaux - Soudage manuel des connexions électriques à
fiabilité élevée
Ta slovenski standard je istoveten z: EN 16602-70-08:2015
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD
EN 16602-70-08
NORME EUROPÉENNE
EUROPÄISCHE NORM
January 2015
ICS 25.160.50; 49.140
English version
Space product assurance - Manual soldering of high-reliability
electrical connections
Assurance produit des projets spatiaux - Soudage manuel Raumfahrtproduktsicherung - Manuelles Löten von hoch-
des connexions électriques à fiabilité élevée zuverlässigen elektrischen Verbindungen
This European Standard was approved by CEN on 18 October 2014.

CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC
member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
has the same status as the official versions.

CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.

CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2015 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. EN 16602-70-08:2015 E
worldwide for CEN national Members and for CENELEC
Members.
Table of contents
Foreword . 9
Introduction . 10
1 Scope . 11
2 Normative references . 12
3 Terms, definitions and abbreviated terms . 13
3.1 Terms from other standards . 13
3.2 Terms specific to the present standard . 13
3.3 Abbreviated terms. 20
4 Principles of reliable soldered connections . 22
5 Preparatory conditions . 23
5.1 Calibration . 23
5.2 Facility cleanliness . 23
5.3 Environmental conditions . 23
5.4 Lighting requirements . 24
5.5 Precautions against static discharges . 24
5.5.1 General . 24
5.5.2 Precautions against ESD during manufacturing . 24
5.5.3 Protective Packaging and ESD Protection . 25
5.5.4 Packing and filler materials . 26
5.6 Equipment and tools . 26
5.6.1 General . 26
5.6.2 Brushes . 26
5.6.3 Cutters and pliers . 26
5.6.4 Bending tools . 27
5.6.5 Clinching tools . 27
5.6.6 Insulation strippers . 28
5.6.7 Soldering irons and resistance soldering equipment . 29
5.6.8 Soldering tools . 30
6 Materials selection . 31
6.1 General . 31
6.2 Solder . 31
6.2.1 Form . 31
6.2.2 Composition . 31
6.3 Flux . 32
6.3.1 Rosin-based fluxes. 32
6.3.2 INH1 corrosive acid flux . 33
6.3.3 Application of flux . 33
6.4 Solvents . 34
6.5 Flexible insulation materials . 34
6.6 Terminals . 35
6.6.1 Materials . 35
6.6.2 Tin-, silver- and gold-plated terminals. 35
6.6.3 Shape of terminals . 35
6.7 Wires . 35
6.8 PCBs . 36
6.8.1 Boards . 36
6.8.2 Gold finish on conductors . 36
6.9 Component lead finishes . 36
6.10 Adhesives (staking compounds and heat sinking), encapsulants and
conformal coatings . 36
7 Preparation for soldering . 38
7.1 General . 38
7.1.1 Tools . 38
7.1.2 Components. 38
7.2 Preparation of conductors, terminals and solder cups . 38
7.2.1 Insulation removal . 38
7.2.2 Surfaces to be soldered . 39
7.2.3 De-golding of gold-plated leads and terminals . 40
7.2.4 Constraints on degolding and pretinning methods . 41
7.2.5 Pretinning of stranded wires . 42
7.2.6 Pre-tinning of component leads and solid-wire conductors . 42
7.3 Preparation of the soldering bit . 43
7.3.1 Fit . 43
7.3.2 Maintenance . 43
7.3.3 Plated bits . 43
7.3.4 Tip in operation . 43
7.4 Maintenance of resistance-type soldering electrodes . 44
7.5 Handling (work station) . 44
7.6 Storage (work station) . 44
7.6.1 Components. 44
7.6.2 PCBs. 44
7.6.3 Materials requiring segregation . 44
7.7 Preparation of PCBs for soldering . 45
7.7.1 Process . 45
7.7.2 Demoisturization methods . 45
7.7.3 Storage of prepared PCBs . 45
8 Mounting of components . 46
8.1 General requirements . 46
8.1.1 Introduction . 46
8.1.2 Heavy components . 46
8.1.3 Metal-case components . 46
8.1.4 Glass-encased components . 47
