IEC 61188-5-4:2007

IEC 61188-5-4 ®
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed boards and printed board assemblies – Design and use –
Part 5-4: Attachment (land/joint) considerations – Components with J leads on
two sides
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –
Partie 5-4: Considérations sur les liaisons pistes-soudures – Composants à
sorties en J sur deux côtés
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IEC 61188-5-4 ®
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed boards and printed board assemblies – Design and use –
Part 5-4: Attachment (land/joint) considerations – Components with J leads on
two sides
Cartes imprimées et cartes imprimées équipées – Conception et utilisation –
Partie 5-4: Considérations sur les liaisons pistes-soudures – Composants à
sorties en J sur deux côtés
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
P
CODE PRIX
ICS 31.180 ISBN 978-2-88910-434-5
– 2 – 61188-5-4 © IEC:2007
CONTENTS
FOREWORD.3
INTRODUCTION.5
1 Scope.6
2 Normative references .6
3 General information.6
3.1 General component description .6
3.2 Marking .7
3.3 Packaging .7
3.4 Process considerations .7
4 Small outlined J packages (SOJ) .7
4.1 Component description.7
4.2 Component dimensions .8
4.3 Solder joint fillet design .9
4.4 Land pattern dimensions .11
Bibliography.15

Figure 1 – SOJ construction.8
Figure 2 – SOJ component dimensions .9
Figure 3 – Solder joint fillet design.11
Figure 4 – SOJ land pattern dimensions .14

61188-5-4 © IEC:2007 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-4: Attachment (land/joint) considerations –
Components with J leads on two sides

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
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Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61188-5-4 has been prepared by IEC technical committee 91:
Electronics assembly technology
This bilingual version, published in 2009-09, corresponds to the English version.
The text of this standard is based on the following documents:
FDIS Report on voting
91/703/FDIS 91/735/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
The French version of this standard has not been voted upon.

– 4 – 61188-5-4 © IEC:2007
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 61188 series, under the general title Printed boards and printed
board assemblies – Design and use, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
61188-5-4 © IEC:2007 – 5 –
INTRODUCTION
This part of IEC 61188 covers land pattern for components with J leads on two sides.
The proposed land pattern dimensions in this standard are based upon the fundamental
tolerance calculation combined with the given land protrusions and courtyard excesses (see
IEC 61188-5-1, Generic requirements). The courtyard includes all issues of the normal
manufacturing necessities.
The unaltered land pattern dimensions of this part are generally applicable for the solder
paste application plus reflow soldering process. For application of the wave soldering process
(though uncommon for SOJ components) the land pattern and courtyard dimensions may
have to be modified. An orientation parallel to the wave direction is strongly recommended
and suitably dimensioned solder thieves should be added.
This standard offers a threefold land pattern dimensioning (levels 1, 2, 3) on the basis of a
threefold set of land protrusions and courtyard excesses: maximum (max.); medium (mdn);
and minimum (min.). Nevertheless the user may develop deviating land pattern dimensions
based upon the methodology of IEC 61188-5-1, introducing his own special material and
assembling process conditions C, F, P and perhaps his own special land protrusions and
courtyard excesses dimensions, as required.
If a user has good reasons to use a concept different from that of IEC 61188-5-1 or if the user
prefers unusual land protrusions, this standard should be used for checking the resulting
solder fillets.
It is the responsibility of the user to verify his used SMD land patterns for achieving an
undisturbed mounting process including testing and an ensured reliability for the product
stress conditions in use.
– 6 – 61188-5-4 © IEC:2007
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-4: Attachment (land/joint) considerations –
Components with J leads on two sides

