IEC 61188-5-3:2007

IEC 61188-5-3 ®
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed boards and printed board assemblies – Design and use –
Part 5-3: Attachment (land/joint) considerations – Components with gull-wing
leads on two sides
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –
Partie 5-3: Considérations sur les liaisons pistes-soudures – Composants à
sorties en aile de mouette sur deux côtés

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IEC 61188-5-3 ®
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed boards and printed board assemblies – Design and use –
Part 5-3: Attachment (land/joint) considerations – Components with gull-wing
leads on two sides
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –
Partie 5-3: Considérations sur les liaisons pistes-soudures – Composants à
sorties en aile de mouette sur deux côtés

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
U
CODE PRIX
ICS 31.180 ISBN 978-2-88910-433-8
– 2 – 61188-5-3 © IEC:2007
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 Scope.7
2 Normative references .7
3 General information.7
3.1 General component description .7
3.2 Marking .7
3.3 Carrier packaging format .7
3.4 Process considerations .7
4 TSOP (Type 1) .8
4.1 Field of application .8
4.2 Component description.8
4.3 Component dimensions .8
4.4 Solder joint fillet design .9
4.5 Land pattern dimensions .11
5 TSOP (Type 2) .13
5.1 Field of application .13
5.2 Component description.13
5.3 Component dimensions .13
5.4 Solder joint fillet design .14
5.5 Land pattern dimensions .16
6 SOP .18
6.1 Field of application .18
6.2 Component description.18
6.3 Component dimensions .18
6.4 Solder joint fillet design .19
6.5 Land pattern dimensions .21
7 SSOP .23
7.1 Field of application .23
7.2 Component description.23
7.3 Component dimensions .24
7.4 Solder joint fillet design .24
7.5 Land pattern dimensions .26
Bibliography.29

Figure 1 – TSOP (Type 1) construction .8
Figure 2 – TSOP (Type 1) – Component dimensions.9
Figure 3 – Solder joint fillet design (see IEC 61188-5-1, Tables 2 and 3) .11
Figure 4 – TSOP (Type 1) – Land pattern dimensions.13
Figure 5 – TSOP (Type 2) construction .13
Figure 6 – TSOP (Type 2) – Component dimensions.14
Figure 7 – Solder joint fillet design (see IEC 61188-5-1, Tables 2 and 3) .16
Figure 8 – TSOP (Type 2) – Land pattern dimensions.18
Figure 9 – SOPIC construction.18
Figure 10 – SOP component dimensions .19

61188-5-3 © IEC:2007 – 3 –
Figure 11 – Solder joint fillet design (see IEC 61188-5-1, Table 2).21
Figure 12 – SOP Land pattern dimensions .23
Figure 13 – SSOP construction .23
Figure 14 – Component dimensions .24
Figure 15 – Solder joint fillet design (see IEC 61188-5-1, Table 2).26
Figure 16 – Land pattern dimensions .28

– 4 – 61188-5-3 © IEC:2007
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-3: Attachment (land/joint) considerations –
Components with gull-wing leads on two sides

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61188-5-3 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/702/FDIS 91/734/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This bilingual version, published in 2009-09, corresponds to the English version.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

61188-5-3 © IEC:2007 – 5 –
IEC 61188-5-3 is to be read in conjunction with IEC 61188-5-1.
The French version of this standard has not been voted upon.
A list of all parts of the IEC 61188 series, under the general title Printed boards and printed
board assemblies – Design and use, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
– 6 – 61188-5-3 © IEC:2007
INTRODUCTION
This part of IEC 61188 covers land patterns for components with gull-wing leads on two sides.
Each clause contains information in accordance with the following format:
The proposed land pattern dimensions in this standard are based upon the fundamental
tolerance calculation combined with the given land protrusions and courtyard excesses (see
IEC 61188-5-1, Generic requirements). The courtyard includes all issues of the normal
manufacturing necessities.
The unaltered land pattern dimensions of this part are generally applicable for the solder
paste application plus reflow soldering process. For application of the wave soldering process,
the land pattern dimensions normally have to be modified. Orientation parallel to the wave
direction is preferable and special, suitably dimensioned solder thieves should be added.
This standard offers a threefold land pattern dimensioning (levels 1, 2, and 3) on the basis of
a threefold set of land protrusions and courtyard excesses: maximum (max.); median (mdn)
and minimum (min.). Each land pattern has been assigned an identification number to indicate
the characteristics of the specific robustness of the land patterns. Users also have the
opportunity to organize the information so that it is most useful for their particular design.
If a user has good reason to use a concept different from that of IEC 61188-5-1 or if the user
prefers unusual land protrusions, this standard should be used for checking the resulting
solder fillet size.
It is the responsibility of the user to verify the SMD land patterns used for achieving an
undisturbed mounting process including testing and an ensured reliability for the product
stress conditions in use.
Component dimensions listed in this standard are those available on the market and regarded
as for reference only.
61188-5-3 © IEC:2007 – 7 –
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-3: Attachment (land/joint) considerations –
Components with gull-wing leads on two sides

