IEC 60747-17:2020

IEC 60747-17 ®
Edition 1.0 2020-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

Dispositifs à semiconducteurs –
Partie 17: Coupleur magnétique et capacitif pour l’isolation principale et
renforcée
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IEC 60747-17 ®
Edition 1.0 2020-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

Dispositifs à semiconducteurs –

Partie 17: Coupleur magnétique et capacitif pour l’isolation principale et

renforcée
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-8924-2

– 2 – IEC 60747-17:2020 © IEC 2020
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Electrical characteristics – Coupler logic and timing definitions . 19
5 Coupler for protection against electrical shock . 20
5.1 General . 20
5.2 Type . 20
5.3 Ratings . 20
5.3.1 General . 20
5.3.2 Safety limiting values . 20
5.3.3 Functional ratings . 20
5.3.4 Rated isolation voltages. 20
5.4 Electrical safety requirements . 20
5.5 Electrical, environmental and/or endurance test information . 21
5.5.1 General . 21
5.5.2 Routine test . 23
5.5.3 Sample test . 23
5.5.4 Maximum surge isolation voltage . 23
5.5.5 Type test . 24
6 Measuring methods for couplers . 35
6.1 General . 35
6.2 Isolation capacitance (C ) . 35
lO
6.2.1 Purpose . 35
6.2.2 Circuit diagram . 35
6.2.3 Measurement procedure . 36
6.2.4 Precautions to be observed . 36
6.2.5 Special conditions . 36
6.3 Isolation resistance between input and output, R . 36
lO
6.3.1 Purpose . 36
6.3.2 Circuit diagram . 36
6.3.3 Precautions to be observed . 37
6.3.4 Measurement procedure . 37
6.3.5 Special conditions . 37
6.4 Isolation test . 37
6.4.1 Purpose . 37
6.4.2 Circuit diagram . 37
6.4.3 Test procedure . 38
6.4.4 Requirements . 38
6.5 Partial discharges of coupler . 39
6.5.1 Purpose . 39
6.5.2 Circuit diagram . 39
6.5.3 Description of Figure 9 test circuit and requirements . 39
6.5.4 Test procedure . 40
6.5.5 Description of calibration circuit (see Figure 10) . 40

6.5.6 Test methods . 41
6.5.7 Specified conditions . 41
6.5.8 Test voltage conditions . 42
6.6 Switching times of couplers . 42
6.6.1 Purpose . 42
6.6.2 Circuit diagram . 42
6.6.3 Measurement procedure . 43
6.6.4 Specified conditions . 44
6.7 Measuring methods of common-mode transient immunity (CMTI) for
magnetic and capacitive couplers . 44
6.7.1 Purpose . 44
6.7.2 Circuit diagram . 44
6.7.3 Precautions to be observed . 45
6.7.4 Static CMTI measuring procedure . 46
6.7.5 Specified conditions . 47
6.7.6 Dynamic CMTI measuring procedure . 47
Annex A (informative) Qualification guidance . 48
Bibliography . 51

Figure 1 – Time intervals for methods a and b of the test voltage . 15
Figure 2 –1,2/50 µs surge pulse according 61000-4-5:2014 allowed as equivalent
impulse for isolation testing . 24
Figure 3 – Determination of time to failure (referring to method in 5.5.5.8) . 31
Figure 4 – Determination of working voltage (referring to method in 5.5.5.8 for
exponential model) . 32
Figure 5 – Determination of working voltage (referring to method in 5.5.5.8 for non-
linear model) . 33
Figure 6 – Isolation capacitance measurement circuit . 36
Figure 7 – Isolation resistance measurement circuit . 37
Figure 8 – Isolation voltage measurement circuit . 38
Figure 9 – Partial discharge test circuit . 39
Figure 10 – Connections for the calibration of the complete test arrangement . 40
Figure 11 – Switching time test circuit . 43
Figure 12 – Transition time waveform measurement . 43
Figure 13 – Propagation delay time waveform measurement . 44
Figure 14 – Static versus dynamic data source signal VI . 45
Figure 15 – Common-mode transient immunity (CMTI) test setup for both static and
dynamic testing . 45
Figure 16 – Static common-mode transient immunity (CMTI) and V and low to high
CM
data transition waveform . 47
Figure A.1 – Lifetime verification . 49

