IEC TS 62564-1:2016

IEC TS 62564-1 ®
Edition 3.0 2016-07
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace qualified electronic components
(AQEC) –
Part 1: Integrated circuits and discrete semiconductors
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IEC TS 62564-1 ®
Edition 3.0 2016-07
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace qualified electronic components

(AQEC) –
Part 1: Integrated circuits and discrete semiconductors

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-3513-3

– 2 – IEC TS 62564-1:2016 © IEC 2016
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references. 6
3 Terms, definitions and abbreviations . 7
3.1 Terms and definitions . 7
3.2 Abbreviations . 9
4 Technical requirements . 9
4.1 AQEC plan . 9
4.2 AQEC documentation . 10
4.2.1 General . 10
4.2.2 AQEC data sheet . 10
4.2.3 Material content . 10
4.2.4 AQEC visibility . 10
4.2.5 AQEC life expectancy . 10
4.2.6 Device technology . 11
4.2.7 SEE data . 11
4.2.8 Termination finish . 11
4.2.9 Third party part numbers . 11
4.3 AQEC performance . 12
4.3.1 Performance . 12
4.3.2 Functional parameters . 13
4.3.3 Known limitations . 13
4.4 Quality system certification . 13
4.5 Component qualification and re-qualification . 13
4.6 AQEC quality assurance and reliability monitoring . 13
4.7 Product change notification (PCN) . 14
4.8 Last time buy (LTB) notification . 14
4.9 Obsolescence management . 14
4.10 Counterfeit prevention . 14
4.11 User or customer guide . 14
Annex A (informative) AQEC material content and construction table . 15
Annex B (informative) Additional desired data . 17
Bibliography . 18

Table A.1 – AQEC material content and construction . 15

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) –

Part 1: Integrated circuits and discrete semiconductors

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
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other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC TS 62564-1, which is a technical specification, has been prepared by IEC technical
committee 107: Process management for avionics.

– 4 – IEC TS 62564-1:2016 © IEC 2016
This third edition cancels and replaces the second edition, published in 2011. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) IEC TS 62239 changed to IEC TS 62239-1, and IEC PAS 62686-1 changed to
IEC TS 62686-1;
b) JESD48 changed to J-STD-048 and added to the Bibliography;
c) AEC-Q100 revision G changed to AEC-Q100:2014 in 4.5 (which is now revision H);
d) revision of AEC-Q101 removed in Bibliography;
e) J-STD-609 for “Marking and labelling” added to the Bibliography;
f) information added regarding components' life expectancy in 4.2.5.
GEIA-STD-0002-001 (June 2006), Aerospace Qualified Electronic Component (AQEC)
Requirements, Volume 1 – Integrated Circuits and Semiconductors, has served as a basis for
the elaboration of this technical specification.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/276/DTS 107/283/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62564 series, under the general title Process management for
avionics – Aerospace qualified electronic components (AQEC), can be found on the IEC
website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

INTRODUCTION
Aerospace qualified electronic components (AQEC) plans are developed by manufacturers in
order to document compliance with AQEC requirements. For AQEC designated components,
the intention is to
a) provide AQEC users access to information from the AQEC manufacturers that is
necessary for using commercial-off-the-shelf (COTS) products;
b) better enable AQEC users to assess whether these parts are capable of operating reliably
in their applications;
c) minimize deviations from the AQEC manufacturers’ COTS products;
d) have minimal impact on the AQEC manufacturers’ standard operating or business
procedures;
e) promote communication between the AQEC manufacturers and users.

– 6 – IEC TS 62564-1:2016 © IEC 2016
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) –

Part 1: Integrated circuits and discrete semiconductors

1 Scope
This part of IEC 62564, which is a Technical Specification, defines the minimum requirements
for integrated circuits and semiconductors which are designated as an “aerospace qualified
electronic component (AQEC)”. It applies to integrated circuits and semiconductors exhibiting
the following attributes:
a) a minimum set of requirements, or information provided by the part manufacturer, which
will allow a standard COTS component to be designated AQEC by the manufacturer;
b) as a minimum, each COTS component (designated AQEC) will have been designed,
fabricated, assembled, and tested in accordance with the component manufacturer’s
requirements for standard data book components;
c) qualification of, and quality systems for, the COTS components to be designated as AQEC
should include the manufacturer’s standards, operating procedures, and technical
specifications. This information should be available when requested;
d) components manufactured before the manufacturer has addressed AQEC requirements,
but utilizing the same processes, are also considered AQEC compliant;
e) additional desired attributes of a device designated AQEC (that will support AQEC users)
are found in Annex B of this technical specification.
NOTE Parts qualified to military specifications (except those identified as being for “logistic support” purposes
only) are considered AQEC; the remainder of this technical specification only addresses non-military specification
parts.
Parts qualified to AEC-Q100, grade 0 through to grade 3 are considered AQEC. For those
applications where a 0 °C to +70 °C temperature range is appropriate, grade 4 is also
considered to be AQEC. The users should document that the grade category used is
compatible with the application in accordance with their IEC TS 62239-1 electronic
components management plan (ECMP).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC TS 62239-1, Process management for avionics – Management plan – Part 1: Preparation
and maintenance of an electronic components management plan
IEC 62396-1, Process management for avionics – Atmospheric radiation effects – Part 1:
Accommodation of atmospheric radiation effects via single event effects within avionics
electronic equipment
IEC TS 62668-1, Process management for avionics – Counterfeit prevention − Part 1:
Avoiding the use of counterfeit, fraudulent and recycled electronic components
ISO 9001, Quality management systems – Requirements