1 Scope
This part of IEC 61188 provides information on land pattern geometries used for the surface
attachment of electronic components with gull-wing leads on two sides. The intent of the
information presented herein is to provide the appropriate size, shape and tolerances of
surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also
allow for inspection, testing and reworking of those solder joints.
Each clause contains a specific set of criteria such that the information presented is
consistent, providing information on the component, the component dimensions, the solder
joint design, and the land pattern dimensions.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61188-5-1:2002, Printed boards and printed board assemblies – Design and use – Part 5-
1: Attachment (land/joint) considerations – Generic requirements
3 General information
3.1 General component description
The acronyms TSOP (thin small outline package), SOP (small outline package) and SSOP
(shrink small outline package) are also used to describe the family.
3.2 Marking
The TSOP, SOP and SSOP families of parts are generally marked with the manufacturer’s
part numbers, manufacturer’s name or symbol, and a pin 1 indicator. Some parts may have a
pin 1 feature in the case shape instead of pin 1 marking. Additional markings may include
date-code manufacturing lot and/or manufacturing location.
3.3 Carrier packaging format
Carrier packaging format may be provided in a tray carrier, but tape and reel carriers are
preferred for best handling and high volume applications. Bulk packaging is not acceptable
because of lead co-planarity required for placement and soldering.
3.4 Process considerations
TSOP, SOP and SSOP packages are normally processed by reflow solder operations.
The land pattern dimensions are based on a mathematical model that establishes a platform
for a solder joint attachment to the printed board. The existing models create a platform that is

– 8 – 61188-5-3 © IEC:2007
capable of establishing a reliable solder joint no matter what solder alloy is used to make that
joint (lead-free, tin lead, etc.)
Process requirements for solder reflow are different based on the solder alloy and should be
analyzed in order that the process is above the liquidus temperature of the alloy, and remains
above that temperature a sufficient time to form a reliable metallurgical bond.
4 TSOP (Type 1)
4.1 Field of application
This clause provides the component and land pattern dimensions for TSOP (Type 1)
components. Basic construction is also covered. Subclause 4.4 lists the tolerances and target
solder joint dimensions used to arrive at the land pattern dimensions.
4.2 Component description
Figure 1 shows a typical construction example.

IEC  2009/07
Figure 1 – TSOP (Type 1) construction
4.3 Component dimensions
Figure 2 shows the component dimensions for TSOP (Type 1) components.
Land pattern dimensional data may need to be adjusted if the component dimensional data
does not match JEDEC and/or JEITA data sheets.

61188-5-3 © IEC:2007 – 9 –
L
S
T
B
IEC  2010/07
Dimensions in millimetres
Component Pin L W T S* A B H P
identification count
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Max. Basic
0,27 0,40
TSOP 6x14 16 13,8 14,2 0,17 0,75 12,3 12,94 5,80 6,20 12,2 12,6 1,20 0,65
TSOP 6x16 24 15,8 16,2 0,17 0,23 0,40 0,75 14,3 14,94 5,80 6,20 14,2 14,6 1,20 0,5
TSOP 6x18 28 17,8 18,2 0,13 0,19 0,40 0,75 16,3 16,94 5,80 6,20 16,2 16,6 1,20 0,4
0,15 0,40
TSOP 6x20 36 19,8 20,2 0,09 0,75 18,3 18,94 5,80 6,20 18,2 18,6 1,20 0,3
0,27 0,40
TSOP 8x14 24 13,8 14,2 0,17 0,75 12,3 12,94 7,80 8,20 12,2 12,6 1,20 0,65
TSOP 8x16 32 15,8 16,2 0,17 0,23 0,40 0,75 14,3 14,94 7,80 8,20 14,2 14,6 1,20 0,5
0,19 0,40
TSOP 8x18 40 17,8 18,2 0,13 0,75 16,3 16,94 7,80 8,20 16,2 16,6 1,20 0,4
0,15 0,40
TSOP 8x20 52 19,8 20,2 0,09 0,75 18,3 18,94 7,80 8,20 18,2 18,6 1,20 0,3
TSOP 10x14 28 13,8 14,2 0,17 0,27 0,40 0,75 12,3 12,94 9,80 10,20 12,2 12,6 1,20 0,65
0,23 0,40
TSOP 10x16 40 15,8 16,2 0,17 0,75 14,3 14,94 9,80 10,20 14,2 14,6 1,20 0,5
0,19 0,40
TSOP 10x18 48 17,8 18,2 0,13 0,75 16,3 16,94 9,80 10,20 16,2 16,6 1,20 0,4
0,15 0,40
TSOP 10x20 64 19,8 20,2 0,09 0,75 18,3 18,94 9,80 10,20 18,2 18,6 1,20 0,3
TSOP 12x14 36 13,8 14,2 0,17 0,27 0,40 0,75 12,3 12,94 11,80 12,20 12,2 12,6 1,20 0,65
0,23 0,40
TSOP 12x16 48 15,8 16,2 0,17 0,75 14,3 14,94 11,80 12,20 14,2 14,6 1,20 0,5
0,19 0,40
TSOP 12x18 60 17,8 18,2 0,13 0,75 16,3 16,94 11,80 12,20 16,2 16,6 1,20 0,4
TSOP 12x20 76 19,8 20,2 0,09 0,15 0,40 0,75 18,3 18,94 11,80 12,20 18,2 18,6 1,20 0,3
* Calculated value.
Figure 2 – TSOP (Type 1) – Component dimensions
4.4 Solder joint fillet design
Figure 3 shows the dimensions of the solder fillet after the soldering process. The minimum,
median and maximum dimensions of each of toe, heel and side fillet are determined by taking
into consideration solder joint reliability and also quality and productivity in the mounting
process of parts.
In designing land patterns, three accuracy factors need to be taken into consideration:
– parts dimensions accuracy (C);
– parts mount accuracy on PWBs (P);
– land shape accuracy of PWBs (F),
in addition to fillet dimensions. The formulae to obtain the tolerance resulting from these
factors are basically as follows:
a) Design consideration when soldered without self-alignment effect (Level 1)
In the flow soldering process, there is no self-alignment effect. Thus, the formulae cannot
be simplified but remain the same, as follows:
W
P
A
– 10 – 61188-5-3 © IEC:2007
2 2 2
T = + +
Zmax = Lmin + 2J max + T
F P C
T L1 L1 L
T T
2 2 2
Gmin = Smax (rms) – 2J max – T T = + +
F P C
H H H L1 L1 S
2 2 2
Xmax = Wmin + 2J max + T T = + +
F P C
S S S L1 L1 W
b) Design consideration when soldered without self-alignment effect (Level 2)
2 2 2
Zmax = Lmin + 2J mdn + T T = + +
F P C
L2 L2 L
T T T
2 2 2
Gmin = Smax(rms) – 2J mdn – T T = + +
F P C
L2 L2 S
H H H
2 2 2
Xmax = Wmin + 2J mdn + T T = + +
F P C
L2 L2 W
S S S
c) Design consideration when soldered with self-alignment effect (Level 3)