8.1.5 Stress relief of components with bendable leads . 47
8.1.6 Stress relief of components with non-bendable leads . 48
8.1.7 Reinforced plated-through holes . 50
8.1.8 Lead and conductor cutting . 50
8.1.9 Solid hook-up wire. 50
8.1.10 Location . 50
8.1.11 Conformal coating, cementing and encapsulation . 50
8.2 Lead bending requirements . 51
8.2.1 General . 51
8.2.2 Conductors terminating on both sides of a non-plated-through hole . 51
8.3 Mounting of terminals to PCBs. 52
8.4 Lead attachment to PCBs . 53
8.4.1 General . 53
8.4.2 Clinched leads . 53
8.4.3 Stud leads . 55
8.4.4 Lapped round leads . 56
8.4.5 Lapped ribbon leads . 56
8.5 Mounting of components to terminals . 56
8.6 Mounting of connectors to PCBs . 58
9 Attachment of conductors to terminals, solder cups and cables . 59
9.1 General . 59
9.1.1 Conductors . 59
9.1.2 Terminals . 59
9.2 Wire termination . 59
9.2.1 Breakouts from cables . 59
9.2.2 Insulation clearance . 59
9.2.3 Solid hook-up wire. 60
9.2.4 Stress relief . 60
9.3 Turret and straight-pin terminals . 60
9.3.1 Side route . 60
9.3.2 Bottom route . 60
9.4 Bifurcated terminals . 61
9.4.1 General . 61
9.4.2 Bottom route . 61
9.4.3 Side route . 62
9.4.4 Top route . 63
9.4.5 Combination of top and bottom routes. 64
9.4.6 Combination of side and bottom routes . 64
9.5 Hook terminals . 64
9.6 Pierced terminals . 65
9.7 Solder cups (connector type) . 66
9.8 Insulation sleeving . 66
9.9 Wire and cable interconnections . 67
9.9.1 General . 67
9.9.2 Preparation of wires . 67
9.9.3 Preparation of shielded wires and cables . 67
9.9.4 Pre-assembly . 68
9.9.5 Soldering procedures . 68
9.9.6 Cleaning . 69
9.9.7 Inspection . 69
9.9.8 Workmanship . 69
9.9.9 Sleeving of interconnections . 69
9.10 Connection of stranded wires to PCBs . 70
10 Soldering to terminals and PCBs . 72
10.1 General . 72
10.1.1 Securing conductors . 72
10.1.2 Thermal shunts . 72
10.1.3 High-voltage connections . 72
10.2 Solder application to terminals . 73
10.2.1 Soldering of swaged terminals onto PCBs . 73
10.2.2 Soldering of conductors onto terminals (except cup terminals) . 73
10.2.3 Soldering of conductors onto cup terminals . 74
10.3 Solder application to PCBs . 74
10.3.1 Solder coverage . 74
10.3.2 Solder fillets . 74
10.3.3 Soldering of component leads to plated-through holes . 74
10.3.4 Solder application . 75
10.4 Wicking . 76
10.5 Solder rework . 76
10.6 Repair and modification . 76
11 Cleaning of PCB assemblies . 77
11.1 General . 77
11.2 Ultrasonic cleaning . 77
11.3 Monitoring for cleanliness . 77
11.3.1 Cleanliness testing . 77
11.3.2 Testing frequency . 78
11.3.3 Test limits . 78
11.3.4 Test method . 78
12 Final inspection . 79
12.1 General . 79
12.2 Acceptance criteria . 79
12.3 Visual rejection criteria . 80
13 Verification procedure. 81
13.1 General . 81
13.2 Vibration . 81
13.3 Temperature cycling . 84
13.4 Microsection . 84
14 Quality assurance . 85
14.1 General . 85
14.2 Data . 85
14.3 Nonconformance . 85
14.4 Calibration . 85
14.5 Traceability . 86
14.6 Workmanship standards . 86
14.7 Inspection . 86
14.8 Operator and inspector training and certification . 86
15 Workmanship standards . 88
15.1 Soldered clinched terminals . 88
15.2 Soldered stud terminals . 89
15.3 Soldered turret terminals. 90
15.4 Solder turret terminals . 91
15.5 Soldered bifurcated terminals . 92
15.6 Soldered hook terminals . 93
15.7 Soldered cup terminals . 94
15.8 Soldered wire to shielded cable interconnections . 95
Annex A (normative) Report on manual soldering of high-reliability
electrical connections - DRD . 98
Annex B (informative) Solder melting temperatures and choice . 102
Bibliography . 103

