SIST EN IEC 62969-3:2018

SLOVENSKI STANDARD
01-september-2018
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Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock
driven piezoelectric energy harvesting for automotive vehicle sensors (IEC 62969-
3:2018)
Ta slovenski standard je istoveten z: EN IEC 62969-3:2018
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
43.040.10 (OHNWULþQDLQHOHNWURQVND Electrical and electronic
RSUHPD equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 62969-3

NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2018
ICS 31.080.99
English Version
Semiconductor devices - Semiconductor interface for automotive
vehicles - Part 3: Shock driven piezoelectric energy harvesting
for automotive vehicle sensors
(IEC 62969-3:2018)
Dispositifs à semiconducteurs - Interface à Halbleiterbauelemente - Halbleiterschnittstelle für
semiconducteurs pour les véhicules automobiles - Automobile - Teil 3: Stoßgeführtes piezoelektrisches
Partie 3: Récupération de l'énergie piézoélectrique produite Energie-Harvesting bei Sensoren für Automobile
par les chocs pour les capteurs de véhicules automobiles (IEC 62969-3:2018)
(IEC 62969-3:2018)
This European Standard was approved by CENELEC on 2018-06-11. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62969-3:2018 E

European foreword
The text of document 47/2461/FDIS, future edition 1 of IEC 62969-3, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 62969-3:2018.

The following dates are fixed:
(dop) 2019-03-11
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2021-06-11
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 62969-3:2018 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 62047-5:2011 NOTE Harmonized as EN 62047-5:2011 (not modified).
IEC 62047-7:2011 NOTE Harmonized as EN 62047-7:2011 (not modified).

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year

IEC 60749-5 -  Semiconductor devices - Mechanical and EN 60749-5 -
climatic test methods -
Part 5: Steady-state temperature humidity
bias life test
IEC 60749-10 -  Semiconductor devices - Mechanical and EN 60749-10 -
climatic test methods -
Part 10: Mechanical shock
IEC 60749-12 -  Semiconductor devices - Mechanical and EN IEC 60749-12 -
climatic test methods -
Part 12: Vibration, variable frequency
IEC 62830-1 -  Semiconductor devices - Semiconductor - -
devices for energy harvesting and
generation -
Part 1: Vibration based piezoelectric
energy harvesting
IEC 62969-3 ®
Edition 1.0 2018-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Semiconductor interface for automotive vehicles –

Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle

sensors
Dispositifs à semiconducteurs – Interface à semiconducteurs pour les véhicules

automobiles –
Partie 3: Récupération de l’énergie piézoélectrique produite par les chocs pour

les capteurs de véhicules automobiles

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-5685-5

– 2 – IEC 62969-3:2018 © IEC 2018
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
3.1 General terms . 8
3.2 Piezoelectric transducer . 9
3.3 Characteristic parameters . 10
4 Essential ratings and characteristic parameters . 11
4.1 Identification and type . 11
4.2 Limiting values and operating conditions . 11
4.3 Additional information . 12
5 Test method . 12
5.1 General . 12
5.2 Electrical characteristics . 13
5.2.1 Test procedure . 13
5.2.2 Capacitance . 14
5.2.3 Natural frequency . 14
5.2.4 Damping ratio . 15
5.2.5 Output voltage . 15
5.2.6 Output current . 16
5.2.7 Output power . 16
5.2.8 Optimal load impedance . 17
5.2.9 Maximum output power . 17
5.3 Mechanical characteristics . 18
5.3.1 Test procedure . 18
5.3.2 Temperature range . 19
5.3.3 Shock magnitude . 20
5.3.4 Temperature and humidity testing . 20
5.3.5 Mechanical reliability (shock) testing . 20
Annex A (informative) Mechanical shock pulses . 21
Annex B (informative) Electromechanical coupling . 23
B.1 Compliance and coupling coefficient relation. 23
B.2 Young’s modulus and coupling coefficient relation . 23
Bibliography . 24

Figure 1 – Shock driven energy harvester using cantilever with piezoelectric film . 8
Figure 2 – Conceptual diagram of shock driven piezoelectric energy harvester . 9
Figure 3 – Equivalent circuit of shock driven piezoelectric energy harvester . 10
Figure 4 – Measurement procedure of shock driven piezoelectric energy harvester . 13
Figure 5 – Test setup for the electrical characteristics of shock driven piezoelectric
energy harvester . 14
Figure 6 – Output waveform and its frequency component of a shock driven
piezoelectric energy harvester . 15
Figure 7 – Output voltages of shock excited piezoelectric energy harvester at various
external loads . 16