2 2 2
T = + +
Zmax = Lmin + 2J min + T
F P C
T L3 L3 L
T T
2 2 2
T = + +
Gmin = Smax(rms) – 2J min – T
F P C
H L3 L3 S
H H
2 2 2
Xmax = Wmin + 2 J min + T T = + +
F P C
S S S L3 L3 W
In the reflow soldering process, there is a self-alignment effect. In the surface mount process
of reflow soldering, parts mount displacement when soldered can be cancelled by self-
alignment effect (therefore factor P can be regarded as 0). In addition, the tolerance of the
land shape accuracy of PWBs is about ±30 μm, and this is extremely small when compared
with that of the parts dimensions accuracy (therefore factor F can be regarded also as 0).
Thus, the formulae can be simplified as follows:
T = C Zmax = Lmin + 2J min + C = Lmax + 2J min
T L, T L T
T = C Gmin = Smax (rms) – 2J min – C
H S, H S
T = C Xmax = Wmin + 2J min + C = Wmax + 2J min
S W, S W S
In addition, the value Gmin ≥ B is also necessary so that the land should not be hidden under
the TSOP. The stand-off of the component mould is nearly zero. The land pattern design
should be made to prevent the lead from floating caused by the solder under the component.
Any tolerance other than the above may be used depending on the soldering strength
required, the capability of the production process used, and so on.