1 Scope
This part of IEC 61188 provides the component and land pattern dimensions for small outline
integrated circuits with “J“ leads on two sides (SOJ components) used in the reflow soldering
process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances
and target solder joint dimensions used to arrive at the land pattern dimensions.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60286-3, Packaging of components for automatic handling – Part 3: Packaging of surface
mount components on continuous tapes
IEC 60286-4, Packaging of components for automatic handling – Part 4: Stick magazines for
electronic components encapsulated in packages of form E and G
IEC 60286-5, Packaging of components for automatic handling – Part 5: Matrix trays (only
available in English)
IEC 61760-1, Surface mounting technology – Part 1: Standard method for the specification of
surface mounting components (SMDs) (only available in English)
3 General information
3.1 General component description
The two-sided J lead family is a small outline family identified by the dimensions of the body
size in inches. For example, the SOJ/300 has a body size of 0,300 in or 7,63 mm, the
SOJ/350 has a body size of 0,350 in or 8,88 mm, the SOJ/400 has a body size of 0,400 in or
10,12 mm, and the SOJ/450 has a body size of 0,450 in or 11,38 mm. Package lead counts
range from 14 to 28 pins. Pitch is uniformly for all sizes, i.e. 1,27 mm.
The small-outline J (SOJ) package has leads on two sides, similar to a DIP. The lead
configuration, like the letter J, extends out the side of the package and bends under the
package forming a J bend. The point of contact of the lead to the land pattern is at the apex of
the J bend and is the basis for the span of the land pattern.
The (inner) end of the J is called the heel, and the outer side of the J is called the toe.

61188-5-4 © IEC:2007 – 7 –
The leads shall be coplanar within 0,1 mm. That is, when the component is placed on a flat
surface, no lead may be more than 0,1 mm off the flat surface.
The SOJ package takes advantage of chips having parallel address or data line layouts. For
example, memory ICs are often used in multiples, and bus lines connect to the same pin on
each chip. Memory chips in SOJ packages can be placed close to one another because of the
parallel pin layout and the use of J leads. With high capacity memory systems, the space
savings can be significant compared with a dual in-line.
3.2 Marking
The marking of the SOIC family of parts shall comply with the definitions in the relevant IEC
product specifications.
3.3 Packaging
Components may be provided in
• tape packaging: reference IEC 60286-3,
• stick magazine: reference IEC 60286-4,
• tray packaging: reference IEC 60286-5.
Bulk packaging is not recommended because of lead coplanarity conditions required for
placement and soldering.
3.4 Process considerations
Together with other components assembled on PC boards, J lead packages are normally
processed using standard solder reflow processes. Parts should therefore have an adequate
solderability and resistance to soldering heat. These capabilities shall be demonstrated by
submitting the parts to the test conditions of IEC 60068-2-58 and by complying with the
conditions defined in IEC 61760-1.
The land pattern dimensions are based on a mathematical model that establishes a platform
for a solder joint attachment to the printed board. The existing models create a platform that is
capable of establishing a reliable solder joint no matter what the solder alloy used to make
that joint (lead-free, tin lead, etc.).
Process requirements for solder reflow are different based on the solder alloy and should be
analyzed in order that the process is above the liquidus temperature of the alloy, and remains
above that temperature a sufficient time to form a reliable metallurgical bond.
4 Small outlined J packages (SOJ)
4.1 Component description
Figure 1 shows a typical construction example.

– 8 – 61188-5-4 © IEC:2007
IEC  2018/07
Figure 1 – SOJ construction
4.2 Component dimensions
Figure 2 shows the component dimensions for SOJ components.

