IEC 62047-10:2011

IEC 62047-10 ®
Edition 1.0 2011-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 10: Micro-pillar compression test for MEMS materials

Dispositifs à semiconducteur – Dispositifs microélectromécaniques –
Partie 10: Essai de compression utilisant la technique des micro-piliers pour
les matériaux des MEMS
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IEC 62047-10 ®
Edition 1.0 2011-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 10: Micro-pillar compression test for MEMS materials

Dispositifs à semiconducteur – Dispositifs microélectromécaniques –
Partie 10: Essai de compression utilisant la technique des micro-piliers pour
les matériaux des MEMS
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX L
ICS 31.080.99 ISBN 978-2-88912-606-4

– 2 – 62047-10  IEC:2011
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Symbols and designations . 5
4 Test piece . 6
4.1 General . 6
4.2 Shape of test piece . 6
4.3 Measurement of dimensions . 6
5 Testing method and test apparatus . 7
5.1 Test principle . 7
5.2 Test machine . 7
5.3 Test procedure . 8
5.4 Test environment. 8
6 Test report. 8
Annex A (informative) Error estimation using finite element method . 10
Bibliography . 11

Figure 1 – Shape of cylindrical pillar (See Table 1 for symbols) . 5
Figure 2 – Schematic of Micro-pillar compression test . 7
Figure A.1 – Error estimation with the aspect ratio and friction coefficient in the elastic
modulus measurement . 10

Table 1 – Symbols and designations of test piece . 6

62047-10  IEC:2011 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 10: Micro-pillar compression test for MEMS materials

FOREWORD
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International Standard IEC 62047-10 has been prepared by subcommittee 47F: Micro-
electromechanical systems, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47F/85/FDIS 47F/94/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of IEC 62047, under the general title Semiconductor devices – Micro-
electromechanical devices, can be found on the IEC website.

– 4 – 62047-10  IEC:2011
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
The contents of the corrigendum of February 2012 have been included in this copy.

IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this publication using a colour printer.

62047-10  IEC:2011 – 5 –
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES –

Part 10: Micro-pillar compression test for MEMS materials

1 Scope
This part of IEC 62047 specifies micro-pillar compression test method to measure
compressive properties of MEMS materials with high accuracy, repeatability, and moderate
effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a
specimen is measured, and the compressive modulus of elasticity and yield strength can be
obtained.
The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micro-
machining technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be
more than 3. This standard is applicable to metallic, ceramic, and polymeric materials.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 62047-8, Semiconductor devices – Micro-electromechanical devices – Part 8: Strip
bending test method for tensile property measurement of thin films
3 Symbols and designations
For the purposes of this document, the shape of test piece and symbols are given in Figure 1
and Table 1, respectively. Test piece in this standard is often referred to as a pillar specimen.

D
Cylindrical pillar
H
Substrate
IEC  1708/11
Key
Components Dimensions of cylindrical pillar
cylindrical pillar: a part
...