61188-5-3 © IEC:2007 – 11 –
J J
T S W
J
Zmax.
H Xmax.
IEC  2011/07
Dimensions in millimetres
Solder joint
Tolerance
assumptions
Toe Heel Side
Component
F P J J J
T H S
L-1/L- L-1/L-
C Max. Mdn Min. C Max. Mdn Min. C Max. Mdn Min.
L S W
2/L-3 2/L-3
0,65 0,10 0,10 0,4 0,55 0,35 0,15 0,64 0,50 0,35 0,20 0,10 0,05 0,0 0,0
0,50 0,10 0,10 0,4 0,55 0,35 0,15 0,64 0,20 0,20 0,20 0,06 0,0 0,0 0,0
0,40 0,10 0,10 0,4 0,55 0,35 0,15 0,64 0,20 0,20 0,20 0,06 0,0 0,0 0,0
0,30 0,10 0,10 0,4 0,55 0,35 0,15 0,64 0,20 0,20 0,20 0,06 0,0 0,0 0,0
Figure 3 – Solder joint fillet design (see IEC 61188-5-1, Tables 2 and 3)
4.5 Land pattern dimensions
Figure 4 shows the land pattern dimensions for TSOP (Type 1) for reflow and flow soldering.
These values are calculated based on the formula for the solder joint fillet design of 4.4.
The courtyard is calculated using the following formula and rounded up (round up factor is to
the nearest 0,05 mm for minimum values and to the nearest 0,5 mm for maximum values).
2 2 2
CY = (Amin + F + P + C ) + (courtyard excess × 2)
A
2 2 2
CY = {whichever larger [Lmin + F + P + C ] or [Z]} + (courtyard excess × 2)
L
CY2
Courtyard
C
G Y
Z
IEC  2012/07
CY1
D
P W
– 12 – 61188-5-3 © IEC:2007
Dimensions in millimetres
Level 1
Pattern Component
Z G X Y C D P CY1 CY2
identifier identifier
3000M TSOP 6x14 15,4 12,4 0,35 1,5 13,9 3,9 0,65 8,0 17,0
3001M TSOP 6x16 17,4 14,4 0,33 1,5 15,9 3,5 0,50 8,0 19,0
3002M TSOP 6x18 19,4 16,4 0,29 1,5 17,9 3,2 0,40 8,0 21,0
3004M TSOP 8x14 15,4 12,4 0,35 1,5 13,9 3,9 0,65 10,0 17,0
3005M TSOP 8x16 17,4 14,4 0,33 1,5 15,9 3,5 0,50 10,0 19,0
3006M TSOP 8x18 19,4 16,4 0,29 1,5 17,9 3,2 0,40 10,0 21,0
3008M TSOP 10x14 15,4 12,4 0,35 1,5 13,9 3,9 0,65 12,0 17,0
3009M TSOP 10x16 17,4 14,4 0,33 1,5 15,9 3,5 0,50 12,0 19,0
3010M TSOP 10x18 19,4 16,4 0,29 1,5 17,9 3,2 0,40 12,0 21,0
3012M TSOP 12x14 15,4 12,4 0,35 1,5 13,9 3,9 0,65 14,0 17,0
3013M TSOP 12x16 17,4 14,4 0,33 1,5 15,9 3,5 0,50 14,0 19,0
3014M TSOP 12x18 19,4 16,4 0,29 1,5 17,9 3,2 0,40 14,0 21,0
Level 2
Pattern Component
Z G X Y C D P CY1 CY2
identifier identifier
3000N TSOP 6x14 15,0 12,4 0,35 1,3 13,7 3,9 0,65 7,0 15,5
3001N TSOP 6x16 17,0 14,4 0,33 1,3 15,7 3,5 0,50 7,0 17,5
3002N TSOP 6x18 19,0 16,4 0,29 1,3 17,7 3,2 0,40 7,0 19,5
3004N TSOP 8x14 15,0 12,4 0,35 1,3 13,7 3,9 0,65 9,0 15,5
3005N TSOP 8x16 17,0 14,4 0,33 1,3 15,7 3,5 0,50 9,0 17,5
3006N TSOP 8x18 19,0 16,4 0,29 1,3 17,7 3,2 0,40 9,0 19,5
3008N TSOP 10x14 15,0 12,4 0,35 1,3 13,7 3,9 0,65 11,0 15,5
3009N TSOP 10x16 17,0 14,4 0,33 1,3 15,7 3,5 0,50 11,0 17,5
3010N TSOP 10x18 19,0 16,4 0,29 1,3 17,7 3,2 0,40 11,0 19,5
3012N TSOP 12x14 15,0 12,4 0,35 1,3 13,7 3,9 0,65 13,0 15,5
3013N TSOP 12x16 17,0 14,4 0,33 1,3 15,7 3,5 0,50 13,0 17,5
3014N TSOP 12x18 19,0 16,4 0,29 1,3 17,7 3,2 0,40 13,0 19,5

61188-5-3 © IEC:2007 – 13 –
Level 3
Pattern Component
Z G X* Y C D P CY1 CY2
identifier identifier
3000L TSOP 6x14 14,50 12,40 0,30 1,05 13,45 3,90 0,65 6,5 14,7
3001L TSOP 6x16 16,50 14,40 0,25 1,05 15,45 3,50 0,50 6,5 16,7
3002L TSOP 6x18 18,50 16,40 0,20 1,05 17,45 3,20 0,40 6,5 18,7
3003L TSOP 6x20 20,50 18,40 0,15 1,05 19,45 2,70 0,30 6,5 20,7
3004L TSOP 8x14 14,50 12,40 0,30 1,05 13,45 3,90 0,65 8,5 14,7
3005L TSOP 8x16 16,50 14,40 0,25 1,05 15,45 3,50 0,50 8,5 16,7
3006L TSOP 8x18 18,50 16,40 0,20 1,05 17,45 3,20 0,40 8,5 18,7
3007L TSOP 8x20 20,50 18,40 0,15 1,05 19,45 2,70 0,30 8,5 20,7
3008L TSOP 10x14 14,50 12,40 0,30 1,05 13,45 3,90 0,65 10,5 14,7
3009L TSOP 10x16 16,50 14,40 0,25 1,05 15,45 3,50 0,50 10,5 16,7
3010L TSOP 10x18 18,50 16,40 0,20 1,05 17,45 3,20 0,40 10,5 18,7
3011L TSOP 10x20 20,50 18,40 0,15 1,05 19,45 2,70 0,30 10,5 20,7
3012L TSOP 12x14 14,50 12,40 0,30 1,05 13,45 3,90 0,65 12,5 14,7
3013L TSOP 12x16 16,50 14,40 0,25 1,05 15,45 3,50 0,50 12,5 16,7
3014L TSOP 12x18 18,50 16,40 0,20 1,05 17,45 3,20 0,40 12,5 18,7
3015L TSOP 12x20 20,50 18,40 0,15 1,05 19,45 2,70 0,30 12,5 20,7
* When the X dimension is used, it is necessary to confirm whether the space between adjacent land patterns is
proper.
Figure 4 – TSOP (Type 1) – Land pattern dimensions
5 TSOP (Type 2)
5.1 Field of application
This clause provides the component and land pattern dimensions for TSOPs (Type 2). Basic
construction of the TSOP device is also covered. Subclause 5.4 lists the tolerances and target
solder joint dimensions used to arrive at the land pattern dimensions.
5.2 Component description
Figure 5 shows a typical construction example.