1,02
H 1,17
P
B
A (in) A (mm)
ref. min.  max.
W T
0,300 7,49  7,75
0,350 8,76  9,02
IEC  2019/07
Dimensions in millimetres
L
S
A
61188-5-4 © IEC:2007 – 9 –
Component L S W T B H P
identification
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Max. Basic
SOJ 14/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 9,65 9,96 3,75 1,27
SOJ 16/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 10,92 11,23 3,75 1,27
SOJ 18/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 12,19 12,50 3,75 1,27
SOJ 20/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 13,46 13,77 3,75 1,27
SOJ 22/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 14,73 15,04 3,75 1,27
SOJ 24/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 16,00 16,31 3,75 1,27
SOJ 26/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 17,27 17,58 3,75 1,27
SOJ 28/300 8,38 8,76 4,38 5,06 0,38 0,51 1,6 2,0 18,54 18,85 3,75 1,27
SOJ 14/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,0 9,65 9,96 3,75 1,27
SOJ 16/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,0 10,92 11,23 3,75 1,27
SOJ 18/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,0 12,19 12,50 3,75 1,27
SOJ 20/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,0 13,46 13,77 3,75 1,27
SOJ 22/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,0 14,73 15,04 3,75 1,27
SOJ 24/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,0 16,00 16,31 3,75 1,27
SOJ 26/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,0 17,27 17,58 3,75 1,27
SOJ 28/350 9,65 10,03 5,65 6,33 0,38 0,51 1,6 2,0 18,54 18,85 3,75 1,27
SOJ 14/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 9,65 9,96 3,75 1,27
SOJ 16/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 10,92 11,23 3,75 1,27
SOJ 18/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 12,19 12,50 3,75 1,27
SOJ 20/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 13,46 13,77 3,75 1,27
SOJ 22/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 14,73 15,04 3,75 1,27
SOJ 24/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 16,00 16,31 3,75 1,27
SOJ 26/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 17,27 17,58 3,75 1,27
SOJ 28/400 10,92 11,30 6,92 7,60 0,38 0,51 1,6 2,0 18,54 18,85 3,75 1,27
SOJ 14/450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 9,65 9,96 3,75 1,27
SOJ 16/450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 10,92 11,23 3,75 1,27
SOJ 18/450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 12,19 12,50 3,75 1,27
SOJ 20/450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 13,46 13,77 3,75 1,27
SOJ 22/450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 14,73 15,04 3,75 1,27
SOJ 24/450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 16,00 16,31 3,75 1,27
SOJ 26/450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 17,27 17,58 3,75 1,27
SOJ 28/450 12,19 12,57 8,19 8,87 0,38 0,51 1,6 2,0 18,54 18,85 3,75 1,27
Figure 2 – SOJ component dimensions
Land pattern dimensional data may need to be adjusted if the component dimensional data
does not match JEDEC and/or JEITA data sheets.
4.3 Solder joint fillet design
Figure 3 shows the shape and dimensions of the solder fillet after the soldering process. The
minimum, median and maximum dimensions of each of toe, heel and side fillet are determined
by taking into consideration solder joint reliability as well as quality and productivity in the
mounting process of parts.
– 10 – 61188-5-4 © IEC:2007
In designing land patterns, three accuracy factors need to be taken into consideration:
– parts dimensions accuracy (C);
– parts mount accuracy on PWBs (P);
– land shape accuracy of PWBs (F),
in addition to fillet dimensions. The formulae to obtain the tolerance resulting from these
factors are basically as follows:
a) Design consideration when soldered without self-alignment effect (level 1)
In the flow soldering process, there is no self-alignment effect. Thus, the formulae cannot
be simpified but remain the same as follows:
2 2 2
Zmax = Lmin + 2J max + T T = + +
C
F P
H H H L1 L1 L
2 2 2
Gmin = Smax (rms) – 2J max – T T = + +
F P C
L1 L1 S
T T T
2 2 2
Xmax = Wmin + 2J max + T T = + +
F P C
L1 L1 W
S S S
b) Design consideration when soldered without self-alignment effect (level 2)

2 2 2
Zmax = Lmin + 2J mdn + T T = + +
F P C
H H H L2 L2 L
2 2 2
Gmin = Smax(rms) – 2J mdn – T T = + +
F P C
T T T L2 L2 S
2 2 2
Xmax = Wmin + 2J mdn + T T = + +
F P C
S S S L2 L2 W
c) Design consideration when soldered with self-alignment effect (level 3)
2 2 2
Zmax = Lmin + 2J min + T T = + +
F P C
L3 L3 L
H H H
2 2 2
Gmin = Smax(rms) – 2J min –T T = + +
F P C
L3 L3 S
T T T
2 2 2
Xmax = Wmin + 2 J min + T T = + +
F P C
L3 L3 W
S S S
In the reflow soldering process, there is a self-alignment effect. In the surface mount process
of reflow soldering, parts mount displacement when soldered can be cancelled by self-
alignment effect (therefore factor P can be regarded as 0). In addition, the tolerance of the
land shape accuracy of PWBs is about ±30 µm, and this is extremely small when compared
with that of the parts dimensions accuracy (therefore factor F can be regarded also as 0).
Thus, the formulae can be simplified as follows:
T = C Zmax = Lmin + 2J min+ C = Lmax + 2 J min
H L, H L H
T = C Gmin= Smax(rms) – 2J min – C
L S, T S
T = C Xmax = Wmin + 2J min + C = Wmax + 2 J min
S W, S W S
Any tolerance other than the above may be used depending on the soldering strength
required, the capability of the production process used, and so on.