J-STD-048, Notification Standard for Product Discontinuance
3 Terms, definitions and abbreviations
For the purposes of this document, the following terms, definitions and abbreviations apply.
3.1 Terms and definitions
3.1.1
AQEC specification
document prepared by or for the manufacturer to describe an AQEC product
Note 1 to entry: It includes a data sheet and may include other documents, such as material descriptions,
environmental test procedures, quality monitoring processes, etc. It may be a stand-alone document or a clearly
denoted item within a larger documentation system. There may be additional data associated with specific
applications which may be requested separately.
3.1.2
AQEC plan
instrument prepared by the plan owner (see 3.1.10) that clearly, concisely, and
unambiguously documents the processes used by the plan owner to satisfy the requirements
of this technical specification
Note 1 to entry: The plan contains auditable content.
3.1.3
assessment
evaluation of a plan owner’s AQEC plan to determine if it is compliant with this technical
specification
Note 1 to entry: It may be conducted by IECQ, the customer, the customer’s designee, or by a third party
designated by the customer community.
3.1.4
microcircuit
integrated circuit
microcircuit (device with a high circuit-element density) in which all or some of the circuit
elements are inseparably associated and electrically interconnected (on one or more
substrates, in a unique indivisible package) so that the microcircuit is considered to be
indivisible for the purpose of construction and commerce
3.1.5
semiconductor
discrete semiconductor device
semiconductor device that is specified to perform an elementary function and that is not
divisible into separate components functional in themselves (for example diodes, transistors,
optocouplers, LEDs and related products)
3.1.6
component
part
microcircuit, integrated circuit, semiconductor or discrete semiconductor for the purpose of
this specification
– 8 – IEC TS 62564-1:2016 © IEC 2016
3.1.7
customer
user
designer
original equipment manufacturer (OEM) that procures integrated circuits and/or
semiconductor devices compliant with this technical specification and uses them to design,
produce, and maintain systems
3.1.8
customer community
body of customers that may act together to address issues related to this technical
specification
3.1.9
data sheet
document prepared by the manufacturer that describes the electrical, mechanical, and
environmental characteristics of the component
3.1.10
manufacturer
plan owner
producer of integrated circuits, microcircuits, or other semiconductor devices that may be
designated AQEC
Note 1 to entry: A manufacturer may produce the components directly or may oversee subcontracted
manufacturing according to their own processes. The manufacturer is also the plan owner.
3.1.11
supplier
distributor of components
Note 1 to entry: A plan for controlling AQEC inventory is in place in order to supply AQECs. A manufacturer can
be a supplier in the case where no distributor is involved.
3.1.12
third party
party designated to act on the behalf of the customer community
3.1.13
termination
element of a component that connects it electrically and mechanically to the next level of
assembly
Note 1 to entry: A termination includes base materials and coatings (including underplates).
3.1.14
form
shape, size, arrangement of parts, visible aspect, mode in which a part exists or manifests
itself, or the material an item is constructed from
3.1.15
fit
qualified and competent
3.1.16
function
work to a specification that an item is designed for without degrading reliability

3.2 Abbreviations
AQEC Aerospace qualified electronic component
Bi-CMOS Bipolar CMOS
BPSG Borophosphosilicate glass
COTS Commercial off the shelf
CMOS Complementary metal oxide semiconductor
DDR Double data rate
DRAM Dynamic random access memory
DSCC Defence supply centre Columbus (see http://www.dscc.dla.mil/)
DSIAC Defense systems information analysis center
ECMP Electronic component management plan
FFF Form, fit and function
FIT Failures in time
FPGA Field programmable gate array
GIDEP Government industry data exchange program
HAST Highly accelerated stress test
HCI Hot carrier injection
HTOL High temperature operating life
LED Light emitting diode
LTB Last time buy
MCU Multiple cell upset
MRAM Magnetoresistive random access memory
NAND Negation AND
NBTI Negative bias temperature Instability
NOR Negation OR
PBTI Positive bias temperature instability
PCN Product change notification
SDRAM Synchronous dynamic random access memory
SEE Single event effect
SEU Single event upset
SER Soft error rate
SEL Single event latch
SEFI Single event functional interrupt
SRAM Static random access memory
SOS Silicon on sapphire
TDDB Time dependant dielectric bre
...