IEC  2013/07
Figure 5 – TSOP (Type 2) construction
5.3 Component dimensions
Figure 6 shows the component dimensions for TSOP (Type 2) components.

– 14 – 61188-5-3 © IEC:2007
Land pattern dimensional data may need to be adjusted if the component dimensional data
does not match JEDEC and/or JEITA data sheets.

A
W
P
IEC  2014/07
Dimensions in millimetres
Component Pin L W T S* A B H P
identification count
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Max. Basic
TSOP 300mil 26 9,02 9,42 0,35 0,45 0,45 0,75 7,52 8,10 16,94 17,34 7,42 7,82 1,20 1,27
TSOP 300mil 44 9,02 9,42 0,25 0,35 0,45 0,75 7,52 8,10 18,21 18,61 7,42 7,82 1,20 0,80
0,45 0,75
TSOP 300mil 42 9,02 9,42 0,17 0,27 7,52 8,10 14,40 14,80 7,42 7,82 1,20 0,65
TSOP 350mil 26 10,29 10,69 0,35 0,45 0,45 0,75 8,79 9,37 16,94 17,34 8,69 9,09 1,20 1,27
TSOP 400mil 28 11,56 11,96 0,35 0,45 0,45 0,75 10,06 10,64 18,21 18,61 9,96 10,36 1,20 1,27
TSOP 400mil 44 11,56 11,96 0,25 0,35 0,45 0,75 10,06 10,64 18,21 18,61 9,96 10,36 1,20 0,80
TSOP 400mil 54 11,56 11,96 0,17 0,27 0,45 0,75 10,06 10,64 18,21 18,61 9,96 10,36 1,20 0,65
TSOP 400mil 70 11,56 11,96 0,17 0,23 0,45 0,75 10,06 10,64 18,21 18,61 9,96 10,36 1,20 0,50
TSOP 500mil 48 14,10 14,50 0,25 0,35 0,45 0,75 12,6 13,18 19,48 19,88 12,50 12,90 1,20 0,80
TSOP 0130 66 13,30 13,70 0,17 0,27 0,45 0,75 11,8 12,38 21,80 22,20 11,30 11,70 1,20 0,65
TSOP 0130 86 13,30 13,70 0,17 0,23 0,45 0,75 11,8 12,38 21,80 22,20 11,30 11,70 1,20 0,50
TSOP 0145 78 16,30 16,70 0,17 0,27 0,45 0,75 14,8 15,8 25,55 25,95 14,30 14,70 1,20 0,65
0,45 0,75
TSOP 0160 40 17,80 18,20 0,35 0,45 16,3 16,88 25,55 25,95 15,80 16,20 1,20 1,25
TSOP 0160 62 17,80 18,20 0,25 0,35 0,45 0,75 16,3 16,88 25,55 25,95 15,80 16,20 1,20 0,80
TSOP 0160 88 17,80 18,20 0,17 0,27 0,45 0,75 16,3 16,88 29,30 29,70 15,80 16,20 1,20 0,65
* Calculated value.
Figure 6 – TSOP (Type 2) – Component dimensions
5.4 Solder joint fillet design
Figure 7 shows dimensions of the solder fillet after soldering process. The minimum, median,
and maximum dimensions of each of toe, heel, and side fillet are determined by taking into
consideration solder joint reliability, and also quality and productivity in the mounting process
of parts.
In designing land patterns, three accuracy factors need to be taken into consideration:
– parts dimensions accuracy (C);
– parts mount accuracy on PWBs (P);
– land shape accuracy of PWBs (F);
B
T
S
L
61188-5-3 © IEC:2007 – 15 –
in addition to fillet dimensions. The formulae to obtain the tolerance resulting from these
factors are basically as follows:
a) Design consideration when soldered without self-alignment effect (Level 1)
In the flow soldering process, there is no self-alignment effect. Thus, the formulae cannot
be simplified but remain the same as follows:
2 2 2
Zmax = Lmin + 2J max + T T = + +
C
F P
T T T L1 L1 L
2 2 2
Gmin = Smax (rms) – 2J max – T T = + +
C
F P
H H H L1 L1 S
2 2 2
Xmax = Wmin + 2J max + T T = + +
C
FL1 PL1 W
S S S
b) Design consideration when soldered without self-alignment effect (Level 2)