61188-5-4 © IEC:2007 – 11 –
Heel fillet Toe fillet Side fillet
L min. S max.
J max.
J max. H J max.
T S
J min.
J min.
H J min.
T S
W min.
Z max. G min. X max.
IEC  2020/07
Dimensions in millimetres
Solder joint
Tolerance
assumptions
Toe Heel Side
Component
F P J J J
T H S
L-1/L- L-1/L-
C Max. Mdn Min. C Max. Mdn Min. C Max. Mdn Min.
L S W
2/L-3 2/L-3
1,27 0,10 0,10 0,38 0,55 0,35 0,15 1,18 0,30 0,25 0,20 0,13 0,1 0,0 0,0
Figure 3 – Solder joint fillet design
4.4 Land pattern dimensions
Figure 4 shows the land pattern dimensions for SOJ for reflow and flow soldering. These
values are calculated based on the formula for the solder joint fillet design given in 4.3.
The courtyard is calculated using the following formula and rounded up (round up factor is to
the nearest 0,05 mm for minimum values and to the nearest 0,5 mm for maximum values).
2 2 2
CY =(Amin + F + P + C ) + (courtyard excess × 2)
A
2 2 2
CY ={whichever larger [Lmin + F + P + C ] or [Z]} + (courtyard excess × 2)
L
NOTE 1 It has to be noted that the courtyard length CY is determined by the component body length B (Figure 2)
and not as normally by the pattern parameter D.
NOTE 2 It is not recommended (but neither is it, in principle, excluded), to use the inner area between the two
rows of lands for attaching flat types of SMDs under the SOJ.

– 12 – 61188-5-4 © IEC:2007
D
Grid
E
Placement
Courtyard
Y
IEC  2021/07
Dimensions in millimetres
Level 1
Pattern Component
Z G X* Y C D P CY1 CY2
identifier identifier
4000M SOJ 14/300 10,0 3,2 0,8 3,4 6,6 5,08 1,27 11 11
4001M SOJ 16/300 10,0 3,2 0,8 3,4 6,6 7,62 1,27 13 11
SOJ 18/300
4002M 10,0 3,2 0,8 3,4 6,6 12,7 1,27 14 11
4004M SOJ 20/300 10,0 3,2 0,8 3,4 6,6 15,24 1,27 15 11
4005M SOJ 22/300 10,0 3,2 0,8 3,4 6,6 20,32 1,27 16 11
4006M SOJ 24/300 10,0 3,2 0,8 3,4 6,6 25,4 1,27 18 11
4008M SOJ 26/300 10,0 3,2 0,8 3,4 6,6 30,48 1,27 19 11
4009M SOJ 28/300 10,0 3,2 0,8 3,4 6,6 38,1 1,27 20 11
SOJ 14/350
4010M 11,2 4,4 0,8 3,4 7,8 5,08 1,27 11 12
4012M SOJ 16/350 11,2 4,4 0,8 3,4 7,8 7,62 1,27 13 12
4013M SOJ 18/350 11,2 4,4 0,8 3,4 7,8 12,7 1,27 14 12
4014M SOJ 20/350 11,2 4,4 0,8 3,4 7,8 15,24 1,27 15 12
4015M SOJ 22/350 11,2 4,4 0,8 3,4 7,8 20,32 1,27 16 12
4016M SOJ 24/350 11,2 4,4 0,8 3,4 7,8 25,4 1,27 18 12
4017M SOJ 26/350 11,2 4,4 0,8 3,4 7,8 30,48 1,27 19 12
4018M SOJ 28/350 11,2 4,4 0,8 3,4 7,8 38,1 1,27 20 12
4019M SOJ 14/400 12,6 5,8 0,8 3,4 9,2 5,08 1,27 11 14
4020M SOJ 16/400 12,6 5,8 0,8 3,4 9,2 7,62 1,27 13 14
4021M SOJ 18/400 12,6 5,8 0,8 3,4 9,2 12,7 1,27 14 14
4022M SOJ 20/400 12,6 5,8 0,8 3,4 9,2 15,24 1,27 15 14
4023M SOJ 22/400 12,6 5,8 0,8 3,4 9,2 20,32 1,27 16 14
4024M SOJ 24/400 12,6 5,8 0,8 3,4 9,2 25,4 1,27 18 14
SOJ 26/400
4025M 12,6 5,8 0,8 3,4 9,2 30,48 1,27 19 14
4026M SOJ 28/400 12,6 5,8 0,8 3,4 9,2 38,1 1,27 20 14
4027M SOJ 14/450 13,8 7,0 0,8 3,4 10,4 5,08 1,27 11 15
4028M SOJ 16/450 13,8 7,0 0,8 3,4 10,4 7,62 1,27 13 15
4029M SOJ 18/450 13,8 7,0 0,8 3,4 10,4 12,7 1,27 14 15
4030M SOJ 20/450 13,8 7,0 0,8 3,4 10,4 15,24 1,27 15 15
SOJ 22/450
4031M 13,8 7,0 0,8 3,4 10,4 20,32 1,27 16 15