Table 1 – Overview on characteristics and symbols . 19
Table 2 – Datasheet characteristics . 21
Table 3 – Tests and test sequence for coupler providing basic insulation and reinforced
insulation for protection against electrical shock . 22
Table 4 – Test conditions . 23

– 4 – IEC 60747-17:2020 © IEC 2020
Table 5 – Safety factor F. 41
Table 6 – Specified conditions for method a and method b. 42
Table A.1 – Front end process changes within component . 49
Table A.2 – Front End Process Changes within SiO/SiN/imide-passivation . 50
Table A.3 – Layout changes . 50
Table A.4 – Backend changes . 50

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 17: Magnetic and capacitive coupler
for basic and reinforced insulation

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-17 has been prepared by subcommittee SC 47E: Discrete
semiconductor devices, of IEC technical committee TC 47: Semiconductor devices.
This first edition cancels and replaces IEC PAS 60747-17:2011. This edition constitutes a
technical revision.
This edition includes the following significant technical changes with respect to
IEC PAS 60747-17:2011:
a) introduced lifetime safety factors for improved life time consideration, to comply with
widely recognized aging mechanisms of silicone dioxide (TDDB) and thin film polymer
isolation layers;
b) significantly improved "end of life testing" paragraph and statistical life time consideration
by adding detailed description on process, safety factors, methods of generating data
points and respective lifetime interpolations as well as being specific on minimum amount
of samples required;
– 6 – IEC 60747-17:2020 © IEC 2020
c) introduced concept of certification by similarity, including Annex A, giving guidance on
qualification considerations and required certification process;
d) alternative pulse shape allowed for surge pulse testing, to avoid issues due to surge tester
availability;
e) various improvements throughout the standard: definitions, for example type of coupler
have been improved, introduction of surge impulse V rating, usage of glass transition
IMP
temperature, pre-conditioning have been redefined for improved usability and better
compatibility with today’s design and functionality of couplers, available mold compounds,
etc.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47E/711/FDIS 47E/715/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60747 series, published under the general title Semiconductor
devices, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
SEMICONDUCTOR DEVICES –
Part 17: Magnetic and capacitive coupler
for basic and reinforced insulation

1 Scope
This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety test
and the measuring methods of magnetic coupler and capacitive coupler.
It specifies the principles and requirements of insulation and isolation characteristics for
magnetic and capacitive couplers for basic insulation and reinforced insulation.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-2-1:2007, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2:2007, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-14:2009, Environmental testing – Part 2-14: Tests – Test N: Change of
temperature
IEC 60068-2-20:2008, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60068-2-30:2005, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
IEC 60068-2-58:2015, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-67:1995, Environmental testing – Part 2: Tests – Test Cy: Damp heat, steady
state, accelerated test primarily intended for components
IEC 60112:2003, Method for the determination of the proof and the comparative tracking
indices of solid insulating materials
IEC 60216-1:2013, Electrical insulating materials – Thermal endurance properties – Part 1:
Ageing procedures and evaluation of test results
IEC 60216-2:2005, Electrical insulating materials – Thermal endurance properties – Part 2:
Determination of thermal endurance properties of electrical insulating materials – Choice of
test criteria
IEC 60664-1:2007, Insulation coordination for equipment within low-voltage systems – Part 1:
Principles, requirements and tests

