IEC 62047-10:2011/COR1:2012
(Corrigendum)Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Corrigendum 1 - Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS
General Information
- Status
- Published
- Publication Date
- 27-Feb-2012
- Technical Committee
- SC 47F - Micro-electromechanical systems
- Current Stage
- PPUB - Publication issued
- Start Date
- 28-Feb-2012
- Completion Date
- 29-Feb-2012
Relations
- Effective Date
- 05-Sep-2023
Frequently Asked Questions
IEC 62047-10:2011/COR1:2012 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials". This standard covers: Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
IEC 62047-10:2011/COR1:2012 is classified under the following ICS (International Classification for Standards) categories: 31.080.99 - Other semiconductor devices. The ICS classification helps identify the subject area and facilitates finding related standards.
IEC 62047-10:2011/COR1:2012 has the following relationships with other standards: It is inter standard links to IEC 62047-10:2011. Understanding these relationships helps ensure you are using the most current and applicable version of the standard.
IEC 62047-10:2011/COR1:2012 is available in PDF format for immediate download after purchase. The document can be added to your cart and obtained through the secure checkout process. Digital delivery ensures instant access to the complete standard document.
Standards Content (Sample)
IEC 62047-10 CEI 62047-10
(First edition – 2011) (Première édition – 2011)
Semiconductor devices – Dispositifs à semiconducteur –
Micro-electromechanical devices – Dispositifs microélectromécaniques –
Part 10: Micro-pillar compression test for MEMS Partie 10: Essai de compression utilisant
materials la technique des micro-piliers pour les
matériaux des MEMS
CO RR
...
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