Figures
Figure 5-1: Profiles of correct and incorrect cutters for trimming leads . 27
Figure 5-2 Examples of non-approved types of mechanical strippers . 28
Figure 8-1: Assembly of underfilled TO-39 and TO-59, and adhesively staked CKR06 . 48
Figure 8-2: Methods for incorporating stress relief with components having bendable
leads . 49
Figure 8-3: Methods for attaching wire extensions to non-bendable leads . 50
Figure 8-4: Minimum lead bend . 51
Figure 8-5: Leads with solder termination on both sides . 52
Figure 8-6: Types of terminal swaging . 53
Figure 8-7: Clinched-lead terminations - unsupported holes . 54
Figure 8-8: Clinched lead terminations - plated through-holes . 54
Figure 8-9: Stud terminations . 55
Figure 8-10: Methods of through-hole lapped termination . 57
Figure 8-11: Method of stress relieving parts attached to terminals . 57
Figure 9-1: Side- and bottom-route connections to turret terminals . 61
Figure 9-2: Bottom-route connections to bifurcated terminal . 62
Figure 9-3: Side-route connection to bifurcated terminal . 63
Figure 9-4: Top-route connection to bifurcated terminal . 64
Figure 9-5: Connections to hook terminals . 65
Figure 9-6: Connections to pierced terminals . 65
Figure 9-7: Connections to solder cups (connector type) . 66
Figure 9-8: Methods for securing wires . 69
Figure 9-9: Connection of stranded wires to PCBs . 71
Figure 10-1: High voltage connection . 73
Figure 10-2:Minimum acceptable wetting on component side. 75
Figure 15-1:Soldered clinched terminals . 88
Figure 15-2: Soldered stud terminals . 89
Figure 15-3: Soldered turret terminals with twin conductors . 90
Figure 15-4: Soldered turret terminals with single conductors . 91
Figure 15-5: Soldered bifurcated terminals . 92
Figure 15-6 Soldered hook terminals . 93
Figure 15-7: Soldered cup terminals . 94
Figure 15-8: Hand-soldered wire to shielded cable interconnections . 95
Figure 15-9: Hand-soldered wire to shielded wire interconnections . 96
Figure 15-10: Hand-soldered wire interconnections - details of defects . 97

Tables
Table 6-1: Chemical composition of spacecraft solders . 32
Table 6-2: Fluxes . 33
Table 7-1: Clearances for insulation . 39
Table 7-2: Solder baths for degolding and pretinning . 41
Table 9-1: Dimensions for Figure 9-9 . 71
Table 13-1: Sine survey . 82
Table 13-2: Minimum severity for sine vibration testing . 83
Table 13-3: Minimum severity for random vibration testing for all applications except
launchers . 83
Table 13-4: Minimum severity for random vibration testing for launcher . 83