– 8 – IEC 60747-17:2020 © IEC 2020
IEC 60672-2:1999, Ceramic and glass insulating materials – Part 2: Methods of test
IEC 60695-11-5:2016, Fire hazard testing – Part 11-5: Test flames – Needle-flame test
method – Apparatus, confirmatory test arrangement and guidance
IEC 62539:2007, Guide for the statistical analysis of electrical insulation breakdown data
3 Terms and definitions
3.1
details of outline and encapsulation
information related method of encapsulation and terminal connections within the coupler's
isolation system
3.1.1
outline drawing
drawing or sketch restricted to line to describe the shape of objects or circuitry
3.1.2
method of encapsulation
encapsulating materials used forming part of the isolation system
3.1.3
terminal identification
terminal identification and indication of any connection between a terminal and the case
3.2
type of coupler
internal construction and insulation method of coupler to achieve basic or reinforced
insulation
3.2.1
SiO isolator
isolator with an internal insulation construction utilizing silicon dioxide based material
3.2.2
thin film polymer isolator
isolator with an internal insulation construction, utilising a thin film polymer insulation
3.3
isolation
ability to reject electrical and magnetic interference or noise
3.4
insulation
part of an electromechanical product which galvanically separates the conducting parts at
different electrical potentials
3.4.1
reinforced insulation
insulation of hazardous-live-parts which provides a degree of protection against electric shock
equivalent to double insulation
Note 1 to entry: Reinforced insulation may comprise several layers which cannot be tested singly as basic
insulation or supplementary insulation.
[SOURCE: IEC 60664-1:2007, 3.17.5]

3.4.2
basic insulation
insulation providing a basic safeguard against electric shock
3.5
isolation side
all terminals of side 1 which are isolated from all terminals of side 2 by an isolation barrier,
forming a two-terminal device
3.6
isolation capacitance
C
IO
total capacitance between the terminals on side 1 of the isolation barrier connected together
and the terminals on side 2 of the isolation barrier connected together forming a two-terminal
device
Note 1 to entry: See IEC 60747-5-5:2007, 4.3.
3.7
isolation resistance
R
IO
resistance between the terminals on side 1 of the isolation barrier connected together and all
the terminals on side 2 of the isolation barrier connected together forming a two-terminal
device
3.8
isolation resistance at safety limiting temperature
R
IO_S
resistance at safety limiting temperature T between the terminals on side 1 of the isolation
S
barrier connected together and all the terminals on side 2 of the isolation barrier connected
together forming a two-terminal device which should be larger or equal to 1E9 Ω
3.9
isolation voltage
voltage between any specified terminals connected together on side 1 of the isolation barrier
and any terminals connected together on side 2 of the isolation barrier
3.10
logic state match
condition in which an output logic state matches the associated input logic state
3.11
logic state transition match
condition in which an output logic state change follows the associated input logic state change
3.12
common mode transient immunity
CMTI
maximum tolerable rate-of-rise (or fall) of a common-mode voltage
Note 1 to entry: The common mode transient immunity is given in volts per second. CMTl should include the
amplitude of the common-mode voltage that can be tolerated.
3.12.1
common mode transient immunity at logic high output
|CM |
H
common mode transient immunity of the coupler with logic at high output

– 10 – IEC 60747-17:2020 © IEC 2020
3.12.2
common mode transient immunity at logic low output
|CM |
L
common mode transient immunity of the coupler with logic at low output
3.12.3
common mode transient immunity at logic dynamic output
|CM |
D
maximum slew rate of a common-mode voltage (V ) at which the coupler transmits the data
CM
without missing the transition or creating unexpected transitions for all combinations of slew
rate polarity and data edges
Note 1 to entry: The data transition shall occur in the specified time frame, and invalid data in terms of delay
times, transitions or number of transitions, or magnitude (not meeting minimum logic V or maximum logic low
OH
V specifications) will be construed as a failure.
OL
3.12.4
CMTI performance
dV /dt
CM
maximum slew rate of a common mode voltage at which the output of the coupler remains at
the specific logic level and at the specified timing
3.12.5
common mode voltage
V
CM
common mode voltage at which the slew rate is measured
3.13
propagation delay
t t
pLH , pHL
time required for a change in the input state of a digital coupler to propagate to the
corresponding output
Note 1 to entry: The propagation delay from LOW to HIGH is expressed by t .
pLH
Note 2 to entry: The propagation delay from HIGH to LOW is expressed by t .
pHL
3.14
pulse width distortion
|t – t |
pLH pHL
PWD
unintentional and generally undesired change in the form of a signal causing the signal input
pulse width to differ from signal output pulse width
3.15
supply voltage
V
DD
supply voltages supplied on input and output side of coupler
Note 1 to entry: The supply voltage is also commonly expressed by V .
CC
3.16
integrated circuit
IC
microcircuit in which all or some of the circuit elements are inseparably associated and
electrically interconnected so that it is considered to be indivisible for the purpose of
construction and commerce on side 1 and side 2