IEC 62969-3:2018 © IEC 2018 – 3 –
Figure 8 – Output currents of shock driven piezoelectric energy harvester at various
output voltages . 16
Figure 9 – Output power of shock driven piezoelectric energy harvester at various
external loads . 17
Figure 10 – Output power and voltage of shock driven piezoelectric energy harvester at
various shock amplitudes . 18
Figure 11 – Block diagram of a test setup for evaluating the reliability of shock driven
piezoelectric energy harvester . 19
Figure A.1 – Comparison of general shock patterns and shock pattern from automobile . 21
Figure A.2 – Impact (or shock) recorded by an electronic impact recorder . 22

Table 1 – Specification parameters for shock driven piezoelectric energy harvesters . 11

– 4 – IEC 62969-3:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES –

Part 3: Shock driven piezoelectric energy harvesting
for automotive vehicle sensors

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
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agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
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5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62969-3 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2461/FDIS 47/2480/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

IEC 62969-3:2018 © IEC 2018 – 5 –
A list of all parts in the IEC 62969 series, published under the general title Semiconductor
devices – Semiconductor interface for automotive vehicles, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 6 – IEC 62969-3:2018 © IEC 2018
INTRODUCTION
The IEC 62969 series is composed of four parts as follow:
• IEC 62969-1, Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 1: General requirements of power interface for automotive vehicle sensors
• IEC 62969-2, Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 2: Efficiency evaluation methods of wireless power transmission using resonance for
automotive vehicle sensors
• IEC 62969-3, Semiconductor devices – Semiconductor interface for automotive vehicles –
Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
• IEC 62969-4 , Semiconductor devices – Semiconductor interface for automotive vehicles
– Part 4: Evaluation method of data interface for automotive vehicle sensors
The IEC 62969 series covers power and data interfaces for sensors in automotive vehicles.
The first part covers general requirements of test conditions such as temperature, humidity,
vibration, etc for automotive sensor power interface. This part also includes various electrical
performances of power interface such as voltage drop from power source to automotive
sensors, noises, voltage level, etc. The second part covers “Efficiency evaluation methods of
wireless power transmission using resonance for automotive vehicle sensors “. The third part
covers “Shock driven piezoelectric energy harvesting for automotive vehicle sensors”. The
fourth part covers “Evaluation methods of data interface for automotive vehicle sensors”.

___________
To be published
IEC 62969-3:2018 © IEC 2018 – 7 –
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES –

Part 3: Shock driven piezoelectric energy harvesting
for automotive vehicle sensors

1 Scope
This part of IEC 62969 describes terms, definitions, symbols, configurations, and test
methods that can be used to evaluate and determine the performance characteristics of
mechanical shock driven piezoelectric energy harvesting devices for automotive vehicle
sensor applications.
This document is also applicable to energy harvesting devices for motorbikes, automobiles,
buses, trucks and their respective engineering subsystems applications without any limitations
of device technology and size.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60749-5, Semiconductor devices – Mechanical and climatic test methods – Part 5:
Steady-state temperature humidity bias life test
IEC 60749-10, Semiconductor devices – Mechanical and climatic test methods – Part 10:
Mechanical shock
IEC 60749-12, Semiconductor devices – Mechanical and climatic test methods – Part 12:
Vibration, variable frequency
IEC 62830-1, Semiconductor devices – Semiconductor devices for energy harvesting and
generation – Part 1: Vibration based piezoelectric energy harvesting
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 62830-1 and the
following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp

– 8 – IEC 62969-3:2018 © IEC 2018
3.1 General terms
3.1.1
shock
sudden acceleration or deceleration resulting in transient physical excitation; characterized by
the peak acceleration, the duration, and the shape of the shock pulse (rectangular, half-sine,
sawtooth, etc.)
Note 1 to entry: The fundamental frequency of the automotive vehicle shock is varied from 0,5 Hz to 20 Hz.
Note 2 to entry: Mechanical shock pulses are sinusoidal, rectangular, half-sine, sawtooth, etc. waves. Detailed
explanation of mechanical shock pulses with an analysis of shock amplitude and duration/frequency of automobile
and conventional shaker have been included in Annex A (informative).
3.1.2
shock driven energy harvester
generator that responds to the applied mechanical shock, transforms shock into vibration
(mechanical oscillation), and converts the vibration to the electricity
Note 1 to entry: The generated power depends on the characteristics of applied shock and, mechanical and
electrical characteristics of the generator itself.
Note 2 to entry: Shock energy harvester to convert shock to electricity by using piezoelectric transducers is
comprised of inertial mass, spring, and piezoelectric transducer as shown in Figure 1. The piezoelectric transducer
contains
...