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IEC 60191-6-18:2010/COR2:2010

(Corrigendum)

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Defines the measurement of physical performance characteristics of air-conduction hearing aids based on a free-field technique and measured with an ear simulator. Describes methods of measurement for evaluation of the electroacoustical characteristics of hearing aids.

Corrigendum 2 - Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-18: Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers matriciels à billes (BGA)

Décrit la mesure des caractéristiques physiques des appareils de correction auditive à conduction aérienne, fondée sur une technique de champ acoustique libre et utilisant un simulateur d'oreille. Décrit des méthodes de mesure pour l'évaluation des caractéristiques électroacoustiques des appareils de correction auditive.

General Information

Status
Published
Publication Date
27-Jul-2010
ICS
17.140.50 - Electroacoustics
31.080.01 - Semiconductor devices in general
Technical Committee
SC 47D - Semiconductor devices packaging
Current Stage
PPUB - Publication issued
Start Date
31-Jul-2010
Completion Date
28-Jul-2010
Ref Project

Relations

Corrects
IEC 60191-6-18:2010 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Effective Date
05-Sep-2023
Corrects
IEC 60191-6-18:2010/COR1:2010 - Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Effective Date
05-Sep-2023
Corrects
IEC PAS 60191-6-18:2008 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Effective Date
05-Sep-2023

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IEC 60191-6-18:2010/COR2:2010 - Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) Released:7/28/2010IEC 60191-6-18:2010/COR2:2010 - Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) Released:7/28/2010
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IEC 60191-6-18:2010/COR2:2010 - Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) Released:7/28/2010
English and French language
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Standards Content (Sample)


IEC 60191-6-18 CEI 60191-6-18
(Edition 1.0 – 2010) (édition 1.0 – 2010)

MECHANICAL STANDARDIZATION OF NORMALISATION MÉCANIQUE DES DISPOSITIFS
SEMICONDUCTOR DEVICES – À SEMICONDUCTEURS –

Part 6-18: General rules for the preparation of Partie 6-18: Règles générales pour la préparation
outline drawings of surface mounted
des dessins d’encombrement des dispositifs à
semiconductor device packages –
semiconducteurs pour montage en surface –
Design guide for ball grid array
...

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