[SOURCE: IEC 60050-521:2002, 521-10-03, modified – The words "on side 1 and side 2"
have been added.]
3.17
input and output terminal
I/O
side 1 and side 2 terminals of an integrated circuit providing signal conditioning to the internal
coupling element
3.18
ground potential
GND
reference potential for any side of a coupler
3.19
input voltage
V
I
input voltage, either V , V or analog level
IL IH
3.20
output voltage
V
O
output voltage, either V , V or analog level
OL OH
3.21
maximum ambient operating temperature
T
op max
maximum ambient operating temperature allowed during operation of coupler
3.22
reference-point temperature
T
REF
temperature defined by the manufacturer to refer to a defined point such as junction
temperature, case temperature, etc.
3.23
characteristic lifetime
t63
refers to characteristic lifetime (t63 %) when applying Weibull distribution to determine the
mean lifetime
Note 1 to entry: In general, lifetime reliability is defined as the mean lifetime (t50 %) at which cumulative failure
rate reaches 50 %. When Weibull distribution is used, a characteristic lifetime (t63 %) is considered for the mean
lifetime. This is referred to as t63 in the statistical lifetime consideration.
3.24
general safety ratings of couplers for basic and reinforced insulation
thermal and mechanical operating conditions that exceed the specified ratings (limiting
values) for normal operation, and to which the specified safety requirements refer
Note 1 to entry: The couplers may become permanently inoperative when safety ratings are applied.
3.25
electrical safety ratings of couplers for basic and reinforced insulation
electrical requirements that have to be met and maintained after the couplers have been
subjected to specified safety ratings, to ensure protection against electrical shock
Note 1 to entry: The couplers may become permanently inoperative when safety ratings are applied.

– 12 – IEC 60747-17:2020 © IEC 2020
[SOURCE: IEC 60747-5-5:2007, 5.2, modified – In the term, the word "requirements" has
been replaced with "ratings", and "isolation" with insulation. In the definition, the word
"photocoupler" has been replaced by "couplers".]
3.25.1
partial discharge
PD
localized electrical discharge which occurs in the insulation between all terminals of the side 1
and all terminals of side 2 of the coupler
3.25.2
apparent charge
q
pd
electrical discharge caused by a partial discharge in the coupler
3.25.3
threshold apparent charge
q
pd(TH)
specified value of apparent charge that is as small as technically feasible, which determines
the partial-discharge extinction voltage
Note 1 to entry: A threshold apparent charge of 5 pC was found to be a practicable criterion for couplers.
Otherwise, it should be defined on each individual device design. Smaller threshold values are desirable but not
required if accurate measurement in a production environment is not practical. This threshold shall not be
exceeded at any time.
Note 2 to entry: In actual testing, this criterion applies to the apparent charge pulse with the maximum value.
Note 3 to entry: The term "specified discharge magnitude" (see 6.1.3.5.4.1 of IEC 60664-1:2007) is synonymous
with "threshold apparent charge".
3.26
test voltage
V
pd(t)
voltage applied during the test period of the partial discharge test between all terminals of
side 1 (connected together) and all terminals of side 2 (connected together) to the coupler
under test
3.26.1
initial test voltage for partial discharge
V
pd(ini)
test voltage applied during the initial test time t
ini
3.26.2
initial test voltage for partial discharge, method a
V
pd(ini),a
value of the voltage applied at the beginning of the measurement, for a specified time t ,
ini
which is intended to simulate the occurrence of a transient overvoltage
Note 1 to entry: Refer to Figure 1, method a.
3.26.3
initial test voltage for partial discharge, method b
V
pd(ini),b
isolation test voltage applied between all terminals of side 1 (connected together) and all
terminals of side 2 (connected together) at routine test (method b) which is equal or higher to
the manufacturer's maximum transient voltage rating

