iTeh StandardsiTeh Standards
EURUSD
Your shopping cart is empty.
IEC

IEC 62132-1:2015

(Main)

Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions

Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions

IEC 62132-1:2015 provides general information and definitions about measurement of electromagnetic immunity of integrated circuits (ICs) to conducted and radiated disturbances. It also defines general test conditions, test equipment and setup, as well as the test procedures and content of the test reports for all parts of the IEC 62132 series. Test method comparison tables are included in Annex A to assist in selecting the appropriate measurement method(s). This edition includes the following significant technical changes with respect to the previous edition:
a) frequency range of 150 kHz to 1 GHz has been deleted from the title;
b) frequency step above 1 GHz has been added in Table 2 in 7.4.1;
c) IC performance classes in 8.3 have been modified;
d) Table A.1 was divided into two tables, and references to IEC 62132-8 and IEC 62132-9 have been added in the new Table A.2 in Annex A.

Circuits intégrés - Mesure de l'immunité électromagnétique - Partie 1: Conditions générales et définitions

L'IEC 62132-1:2015 fournit des informations générales et des définitions relatives à la mesure de l'immunité électromagnétique des circuits intégrés (CI) aux perturbations conduites et rayonnées. Elle définit également les conditions générales d'essai, l'équipement et le montage d'essai, ainsi que les méthodes d'essai et le contenu des rapports d'essai pour toutes les parties de la série IEC 62132. Des tableaux de comparaison des méthodes d'essai sont inclus dans l'Annexe A pour aider à la sélection de la ou des méthodes de mesure appropriées. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) la plage de fréquences de 150 kHz à 1 GHz a été supprimée du titre;
b) l'échelon de fréquence supérieur à 1 GHz a été ajouté dans le Tableau 2 de 7.4.1;
c) les classes de performance des circuits intégrés de 8.3 ont été modifiées;
d) le Tableau A.1 a été divisé en deux tableaux, et des références à l'IEC 62132-8 et à l'IEC 62132-9 ont été ajoutées dans le nouveau Tableau A.2 de l'Annexe A.

General Information

Status
Published
Publication Date
28-Oct-2015
ICS
01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
31.200 - Integrated circuits. Microelectronics
Technical Committee
SC 47A - Integrated circuits
Drafting Committee
WG 9 - TC 47/SC 47A/WG 9
Current Stage
PPUB - Publication issued
Start Date
15-Nov-2015
Completion Date
29-Oct-2015
Ref Project

Relations

Revises
IEC 62132-1:2006 - Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 1: General conditions and definitions
Effective Date
05-Sep-2023

Buy Standard

IEC 62132-1:2015 - Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitionsIEC 62132-1:2015 - Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions
PreviousNext
Standard
IEC 62132-1:2015 - Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions
English and French language
49 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (Sample)


IEC 62132-1 ®
Edition 2.0 2015-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Integrated circuits – Measurement of electromagnetic immunity –
Part 1: General conditions and definitions

Circuits intégrés – Mesure de l'immunité électromagnétique –
Partie 1: Conditions générales et définitions

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé Fax: +41 22 919 03 00
CH-1211 Geneva 20 info@iec.ch
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing more than 30 000 terms and
Technical Specifications, Technical Reports and other definitions in English and French, with equivalent terms in 15
documents. Available for PC, Mac OS, Android Tablets and additional languages. Also known as the International
iPad. Electrotechnical Vocabulary (IEV) online.

IEC publications search - www.iec.ch/searchpub IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a More than 60 000 electrotechnical terminology entries in
variety of criteria (reference number, text, technical English and French extracted from the Terms and Definitions
committee,…). It also gives information on projects, replaced clause of IEC publications issued since 2002. Some entries
and withdrawn publications. have been collected from earlier publications of IEC TC 37,

77, 86 and CISPR.
IEC Just Published - webstore.iec.ch/justpublished

Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: csc@iec.ch.
A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Catalogue IEC - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
Application autonome pour consulter tous les renseignements
Le premier dictionnaire en ligne de termes électroniques et
bibliographiques sur les Normes internationales,
électriques. Il contient plus de 30 000 termes et définitions en
Spécifications techniques, Rapports techniques et autres
anglais et en français, ainsi que les termes équivalents dans
documents de l'IEC. Disponible pour PC, Mac OS, tablettes
15 langues additionnelles. Egalement appelé Vocabulaire
Android et iPad.
Electrotechnique International (IEV) en ligne.