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61188-5-4 © IEC:2007 – 13 –
Pattern Component
Z G X* Y C D P CY1 CY2
identifier identifier
4032M SOJ 24/450 13,8 7,0 0,8 3,4 10,4 25,4 1,27 18 15
4033M SOJ 26/450 13,8 7,0 0,8 3,4 10,4 30,48 1,27 19 15
4034M SOJ 28/450 13,8 7,0 0,8 3,4 10,4 38,1 1,27 20 15
Level 2
4000N SOJ 14/300 9,5 3,3 0,6 3,1 6,4 5,08 1,27 10,5 10,0
4001N SOJ 16/300 9,5 3,3 0,6 3,1 6,4 7,62 1,27 11,8 10,0
4002N SOJ 18/300 9,5 3,3 0,6 3,1 6,4 12,7 1,27 13,1 10,0
4004N SOJ 20/300 9,5 3,3 0,6 3,1 6,4 15,24 1,27 14,3 10,0
4005N SOJ 22/300 9,5 3,3 0,6 3,1 6,4 20,32 1,27 15,6 10,0
SOJ 24/300
4006N 9,5 3,3 0,6 3,1 6,4 25,4 1,27 16,9 10,0
4008N SOJ 26/300 9,5 3,3 0,6 3,1 6,4 30,48 1,27 18,2 10,0
4009N SOJ 28/300 9,5 3,3 0,6 3,1 6,4 38,1 1,27 19,4 10,0
4010N SOJ 14/350 10,8 4,6 0,6 3,1 7,7 5,08 1,27 10,5 11,3
4012N SOJ 16/350 10,8 4,6 0,6 3,1 7,7 7,62 1,27 11,8 11,3
4013N SOJ 18/350 10,8 4,6 0,6 3,1 7,7 12,7 1,27 13,1 11,3
SOJ 20/350
4014N 10,8 4,6 0,6 3,1 7,7 15,24 1,27 14,3 11,3
4015N SOJ 22/350 10,8 4,6 0,6 3,1 7,7 20,32 1,27 15,6 11,3
4016N SOJ 24/350 10,8 4,6 0,6 3,1 7,7 25,4 1,27 16,9 11,3
4017N SOJ 26/350 10,8 4,6 0,6 3,1 7,7 30,48 1,27 18,2 11,3
4018N SOJ 28/350 10,8 4,6 0,6 3,1 7,7 38,1 1,27 19,4 11,3
4019N SOJ 14/400 12,1 5,9 0,6 3,1 9,0 5,08 1,27 10,5 12,6
4020N SOJ 16/400 12,1 5,9 0,6 3,1 9,0 7,62 1,27 11,8 12,6
4021N SOJ 18/400 12,1 5,9 0,6 3,1 9,0 12,7 1,27 13,1 12,6
4022N SOJ 20/400 12,1 5,9 0,6 3,1 9,0 15,24 1,27 14,3 12,6
4023N SOJ 22/400 12,1 5,9 0,6 3,1 9,0 20,32 1,27 15,6 12,6
4024N SOJ 24/400 12,1 5,9 0,6 3,1 9,0 25,4 1,27 16,9 12,6
4025N SOJ 26/400 12,1 5,9 0,6 3,1 9,0 30,48 1,27 18,2 12,6
4026N SOJ 28/400 12,1 5,9 0,6 3,1 9,0 38,1 1,27 19,4 12,6
4027N SOJ 14/450 13,3 7,1 0,6 3,1 10,2 5,08 1,27 10,5 13,8
SOJ 16/450
4028N 13,3 7,1 0,6 3,1 10,2 7,62 1,27 11,8 13,8
4029N SOJ 18/450 13,3 7,1 0,6 3,1 10,2 12,7 1,27 13,1 13,8
4030N SOJ 20/450 13,3 7,1 0,6 3,1 10,2 15,24 1,27 14,3 13,8
4031N SOJ 22/450 13,3 7,1 0,6 3,1 10,2 20,32 1,27 15,6 13,8
4032N SOJ 24/450 13,3 7,1 0,6 3,1 10,2 25,4 1,27 16,9 13,8
4033N SOJ 26/450 13,3 7,1 0,6 3,1 10,2 30,48 1,27 18,2 13,8
SOJ 28/450
4034N 13,3 7,1 0,6 3,1 10,2 38,1 1,27 19,4 13,8

