IEC 60191-6-19:2010

IEC 60191-6-19 ®
Edition 1.0 2010-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Mechanical standardization of semiconductor devices –
Part 6-19: Measurement methods of the package warpage at elevated
temperature and the maximum permissible warpage

Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-19: Méthodes de mesure du gauchissement des boîtiers à température
élevée et du gauchissement maximum admissible

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IEC 60191-6-19 ®
Edition 1.0 2010-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Mechanical standardization of semiconductor devices –
Part 6-19: Measurement methods of the package warpage at elevated
temperature and the maximum permissible warpage

Normalisation mécanique des dispositifs à semiconducteurs –
Partie 6-19: Méthodes de mesure du gauchissement des boîtiers à température
élevée et du gauchissement maximum admissible

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
M
CODE PRIX
ICS 31.080.01 ISBN 978-2-88910-066-8
– 2 – 60191-6-19 © IEC:2010
CONTENTS
FOREWORD.3
1 Scope.5
2 Normative references .5
3 Terms and definitions .5
4 Sample.9
4.1 Sample size .9
4.2 Solder ball removal .9
4.3 Pretreatment conditions.9
4.4 Maximum time after pretreatment until measurement.9
4.5 Repetition of the reflow cycles for the sample.9
5 Measurement .9
5.1 General description .9
5.2 Temperature profile and the temperatures for measurements .9
5.3 Measurement method.10
5.3.1 Shadow moiré method .10
5.3.2 Laser reflection method .10
5.3.3 Data analysis (Data table, Diagonal scan graph, 3D plot graph).11
6 Maximum permissible package warpage at elevated temperature .11
7 Recommended datasheet for the package warpage.11
7.1 Measurement temperatures for data sheet .11
7.2 Datasheet.11
7.3 Example of datasheets .12

Figure 1 – Measuring area of BGA and FBGA in full grid layout .6
Figure 2 – Measuring area of BGA and FBGA perimeter layout with 4 rows and 4
columns .6
Figure 3 – Measuring area of FLGA perimeter layout with 4 rows and 4 columns .7
Figure 4 – Calculation of the sign of package warpage .8
Figure 5 – Package warpage .8
Figure 6 – Thermocouple placement .10
Figure 7 – Temperature dependency of the package warpage .12
Figure 8 – Recommended datasheet.13

Table 1 – Maximum permissible package warpages for BGA and FBGA.11
Table 2 – Maximum permissible package warpages for FLGA.11

60191-6-19 © IEC:2010 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-19: Measurement methods of the package warpage
at elevated temperature and the maximum permissible warpage

FOREWORD
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International Standard IEC 60191-6-19 has been prepared by subcommittee 47D: Mechanical
standardization for semiconductor devices, of IEC technical committee 47: Semiconductor
devices.
This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition
constitutes a technical revision.
The text of this standard is based on the following documents:
FDIS Report on voting
47D/757/FDIS 47D/764/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

– 4 – 60191-6-19 © IEC:2010
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 60191 series, under the general title Mechanical
standardization of semiconductor devices, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
60191-6-19 © IEC:2010 – 5 –
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES –

Part 6-19: Measurement methods of the package warpage
at elevated temperatur
...