2 2 2
Zmax = Lmin + 2J mdn + T T = + +
F P C
T T T L2 L2 L
2 2 2
Gmin = Smax(rms) – 2J mdn – T T = + +
F P C
H H H L2 L2 S
2 2 2
Xmax = Wmin + 2J mdn + T T = + +
F P C
S S S L2 L2 W
c) Design consideration when soldered with self-alignment effect (Level 3)
2 2 2
Zmax = Lmin + 2J min + T T = + +
F P C
L3 L3 L
T T T
2 2 2
Gmin = Smax(rms) – 2J min – T T = + +
F P C
L3 L3 S
H H H
2 2 2
Xmax = Wmin + 2 J min + T T = + +
F P C
L3 L3 W
S S S
In the reflow soldering process, there is a self-alignment effect. In the surface mount process
of reflow soldering, parts mount displacement when soldered can be cancelled by self-
alignment effect (therefore factor P can be regarded as 0). In addition, the tolerance of the
land shape accuracy of PWBs is about ±30 μm, and this is extremely small when compared
with that of the parts dimensions accuracy (therefore factor F can be regarded also as 0).
Thus, the formulae can be simplified as follows:
T = C Zmax = Lmin + 2J min + C = Lmax + 2J min
T L, T L T
T = C Gmin = Smax (rms) – 2J min – C
H S, H S
T = C Xmax = Wmin + 2J min + C = Wmax + 2J min
S W, S W S
In addition, the value Gmin ≥ B is also necessary so that the land should not be hidden under
the TSOP. The stand-off of the component mould is nearly zero. The land pattern design
should be made to prevent the lead from floating caused by the solder under the component.
Any tolerance other than the above may be used depending on the soldering strength
required, the capability of the production process used, and so on.