Recherche de publications IEC - www.iec.ch/searchpub
Glossaire IEC - std.iec.ch/glossary
La recherche avancée permet de trouver des publications IEC Plus de 60 000 entrées terminologiques électrotechniques, en
en utilisant différents critères (numéro de référence, texte, anglais et en français, extraites des articles Termes et
comité d’études,…). Elle donne aussi des informations sur les Définitions des publications IEC parues depuis 2002. Plus
projets et les publications remplacées ou retirées. certaines entrées antérieures extraites des publications des

CE 37, 77, 86 et CISPR de l'IEC.
IEC Just Published - webstore.iec.ch/justpublished

Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications IEC. Just
Published détaille les nouvelles publications parues. Si vous désirez nous donner des commentaires sur cette
Disponible en ligne et aussi une fois par mois par email. publication ou si vous avez des questions contactez-nous:
csc@iec.ch.
IEC 62132-1 ®
Edition 2.0 2015-10
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Integrated circuits – Measurement of electromagnetic immunity –

Part 1: General conditions and definitions

Circuits intégrés – Mesure de l'immunité électromagnétique –

Partie 1: Conditions générales et définitions

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-2968-2

– 2 – IEC 62132-1:2015 © IEC 2015
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references. 7
3 Terms and definitions . 7
4 Test conditions . 11
4.1 General . 11
4.2 Ambient conditions . 11
4.2.1 Ambient temperature . 11
4.2.2 RF ambient . 11
4.2.3 RF-immunity of the test setup . 11
4.2.4 Other ambient conditions . 11
4.3 Test generator . 11
4.4 Frequency range . 11
5 Test equipment . 12
5.1 General . 12
5.2 Shielding . 12
5.3 Test generator and power amplifier . 12
5.4 Other components . 12
6 Test setup . 12
6.1 General . 12
6.2 Test circuit board . 12
6.3 Pin selection scheme . 12
6.4 IC pin loading/termination . 13
6.5 Power supply requirements . 13
6.6 IC specific considerations . 13
6.6.1 IC supply voltage . 13
6.6.2 IC decoupling . 14
6.6.3 Operation of IC . 14
6.6.4 Guidelines for IC stimulation . 14
6.6.5 IC monitoring . 14
6.7 IC stability over time . 14
7 Test procedure . 14
7.1 Monitoring check . 14
7.2 Human exposure . 14
7.3 System verification . 14
7.4 Specific procedures . 15
7.4.1 Frequency steps . 15
7.4.2 Amplitude modulation . 15
7.4.3 Power levelling for modulation . 15
7.4.4 Dwell time . 16
7.4.5 Monitoring of the IC . 16
8 Test report. 16
8.1 General . 16

8.2 Immunity limits or levels . 17
8.3 IC performance classes . 17
8.4 Interpretation of results . 17
8.4.1 Comparison between IC(s) using the same test method . 17
8.4.2 Comparison between different test methods. 17
8.4.3 Correlation to module test methods . 17
Annex A (informative) Test method comparison table . 18
Annex B (informative) General test board description . 20
B.1 Overview. 20
B.2 Board description – Mechanical . 20
B.3 Board description – Electrical . 20
B.3.1 General . 20
B.3.2 Ground planes . 20
B.3.3 Package pins . 21
B.3.4 Via diameters . 21
B.3.5 Via distance . 21
B.3.6 Additional components . 21
B.3.7 Supply decoupling . 21
B.3.8 I/O load . 22
Bibliography . 24

Figure 1 – RF signal when RF peak power level is maintained . 16
Figure B.1 – Example of an immunity test board . 23

Table 1 – IC pin loading default values .
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.

This May Also Interest You

IEC
IEC 62433-6:2020(Main)
EMC IC modelling - Part 6: Models of integrated circuits for pulse immunity behavioural simulation - Conducted pulse immunity modelling (ICIM-CPI)

IEC 62433-6:2020 describes the extraction flow for deriving an immunity macro-model of an Integrated Circuit (IC) against conducted Electrostatic Discharge (ESD) according to IEC 61000-4-2 and Electrical Fast Transients (EFT) according to IEC 61000-4-4.
The model addresses physical damages due to overvoltage, thermal damage and other failure modes. Functional failures can also be addressed. This model allows the immunity simulation of the IC in an application. This model is commonly called "Integrated Circuit Immunity Model Conducted Pulse Immunity", ICIM-CPI.
This document provides:
- the description of ICIM-CPI macro-model elements representing electrical, thermal or logical behaviour of the IC.
- a universal data exchange format based on XML.

  • Standard
    110 pages
    English and French language
    sale 15% off
IEC
IEC 62228-3:2019(Main)
Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers

IEC 62228-3:2019 specifies test and measurement methods for EMC evaluation of CAN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for CAN standard transceivers, CAN transceivers with partial networking functionality and CAN transceivers with flexible data rate capability and covers
- the emission of RF disturbances,
- the immunity against RF disturbances,
- the immunity against impulses, and
- the immunity against electrostatic discharges (ESD).
This first edition cancels and replaces the first edition of IEC TS 62228 published in 2007 and constitutes a technical revision. This edition includes the following significant technical changes with respect to IEC TS 62228:
a) introduction of CAN transceivers with partial networking functionality and CAN transceivers with flexible data rate capability and addition of operation modes and test descriptions in the respective subclauses of the document;
b) introduction of minimal communication network with two CAN transceivers;
c) update of the test requirements and targets in Annex C;
d) addition of Annex D for common mode choke characterization.
The contents of the corrigendum of June 2023 have been included in this copy.