Table B-1 : Guide to choice of solder types . 102

Foreword
This document (EN 16602-70-08:2015) has been prepared by Technical
Committee CEN/CLC/TC 5 “Space”, the secretariat of which is held by DIN.
This standard (EN 16602-70-08:2015) originates from ECSS-Q-ST-70-08C.
This European Standard shall be given the status of a national standard, either
by publication of an identical text or by endorsement, at the latest by July 2015,
and conflicting national standards shall be withdrawn at the latest by July 2015.
Attention is drawn to the possibility that some of the elements of this document
may be the subject of patent rights. CEN [and/or CENELEC] shall not be held
responsible for identifying any or all such patent rights.
This document has been prepared under a mandate given to CEN by the
European Commission and the European Free Trade Association.
This document has been developed to cover specifically space systems and has
therefore precedence over any EN covering the same scope but with a wider
domain of applicability (e.g. : aerospace).
According to the CEN-CENELEC Internal Regulations, the national standards
organizations of the following countries are bound to implement this European
Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France,
Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania,
Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania,
Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United
Kingdom.
Introduction
The main part of this Standard is based on recommendations from the National
Aeronautics and Space Administration and European soldering technology
experts. Modifications have been incorporated into the text to provide for the
specific requirement of low–outgassing electrical systems which are required by
scientific and application satellites. Other additions have been made in the light
of recent technological advances and the results of verification test
programmes. The methods and workmanship contained in this document are
considered to be fully approved for normal spacecraft requirements.
Scope
This Standard defines the technical requirements and quality assurance
provisions for the manufacture and verification of manually-soldered, high-
reliability electrical connections.
The Standard defines acceptance and rejection criteria for high reliability
manufacture of manually-soldered electrical connections intended to withstand
normal terrestrial conditions and the vibrational g-loads and environment
imposed by space flight.
The proper tools, correct materials, design and workmanship are covered by
this document. Workmanship standards are included to permit discrimination
between proper and improper work.
The assembly of surface-mount devices is covered in ECSS-Q-ST-70-38.
Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-10
and ECSS-Q-ST-70-11.
Verification of manual soldering assemblies which are not described in this
standard are performed by vibration and thermal cycling testing. The
requirements for verification are given in this Standard.
This standard does not cover the qualification and acceptance of EQM and FM
equipment with hand soldered connections.
The qualification and acceptance tests of equipment manufactured in
accordance with this Standard are covered by ECSS-E-ST-10-03.
The mounting and supporting of components, terminals and conductors
prescribed herein applies to assemblies designed to operate within the
temperature limits of −55 °C to +85 °C.
For temperatures outside this normal range, special design, verification and
qualification testing is performed to ensure the necessary environmental
survival capability.
Special thermal heat sinks are applied to devices having high thermal
dissipation (e.g. junction temperatures of 110 °C, power transistors) in order to
ensure that solder joints do not exceed 85 °C.
This standard may be tailored for the specific characteristic and constrains of a
space project in conformance with ECSS-S-ST-00.
Normative references
The following normative documents contain provisions which, through
reference in this text, constitute provisions of this ECSS Standard. For dated
references, subsequent amendments to, or revision of any of these publications
do not apply, However, parties to agreements based on this ECSS Standard are
encouraged to investigate the possibility of applying the more recent editions of
the normative documents indicated below. For undated references, the latest
edition of the publication referred to applies.

EN reference Reference in text Title
EN 16601-00-01 ECSS-S-ST-00-01 ECSS system - Glossary of terms
EN 16602-10-09 ECSS-Q-ST-10-09 Space product assurance - Nonconformance control
system
EN 16602-20 ECSS-Q-ST-20 Space product assurance - Quality assurance
EN 16602-70-02 ECSS-Q-ST-70-02 Space product assurance - Thermal vacuum
outgassing test for the screening of space materials
EN 16602-70-10 ECSS-Q-ST-70-10 Space product assurance - Qualification of printed
circuit boards
EN 16602-70-11 ECSS-Q-ST-70-11 Space product assurance - Procurement of printed
circuit boards
EN 16602-70-28 ECSS-Q-ST-70-28 Space product assurance - Repair and modification of
printed circuit board assemblies for space use
EN 16602-70-71 ECSS-Q-ST-70-71 Space product assurance - Data for selection of space
materials and processes
ESCC 23500 Requirements for lead materials and finishes for
components for space application
EN 61340-5-1 Protection of electronic devices from electrostatic
phenomena - General requirements
EN 61340-5-2 Protection of electronic devices from electrostatic
phenomena – User guide
MIL-STD-883 Rev.G Test methods and procedures for microelectronics