– 16 – 61188-5-3 © IEC:2007
J J
T S W
J
Zmax.
H Xmax.
IEC  2011/07
Dimensions in millimetres
Solder joint
Tolerance
assumptions
Toe Heel Side
Component
F P J J J
T H S
L-1/L- L-1/L-
C Max. Mdn Min. C Max. Mdn Min. C Max. Mdn Min.
L S W
2/L-3 2/L-3
1,27 0,10 0,10 0,4 0,55 0,35 0,15 0,58 0,50 0,35 0,20 0,10 0,05 0,0 0,0
1,25 0,10 0,10 0,4 0,55 0,35 0,15 0,58 0,50 0,35 0,20 0,10 0,05 0,0 0,0
0,80 0,10 0,10 0,4 0,55 0,35 0,15 0,58 0,50 0,35 0,20 0,10 0,05 0,0 0,0
0,65 0,10 0,10 0,4 0,55 0,35 0,15 0,58 0,50 0,35 0,20 0,10 0,05 0,0 0,0
0,50 0,10 0,10 0,4 0,55 0,35 0,15 0,58 0,20 0,20 0,20 0,06 0,0 0,0 0,0
Figure 7 – Solder joint fillet design (see IEC 61188-5-1, Tables 2 and 3)
5.5 Land pattern dimensions
Figure 8 shows the land pattern dimensions for TSOP (Type 2) for reflow and flow soldering.
These values are calculated based on the formulae for the solder joint fillet design of 5.4.
The courtyard is calculated using the following formula and rounded off (round off factor is to
the nearest 0,05 mm for minimum values and to the nearest 0,5 mm for maximum values).
2 2 2
CY =(Amin + F + P + C ) + (courtyard excess × 2)
A
2 2 2
CY ={whichever larger [Lmin + F + P + C ] or [Z]} + (courtyard excess × 2)
L
61188-5-3 © IEC:2007 – 17 –
CY1
D
Courtyard
PW
IEC  2015/07
Dimensions in millimetres
Level 1
Pattern Component
Z G X Y C D P CY1 CY2
identifier identifier
3016M TSOP 300mil 11,1 7,6 0,53 1,75 9,35 15,24 1,27 19 13
3017M TSOP 300mil 11,1 7,6 0,43 1,75 9,35 16,80 0,80 20 13
3018M TSOP 300mil 11,1 7,6 0,35 1,75 9,35 13,00 0,65 16 13
3019M TSOP 350mil 12,4 8,9 0,53 1,75 10,65 15,24 1,27 19 14
3020M TSOP 400mil 13,6 10,2 0,53 1,7 11,9 16,51 1,27 20 15
3021M TSOP 400mil 13,6 10,2 0,43 1,7 11,9 16,80 0,80 20 15
3022M TSOP 400mil 13,6 10,2 0,35 1,7 11,9 16,90 0,65 20 15
3023M TSOP 400mil 13,6 10,2 0,33 1,7 11,9 16,90 0,50 20 15
3024M TSOP 500mil 16,2 12,7 0,43 1,75 14,45 18,40 0,80 21 18
3025M TSOP 0130 15,4 11,5 0,35 1,95 13,45 20,80 0,65 24 17
3026M TSOP 0130 15,4 11,5 0,33 1,95 13,45 20,80 0,50 24 17
3027M TSOP 0145 18,4 14,5 0,35 1,95 16,45 24,70 0,65 27 20
3028M TSOP 0160 19,9 16,0 0,53 1,95 17,95 23,75 1,25 27 21
3029M TSOP 0160 19,9 16,0 0,43 1,95 17,95 24,00 0,80 27 21
3030M TSOP 0160 19,9 16,0 0,35 1,95 17,95 27,95 0,65 31 21
Level 2
Pattern Component
Z G X Y C D P CY1 CY2
identifier identifier
3016N TSOP 300mil 10,5 7,6 0,53 1,45 9,1 15,24 1,27 18 11
3017N TSOP 300mil 10,5 7,6 0,43 1,45 9,1 16,80 0,80 20 11
3018N TSOP 300mil 10,5 7,6 0,35 1,45 9,1 13,00 0,65 16 11
3019N TSOP 350mil 11,8 8,9 0,53 1,45 10,35 15,24 1,27 18 13
3020N TSOP 400mil 13,05 10,2 0,53 1,45 11,65 16,51 1,27 20 14
3021N TSOP 400mil 13,05 10,2 0,43 1,45 11,65 16,80 0,80 20 14
3022N TSOP 400mil 13,05 10,2 0,35 1,45 11,65 16,90 0,65 20 14
3023N TSOP 400mil 13,05 10,2 0,33 1,45 11,65 16,90 0,50 20 14
3024N TSOP 500mil 15,6 12,7 0,43 1,45 14,15 18,40 0,80 21 17
3025N TSOP 0130 14,8 11,5 0,35 1,65 13,15 20,80 0,65 23 16
3026N TSOP 0130 14,8 11,5 0,33 1,65 13,15 20,80 0,50 23 16
3027N TSOP 0145 17,8 14,5 0,35 1,65 16,15 24,70 0,65 27 19
3028N TSOP 0160 19,3 16,0 0,53 1,65 17,65 23,75 1,25 27 20
CY2
C
G Y
Z
– 18 – 61188-5-3 © IEC:2007
3029N TSOP 0160 19,3 16,0 0,43 1,65 17,65 24,00 0,80 27 20
3030N TSOP 0160 19,3 16,0 0,35 1,65 17,65 27,95 0,65 31 20
Level 3
Pattern Component
Z G X* Y C D P CY1 CY2
identifier identifier
3016L TSOP 300mil 9,85 7,65 0,45 1,10 8,75 15,24 1,27 17,6 10,1
3017L TSOP 300mil 9,85 7,65 0,35 1,10 8,75 16,80 0,80 18,9 10,1
3018L TSOP 300mil 9,85 7,65 0,30 1,10 8,75 13,00 0,65 15,1 10,1
3019L TSOP 350mil 11,10 8,90 0,45 1,10 10,00 15,24 1,27 17,6 11,3
3020L TSOP 400mil 12,40 10,20 0,45 1,10 11,30 16,51 1,27 18,9 12,6
3021L TSOP 400mil 12,40 10,20 0,35 1,10 11,30 16,80 0,80 18,9 12,6
3022L TSOP 400mil 12,40 10,20 0,30 1,10 11,30 16,90 0,65 18,9 12,6
3023L TSOP 400mil 12,40 10,20 0,25 1,10 11,30 17,00 0,50 18,9 12,6
3024L TSOP 500mil 14,90 12,70 0,35 1,10 13,80 18,40 0,80 20,1 15,1
3025L TSOP 0130 14,10 11,50 0,30 1,30 12,80 20,80 0,65 22,5 14,3
3026L TSOP 0130 14,10 11,50 0,25 1,30 12,80 21,00 0,50 22,5 14,3
3027L TSOP 0145 17,10 14,50 0,30 1,30 15,80 24,70 0,65 26,2 17,3
3028L TSOP 0160 18,60 16,00 0,45 1,30 17,30 23,75 1,25 26,2 18,8
3029L TSOP 0160 18,60 16,00 0,35 1,30 17,30 24,00 0,80 26,2 18,8
3030L TSOP 0160 18,60 16,00 0,30 1,30 17,30 27,95 0,65 30,0 18,8
* When the X dimension is used, it is necessary to confirm whether the space between adjacent land patterns is
proper.
Figure 8 – TSOP (Type 2) – Land pattern dimensions

6 SOP
6.1 Field of application
This clause provides the component and land pattern dimensions for the SOPs. Basic
construction of the SOP device is also covered. Subclause 6.4 lists the tolerances and target
solder joint dimensions used to arrive at the land pattern dimensions.
6.2 Component description
Figure 9 shows a typical construction example.