  • Standard
    156 pages
    English and French language
    sale 15% off
IEC
IEC 62433-1:2019(Main)
EMC IC modelling - Part 1: General modelling framework

IEC 62433-1:2019 specifies the framework and methodology for EMC IC macro-modelling. Terms that are commonly used in IEC 62433 (all parts), different modelling approaches, requirements and data-exchange format for each model category that is standardized in this series are defined in this document.
IEC 62433-1 cancels and replaces IEC TS 62433-1 published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to IEC TS 62433 1:2011:
Incorporation of a data exchange format for an integrated circuit’s model representation.
The contents of the corrigendum of July 2020 have been included in this copy.

  • Standard
    59 pages
    English language
    sale 15% off
  • Standard
    122 pages
    English and French language
    sale 15% off
IEC
IEC 61967-1:2018(Main)
Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions

IEC 61967-1:2018 is available as IEC 61967-1:2018 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 61967-1:2018 provides general information and definitions on the measurement of conducted and radiated electromagnetic disturbances from integrated circuits. It also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. Test method comparison tables are include in Annex A to assist in selecting the appropriate measurement method(s). The object of this document is to describe general conditions in order to establish a uniform testing environment and to obtain a quantitative measure of RF disturbances from integrated circuits (IC). Critical parameters that are expected to influence the test results are described. Deviations from this document are noted explicitly in the individual test report. The measurement results can be used for comparison or other purposes. Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under controlled conditions, yields information about the potential for RF disturbances in an application of the integrated circuit. The applicable frequency range is described in each part of IEC 61967.
This edition includes the following significant technical changes with respect to the previous edition:
- the frequency range of 150 kHz to 1 GHz has been deleted from the title;
- the frequency step above 1 GHz has been added to Table 1, Table 2 and to 5.4;
- Table A.1 has been divided into two tables, and IEC 61967-8 has been added to Table A.2 of Annex A;
- the general test board description has been moved to Annex D.

  • Standard
    79 pages
    English language
    sale 15% off
  • Standard
    52 pages
    English and French language
    sale 15% off
IEC
IEC 63011-1:2018(Main)
Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology

IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

  • Standard
    24 pages
    English and French language
    sale 15% off
IEC
IEC 63011-2:2018(Main)
Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

  • Standard
    28 pages
    English and French language
    sale 15% off
IEC
IEC 63011-3:2018(Main)
Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via

IEC 63011-3:2018 specifies a reference model of through-silicon via (TSV) electrical characteristics required for an interface design in three dimensional integrated circuit (3-D IC) to transmit and receive digital data and measurement conditions for resistance and capacitance to specify TSV characteristics in 3-D IC.
Power devices, RF devices and micro-electromechanical systems (MEMS) are not in the scope of this document.

  • Standard
    28 pages
    English and French language
    sale 15% off
IEC
IEC 62228-1:2018(Main)
Integrated circuits - EMC evaluation of transceivers - Part 1: General conditions and definitions

IEC 62228-1:2018 provides general information and definitions for electromagnetic compatibility (EMC) evaluation of integrated circuits (IC) with transceivers for wired network applications under network condition. It defines general test conditions, general test setups and test and measurement methods are applied to all parts of IEC 62228.

  • Standard
    8 pages
    English language
    sale 15% off
  • Standard
    17 pages
    English and French language
    sale 15% off
IEC
IEC 62433-2:2017(Main)
EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)

IEC 62433-2:2017 specifies macro-models for an Integrated Circuit (IC) to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE macro-model can also be used for modelling an IC-die, a functional block and an Intellectual Property (IP) block. The ICEM-CE macro-model can be used to model both digital and analogue ICs. This edition includes the following significant technical changes with respect to the previous edition:
Incorporation of an XML based exchange format for model representation.

  • Standard
    217 pages
    English and French language
    sale 15% off
IEC
IEC 62433-3:2017(Main)
EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)

IEC 62433-3:2017 provides a method for deriving a macro-model to allow the simulation of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called Integrated Circuit Emission Model - Radiated Emission, ICEM-RE. The model is intended to be used for modelling a complete IC, with or without its associated package, a functional block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output pins, digital core and supply), when measured or simulated data cannot be directly imported into simulation tools.

  • Standard
    181 pages
    English and French language
    sale 15% off