– 14 – 61188-5-4 © IEC:2007
Pattern Component
Z G X* Y C D P CY1 CY2
identifier identifier
Level 3
4000L SOJ 14/300 9,1 3,4 0,55 2,85 6,25 5,08 1,27 10,2 9,3
4001L SOJ 16/300 9,1 3,4 0,55 2,85 6,25 7,62 1,27 11,5 9,3
4002L SOJ 18/300 9,1 3,4 0,55 2,85 6,25 12,7 1,27 12,8 9,3
4004L SOJ 20/300 9,1 3,4 0,55 2,85 6,25 15,24 1,27 14,0 9,3
4005L SOJ 22/300 9,1 3,4 0,55 2,85 6,25 20,32 1,27 15,3 9,3
4006L SOJ 24/300 9,1 3,4 0,55 2,85 6,25 25,4 1,27 16,6 9,3
4008L SOJ 26/300 9,1 3,4 0,55 2,85 6,25 30,48 1,27 17,9 9,3
4009L SOJ 28/300 9,1 3,4 0,55 2,85 6,25 38,1 1,27 19,1 9,3
4010L SOJ 14/350 10,4 4,7 0,55 2,85 7,55 5,08 1,27 10,2 10,6
SOJ 16/350
4012L 10,4 4,7 0,55 2,85 7,55 7,62 1,27 11,5 10,6
4013L SOJ 18/350 10,4 4,7 0,55 2,85 7,55 12,7 1,27 12,8 10,6
4014L SOJ 20/350 10,4 4,7 0,55 2,85 7,55 15,24 1,27 14,0 10,6
4015L SOJ 22/350 10,4 4,7 0,55 2,85 7,55 20,32 1,27 15,3 10,6
4016L SOJ 24/350 10,4 4,7 0,55 2,85 7,55 25,4 1,27 16,6 10,6
SOJ 26/350
4017L 10,4 4,7 0,55 2,85 7,55 30,48 1,27 17,9 10,6
4018L SOJ 28/350 10,4 4,7 0,55 2,85 7,55 38,1 1,27 19,1 10,6
4019L SOJ 14/400 11,6 6,0 0,55 2,80 8,80 5,08 1,27 10,2 11,8
4020L SOJ 16/400 11,6 6,0 0,55 2,80 8,80 7,62 1,27 11,5 11,8
4021L SOJ 18/400 11,6 6,0 0,55 2,80 8,80 12,7 1,27 12,8 11,8
4022L SOJ 20/400 11,6 6,0 0,55 2,80 8,80 15,24 1,27 14,0 11,8
4023L SOJ 22/400 11,6 6,0 0,55 2,80 8,80 20,32 1,27 15,3 11,8
4024L SOJ 24/400 11,6 6,0 0,55 2,80 8,80 25,4 1,27 16,6 11,8
4025L SOJ 26/400 11,6 6,0 0,55 2,80 8,80 30,48 1,27 17,9 11,8
4026L SOJ 28/400 11,6 6,0 0,55 2,80 8,80 38,1 1,27 19,1 11,8
SOJ 14/450
4027L 12,9 7,2 0,55 2,85 10,05 5,08 1,27 10,2 13,1
4028L SOJ 16/450 12,9 7,2 0,55 2,85 10,05 7,62 1,27 11,5 13,1
4029L SOJ 1
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