3.27
multiplying factor
F
multiplying factor applied for method a and method b
Note 1 to entry: See Table 5 for more information.
3.28
apparent charge measuring voltage
V
pd(m)
test voltage at which apparent charge is measured
Note 1 to entry: Specified values of this voltage may be expressed as multiple of the specified value of the rated
repetitive peak isolation voltage: V = F × V . Refer to 3.27.
pd(m) IORM
Note 2 to entry: This is a test voltage where the apparent charge shall be equal or less than the specified value.
3.29
partial-discharge inception voltage
V
pd(I)
lowest peak value of an AC test voltage at which the apparent charge is greater than the
specified threshold apparent charge, if the test voltage is increased from a lower value where
no partial discharge occurs
3.30
partial-discharge extinction voltage

V
pd(e)
lowest peak value of an AC test voltage at which the apparent charge is smaller than the
specified threshold apparent charge, if the test voltage is reduced from a higher value where
such discharge occurs
Note 1 to entry: The equivalent RMS value of an AC test voltage may also be used.
3.31
reference voltage for lifetime determination
V
REF
maximum predicated voltage which is determined by the end of life (EOL) test according
5.5.5.8
3.32
lifetime safety factor
lifetime safety factor applied to V to reflect safety consideration on coupler lifetime
REF
3.33
time intervals
duration and sequence of test voltages for partial discharge measurements as shown in
Figure 1
– 14 – IEC 60747-17:2020 © IEC 2020

Time intervals for method a
Time intervals for method b1
Time intervals for method b2
Key
t initial time method a only
ini
t isolation test time method b
ini,b
t (partial-discharge) stress time
st
t (partial-discharge) stress time
st2
t isolation test stress time (method b only)
st1
t (partial-discharge) measuring time
m
t , t , t , t settling times
1 2 3 4
Figure 1 – Time intervals for methods a and b of the test voltage
3.34
lifetime
minimum required time in years to failure based on an insulation grade correlated failure rate
3.35
SiO time dependent dielectric breakdown
SiO TDDB
aging effect observed in isolators using internal constructions utilizing SiO based materials
3.36
thin film polymer space charge degradation
aging effect observed in isolators using internal insulation constructions utilizing thin film
polymer dielectric materials
Note 1 to entry: This constitutes test requirements to establish the maximum safe operating voltage at which
space charge aging does not impact the safety related values V and V .
IORM IOTM
3.37
failure rate over lifetime
FROL
maximum allowed failure rate due to isolation break down using lifetime prediction
3.38
statistical model
mathematical model that embodies a set of statistical assumptions concerning the generation
of sample data
– 16 – IEC 60747-17:2020 © IEC 2020
Note 1 to entry: The type of curve fit shall be based on the material type as defined in 3.2.1 and 3.2.2.
Note 2 to entry: In cases where the insulation material type is not compatible or defined with models in 3.38.1 and
3.38.2, such isolators may only be used in case the specific distinctiveness of such insulation material has been
considered and properly addressed by the regulatory experts and has been added as into the standard.
3.38.1
exponential model
modelling method used for material types defined in 3.2.1 (SiO isolators):
kV
L= ce
where
L is the time-to-failure at test voltage V;
V is the test voltage;
c and k are the coefficients
Note 1 to entry: For the usage of k × V dependency, an adequate data set with sufficient measurement points
shall be provided which clearly proves the k × V dependency according to IEC 62539:2007.
3.38.2
non linear model
modelling method used for material types defined in 3.2.2 (thin film polymer isolators):
−n
kV
= L ce
where
L is the time-to-failure at test voltage V;
V is the test voltage;
c, n and k are the coefficients
-n
Note 1 to entry: For the usage of k × V dependency, an adequate data set with sufficient measurement points
-n
shall be provided which clearly proves the k × V dependency according to IEC 62539:2007.
3.38.3
rated isolation voltages
3.38.3.1
DC isolation voltage
V
IO
value of the constant isolation voltage
3.38.3.2
maximum rated isolation working voltage
V
IOWM
RMS value of isolation voltage V assigned by the manufacturer of the couplers,
IORM
characterizing the specified (long term) withstand capability of its isolation
3.38.3.3
maximum rated repetitive peak isolation voltage
V
IORM
repetitive peak isolation voltage assigned by the manufacturer of the couplers, characterizing
the specified withstand capability of its isolation against repetitive peak voltages
Note 1 to entry: This peak isolation voltage includes all repetitive transient voltages, but excludes all non-
repetitive transient voltages.