Terms, definitions and abbreviated terms
3.1 Terms from other standards
For the purpose of this Standard, the terms and definitions from ECSS-ST-00-01
apply.
For the purpose of this Standard, the following terms from ECSS-Q-ST-70-28
apply:
repair
rework
3.2 Terms specific to the present standard
3.2.1 approval authority
entity that reviews and accepts the verification programme, evaluating the test
results and grants the final approval
3.2.2 base laminate
see “substrate”
3.2.3 bifurcated (split) terminal
terminal containing a slot or split in which wires or leads are placed before
soldering
3.2.4 bit
removable heat store of a soldering iron
3.2.5 blister
delamination in a distinct local area or areas
3.2.6 bridging
build-up of solder or conformal coating between parts, component leads or base
substrate forming an elevated path
NOTE See “fillet”.
3.2.7 clinched-lead termination
conductor or component lead which passes through a printed circuit board and
is then bent to make contact with the printed circuit board pad
NOTE The clinched portion is not forced to lie flat on
the pad and some innate spring back is
desirable before this form of termination is
soldered.
3.2.8 cold flow
movement of insulation, for example Teflon (PTFE), caused by pressure
3.2.9 cold solder joint
joint in which the solder has a blocky, wrinkled or piled-up appearance and
shows signs of improper flow or wetting action
NOTE It can appear either shiny or dull, but not
granular. The joint normally has abrupt lines of
demarcation rather than a smooth, continuing
fillet between the solder and the surfaces being
joined. These lines are caused by either
insufficient application of heat or the failure of
an area of the surfaces being joined to reach
soldering temperature
3.2.10 component
device which performs an electronic, electrical or electromechanical function
and consists of one or more elements joined together and which cannot
normally be disassembled without destruction
NOTE 1 The terms component and part can be
interchanged.
NOTE 2 Transistors, integrated circuits, hybrids,
capacitors.
3.2.11 component lead
solid wire which extends from and serves as a connection to a component
3.2.12 conductor
lead or wire, solid or stranded, or printed circuit patch serving as an electrical
interconnection between terminations
3.2.13 conformal coating
thin protective coating which conforms to the configuration of the covered
assembly
3.2.14 connection
electrical termination
3.2.15 contact angle
angle enclosed between half-planes, tangent to a liquid surface and a solid-
liquid interface at their intersection
NOTE In particular, the contact angle of liquid solder
in contact with a solid metal surface. An
approximate value for this can be determined
by shadow projection or other means, by
measuring after the solder has solidified. The
contact angle is always the angle inside the
liquid
3.2.16 contamination
particles, liquids, gases, materials and micro-organisms which by their presence
can disturb the performance of an item
3.2.17 corrosion
deterioration of a metal by chemical or electrochemical reaction with its
environment
3.2.18 cracked solder joint
soldered connection which has fractured or broken within the solder
3.2.19 dewetting
condition in a soldered area in which the liquid solder has not adhered
intimately, characterized by an abrupt boundary between solder and conductor,
or solder and terminal/termination area
NOTE This is often seen as a dull surface with islands
of thicker shiny solder.
3.2.20 disturbed solder joint
unsatisfactory connection resulting from relative motion between the conductor
and termination during solidification of the solder
3.2.21 electrical connection
conductive connection in electrical or electronic circuits
3.2.22 eutectic alloy
alloy of two or more metals that has one distinct melting point
NOTE One eutectic solder is a tin-lead alloy containing
63 % Sn and 37 % Pb which melts at 183 °C
3.2.23 fillet
smooth concave build-up of material between two surfaces
NOTE Example: A fillet of solder between a
component lead and a solder pad or terminal,
or a fillet of conformal coating material between
a component and printed circuit board
3.2.24 flux
material which, during soldering, removes the oxide film, protects the surface
from oxidation, and permits the solder to wet the surfaces to be joined
3.2.25 flux activity
property of a flux which allows the smallest contact angle between molten
solder and a solid surface
NOTE See also “rosin”.
3.2.26 glass meniscus
glass fillet of a lead seal which occurs where an external lead leaves the package
body
3.2.27 haloing
condition existing in the base laminate of a printed circuit board in the form of a
light area around holes or other machined areas on or below the surface of the
laminate
3.2.28 hook terminal
terminal formed in a hook shape
3.2.29 icicles
see “solder icicle”
3.2.30 interfacial connection
conductor which connects conductive patterns between opposite sides of a
printed circuit board
NOTE Normally a plated-through hole.
3.2.31 lap joint
joining or fusing of two overlapping metal surfaces with solder without use of
any other mechanical attachment or support
3.2.32 measling/measles
condition existing in the base laminate of printed circuit board in the form of
discrete white spots or “crosses” below the surface of the base laminate,
reflecting a separation of fibres in the glass cloth at the weave intersection
NOTE During soldering this can be caused by
excessive heat.
3.2.33 multi-layer circuit board
product consisting of alternate laminates of printed circuit substrates and
insulators, bonded together by simultaneous application of heat and pressure
prior to drilling and plating holes for interconnections
NOTE See also “printed circuit board”.
3.2.34 pad
termination of a conducting surface on a printed circuit board to which leads
are soldered to form electrical connections
NOTE These can be described as either functional,
where an active track is terminated, or non-
functional, where the pad is isolated.
3.2.35 pits
small holes or sharp depressions in the surface of solder
NOTE This can be caused by flux blow-out due to
entrapment or overheating
3.2.36 plated-through hole
hole in which metal is deposited on the inside surface
NOTE 1 Adapted from IEC Multilingual dictionary.
NOTE 2 Also known as a supported hole. The
configuration is used to provide additional
mechanical strength to the soldered termination
or to provide an electrical interconnection on a
double-sided or multi-layer printed c
...