EN IEC 62969-3:2018

SLOVENSKI STANDARD
01-september-2018
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Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock
driven piezoelectric energy harvesting for automotive vehicle sensors (IEC 62969-
3:2018)
Ta slovenski standard je istoveten z: EN IEC 62969-3:2018
ICS:
31.080.01 Polprevodniški elementi Semiconductor devices in
(naprave) na splošno general
43.040.10 (OHNWULþQDLQHOHNWURQVND Electrical and electronic
RSUHPD equipment
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.

EUROPEAN STANDARD EN IEC 62969-3

NORME EUROPÉENNE
EUROPÄISCHE NORM
June 2018
ICS 31.080.99
English Version
Semiconductor devices - Semiconductor interface for automotive
vehicles - Part 3: Shock driven piezoelectric energy harvesting
for automotive vehicle sensors
(IEC 62969-3:2018)
Dispositifs à semiconducteurs - Interface à Halbleiterbauelemente - Halbleiterschnittstelle für
semiconducteurs pour les véhicules automobiles - Automobile - Teil 3: Stoßgeführtes piezoelektrisches
Partie 3: Récupération de l'énergie piézoélectrique produite Energie-Harvesting bei Sensoren für Automobile
par les chocs pour les capteurs de véhicules automobiles (IEC 62969-3:2018)
(IEC 62969-3:2018)
This European Standard was approved by CENELEC on 2018-06-11. CENELEC members are bound to comply with the CEN/CENELEC
Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC
Management Centre or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the
same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic,
Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden,
Switzerland, Turkey and the United Kingdom.

European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels
© 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members.
Ref. No. EN IEC 62969-3:2018 E

European foreword
The text of document 47/2461/FDIS, future edition 1 of IEC 62969-3, prepared by IEC/TC 47
"Semiconductor devices" was submitted to the IEC-CENELEC parallel vote and approved by
CENELEC as EN IEC 62969-3:2018.

The following dates are fixed:
(dop) 2019-03-11
• latest date by which the document has to be
implemented at national level by
publication of an identical national
standard or by endorsement
• latest date by which the national (dow) 2021-06-11
standards conflicting with the
document have to be withdrawn
Attention is drawn to the possibility that some of the elements of this document may be the subject of
patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights.

Endorsement notice
The text of the International Standard IEC 62969-3:2018 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 62047-5:2011 NOTE Harmonized as EN 62047-5:2011 (not modified).
IEC 62047-7:2011 NOTE Harmonized as EN 62047-7:2011 (not modified).

Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications

The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any amendments)
applies.
NOTE 1  Where an International Publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
NOTE 2  Up-to-date information on the latest versions of the European Standards listed in this annex is available here:
www.cenelec.eu.
Publication Year Title EN/HD Year

IEC 60749-5 -  Semiconductor devices - Mechanical and EN 60749-5 -
climatic test methods -
Part 5: Steady-state temperature humidity
bias life test
IEC 60749-10 -  Semiconductor devices - Mechanical and EN 60749-10 -
climatic test methods -
Part 10: Mechanical shock
IEC 60749-12 -  Semiconductor devices - Mechanical and EN IEC 60749-12 -
climatic test methods -
Part 12: Vibration, variable frequency
IEC 62830-1 -  Semiconductor devices - Semiconductor - -
devices for energy harvesting and
generation -
Part 1: Vibration based piezoelectric
energy harvesting
IEC 62969-3 ®
Edition 1.0 2018-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Semiconductor interface for automotive vehicles –

Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle

sensors
Dispositifs à semiconducteurs – Interface à semiconducteurs pour les véhicules

automobiles –
Partie 3: Récupération de l’énergie piézoélectrique produite par les chocs pour

les capteurs de véhicules automobiles

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-5685-5

– 2 – IEC 62969-3:2018 © IEC 2018
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
3.1 General terms . 8
3.2 Piezoelectric transducer . 9
3.3 Characteristic parameters . 10
4 Essential ratings and characteristic parameters . 11
4.1 Identification and type . 11
4.2 Limiting values and operating conditions . 11
4.3 Additional information . 12
5 Test method . 12
5.1 General . 12
5.2 Electrical characteristics . 13
5.2.1 Test procedure . 13
5.2.2 Capacitance . 14
5.2.3 Natural frequency . 14
5.2.4 Damping ratio . 15
5.2.5 Output voltage . 15
5.2.6 Output current . 16
5.2.7 Output power . 16
5.2.8 Optimal load impedance . 17
5.2.9 Maximum output power . 17
5.3 Mechanical characteristics . 18
5.3.1 Test procedure . 18
5.3.2 Temperature range . 19
5.3.3 Shock magnitude . 20
5.3.4 Temperature and humidity testing . 20
5.3.5 Mechanical reliability (shock) testing . 20
Annex A (informative) Mechanical shock pulses . 21
Annex B (informative) Electromechanical coupling . 23
B.1 Compliance and coupling coefficient relation. 23
B.2 Young’s modulus and coupling coefficient relation . 23
Bibliography . 24

Figure 1 – Shock driven energy harvester using cantilever with piezoelectric film . 8
Figure 2 – Conceptual diagram of shock driven piezoelectric energy harvester . 9
Figure 3 – Equivalent circuit of shock driven piezoelectric energy harvester . 10
Figure 4 – Measurement procedure of shock driven piezoelectric energy harvester . 13
Figure 5 – Test setup for the electrical characteristics of shock driven piezoelectric
energy harvester . 14
Figure 6 – Output waveform and its frequency component of a shock driven
piezoelectric energy harvester . 15
Figure 7 – Output voltages of shock excited piezoelectric energy harvester at various
external loads . 16

IEC 62969-3:2018 © IEC 2018 – 3 –
Figure 8 – Output currents of shock driven piezoelectric energy harvester at various
output voltages . 16
Figure 9 – Output power of shock driven piezoelectric energy harvester at various
external loads . 17
Figure 10 – Output power and voltage of shock driven piezoelectric energy harvester at
various shock amplitudes . 18
Figure 11 – Block diagram of a test setup for evaluating the reliability of shock driven
piezoelectric energy harvester . 19
Figure A.1 – Comparison of general shock patterns and shock pattern from automobile . 21
Figure A.2 – Impact (or shock) recorded by an electronic impact recorder . 22

Table 1 – Specification parameters for shock driven piezoelectric energy harvesters . 11

– 4 – IEC 62969-3:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES –

Part 3: Shock driven piezoelectric energy harvesting
for automotive vehicle sensors

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
...