IEC  2016/07
Figure 9 – SOPIC construction
6.3 Component dimensions
Figure 10 shows the component dimensions for SOP components.

61188-5-3 © IEC:2007 – 19 –
Land pattern dimensional data may need to be adjusted if the component dimensional data
does not match JEDEC and/or JEITA data sheets.

Dimensions in millimetres
Component Pin L W T S* A B H P
identification count
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Max. Basic
P-SOP8-4,4x5-
8 6,02 6,42 0,35 0,47 0,45 0,75 4,52 5,10 4,88 5,28 4,02 4,42 1,20 1,27
1,27
P-SOP14 -
14 6,02 6,42 0,35 0,47 0,45 0,75 4,52 5,10 9,96 10,36 4,02 4,42 1,20 1,27
4,4x10-1,27
P-SOP14-
14 8,22 8,62 0,35 0,47 0,73 1,03 6,16 7,16 9,96 10,36 5,02 5,42 1,20 1,27
5,3x10,3-1,27
P-SOP16 -
16 6,02 6,42 0,35 0,47 0,45 0,75 4,52 5,52 9,96 10,36 4,02 4,42 1,20 1,27
4,4x10-1,27
P-SOP16-
16 8,22 8,62 0,35 0,47 0,73 1,03 6,16 7,16 9,96 10,36 5,02 5,42 1,20 1,27
5,3x10,3-1,27
P-SOP20-
20 15,84 16,24 0,35 0,47 0,73 1,03 13,78 14,78 12,50 12,90 12,64 13,04 1,20 1,27
12,6x5,5-1,27
P-SOP24-8x15,4
24 10,13 10,53 0,35 0,47 0,73 1,03 8,07 9,07 15,04 15,44 6,93 7,33 1,20 1,27
-1,27
P-SOP28–8,6x18
28 12,03 12,43 0,35 0,47 0,73 1,03 9,97 10,97 17,58 17,98 8,83 9,23 1,20 1,27
-1,27
P-SOP32-
32 13,94 14,34 0,35 0,47 0,73 1,03 11,88 12,88 20,12 20,52 10,74 11,14 1,20 1,27
10,7x20,6-1,27
P-SOP40-
40 13,94 14,34 0,35 0,47 0,73 1,03 11,88 12,88 26,47 26,87 10,74 11,14 1,20 1,27
10,7x26-1,27
P-SOP44-
44 15,84 16,24 0,35 0,47 0,73 1,03 13,78 14,78 27,74 28,14 12,64 13,04 1,20 1,27
13x28,2-1,27
* Calculated value.
Figure 10 – SOP component dimensions

6.4 Solder joint fillet design
Figure 11 shows dimensions of the solder fillet after soldering process. The minimum, median
and maximum dimensions of each of toe, heel, and side fillets are determined by taking into
consideration solder joint reliability and also quality and productivity in parts mount process.
In designing land patterns, three accuracy factors need to be taken into consideration:
– parts dimensions accuracy (C);
– parts mount accuracy on PWBs (P);
– land shape accuracy of PWBs (F),
in addition to fillet dimensions. The formulae to obtain the tolerance resulted from these
factors are basically as follows:
a) Design consideration when soldered without self-alignment effect (Level 1)
In the flow soldering process, there is no self-alignment effect. Thus, the formulae cannot
be simplified but remain the same, as follows:

– 20 – 61188-5-3 © IEC:2007
2 2 2
Zmax = Lmin + 2J max + T T = + +
F P C
L1 L1 L
T T T
2 2 2
Gmin = Smax (rms) – 2J max – T T = + +
F P C
H H H L1 L1 S
2 2 2
Xmax = Wmin + 2J max + T T = + +
F P C
S S S L1 L1 W
b) Design consideration when soldered without self-alignment effect (Level 2)
2 2 2
Zmax = Lmin + 2J mdn + T T = + +
C
F P
T T T L2 L2 L
2 2 2
Gmin = Smax(rms) – 2J mdn – T T = + +
F P C
L2 L2 S
H H H
2 2 2
Xmax = Wmin + 2J mdn + T T = + +
F P C
L2 L2 W
S S S
c) Design consideration when soldered with self-alignment effect (Level 3)
2 2 2
T = + +
Zmax = Lmin + 2J min + T
F P C
T L3 L3 L
T T
2 2 2
Gmin = Smax(rms) – 2J min – T T = + +
F P C
H H H L3 L3 S
2 2 2
Xmax = Wmin + 2 J min + T T = + +
F P C
S S S L3 L3 W
In the reflow soldering process, there i
...