Note 2 to entry: A repetitive transient voltage is usually a function of the circuit. A non-repetitive transient voltage
is usually due to an external cause and it is assumed that its effect has completely disappeared before the next
non-repetitive voltage transient arrives.
Note 3 to entry: Since the degradation of the galvanic isolation depends normally on the peak voltage, V is
IORM
the repetitive peak value of the absolute envelope voltage over time.
Note 4 to entry: See IEC 60747-5-5:2007, 5.3, from which the description has been modified to define V as
IORM
repetitive peak or equivalent DC value and state it includes all repetitive transient voltages.
3.38.3.4
maximum rated transient isolation voltage
V
IOTM
peak isolation voltage which includes all non-repetitive transient voltages and applies to the
package clearance as well as internal insulation
Note 1 to entry: See IEC 60664-1:2007.
Note 2 to entry: See IEC 60747-5-5:2007, 5.3, from which the description has been modified to emphasize that
V includes all non-repetitive transient voltages and applies to package clearance as well as internal insulation.
IOTM
3.38.3.5
withstanding isolation voltage
V
ISO
maximum isolation withstanding AC RMS voltage for one minute
3.38.3.6
surge isolation voltage
V
IOSM
highest instantaneous value of an isolation voltage pulse with short time duration and of
specified wave form (1,2/50 µs) applied across the internal insulation of the device
Note 1 to entry: Testing of required V levels as specified in 5.5.4 may be conducted for example in oil to
IOSM
exclude arcing across the surface or in air.
Note 2 to entry: See IEC 60747-5-5:2007, 5.3, from which description has been modified to provide additional
information on duration and wave form.
3.38.3.7
impulse voltage
V
IMP
highest peak value of impulse voltage without flashover and solid insulation breakdown
Note 1 to entry: Wave form and polarity are described in 6.1.2.2.1 of IEC 60664-1:2007.
3.39
absolute maximum ratings
qualifications such as time, frequency, pulse duration, humidity
Note 1 to entry: Exceeding the maximum ratings can lead to damage of the isolation barrier.
3.39.1
minimum and maximum storage temperatures
T
stg
temperatures in non-operation condition
3.39.2
minimum and maximum ambient temperatures
T
amb
temperatures of the air surrounding a component

– 18 – IEC 60747-17:2020 © IEC 2020
3.39.3
maximum soldering temperature
T
sld
maximum soldering time and minimum distance to case which should be specified
3.39.4
maximum continuous input power
P
SI
maximum continuous input power at ambient or a reference point temperature of 25 °C and
derating curve or derating factor
3.39.5
maximum output power dissipation
P
SO
maximum output power dissipation of the output stage at ambient or a reference point
temperature of 25 °C and a derating curve or derating factor
3.39.6
maximum total power dissipation of the package
P
tot
maximum total power dissipation at ambient or reference-point temperature of 25 °C and
derating
...