IEC 61188-5-5:2007

IEC 61188-5-5
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
Printed boards and printed board assemblies – Design and use –
Part 5-5: Attachment (land/joint) considerations – Components with gull-wing
leads on four sides
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IEC 61188-5-5
Edition 1.0 2007-10
INTERNATIONAL
STANDARD
Printed boards and printed board assemblies – Design and use –
Part 5-5: Attachment (land/joint) considerations – Components with gull-wing
leads on four sides
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
X
ICS 31.180 ISBN 2-8318-9342-9
– 2 – 61188-5-5 © IEC:2007(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6

1 Scope.7
2 Normative references .7
3 General information.7
3.1 General component description .7
3.2 Marking .7
3.3 Carrier packaging format .8
3.4 Process considerations .8
4 PQFP (square) .8
4.1 Field of application .8
4.2 Component descriptions .8
4.3 Component dimensions .9
4.4 Solder joint fillet design .13
4.5 Land pattern dimensions .14
5 PQFP (rectangular) .17
5.1 Field of application .17
5.2 Component descriptions .18
5.3 Component dimensions .19
5.4 Solder joint fillet design .19
5.5 Land pattern dimensions .21
6 PLQFP (square) .23
6.1 Field of application .23
6.2 Component descriptions .23
6.3 Component dimensions .24
6.4 Solder joint fillet design .26
6.5 Land pattern dimensions .28
7 PLQFP (rectangular) .31
7.1 Field of application .31
7.2 Component descriptions .31
7.3 Component dimensions .32
7.4 Solder joint fillet design .33
7.5 Land pattern dimensions .34
8 PTQFP (square) .35
8.1 Field of application .35
8.2 Component descriptions .35
8.3 Component dimensions .36
8.4 Solder joint fillet design .39
8.5 Land pattern dimensions .40

Figure 1 – PQFP (square).9
Figure 2 – PQFP (square) component dimensions .10
Figure 3 – Solder joint fillet design.14
Figure 4 – PQFP (square) land pattern dimensions.17

61188-5-5 © IEC:2007(E) – 3 –
Figure 5 – PQFP (rectangular) .18
Figure 6 – PQFP (rectangular) component dimensions .19
Figure 7 – Solder joint fillet design.21
Figure 8 – PQFP (rectangular) land pattern dimensions .22
Figure 9 – PLQFP (square) .23
Figure 10 – PLQFP (square) component dimensions .24
Figure 11 – Solder joint fillet design.28
Figure 12 – PLQFP (square) land pattern dimensions .31
Figure 13 – PLQFP (rectangular) .32
Figure 14 – PLQFP (rectangular) component dimensions.32
Figure 15 – Solder joint fillet design.34
Figure 16 – PLQFP (rectangular) land pattern dimensions .35
Figure 17 – PTQFP (square).36
Figure 18 – PTQFP component dimensions .37
Figure 19 – Solder joint fillet design.40
Figure 20 – PTQFP land pattern dimensions.42

– 4 – 61188-5-5 © IEC:2007(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-5: Attachment (land/joint) considerations –
Components with gull-wing leads on four sides

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61188-5-5 has been prepared by IEC technical committee 91:
Electronics assembly technology.
The text of this standard is based on the following documents:
FDIS Report on voting
91/704/FDIS 91/736/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
IEC 61188-5-5 is to be read in conjunction with IEC 61188-5-1.

61188-5-5 © IEC:2007(E) – 5 –
A list of all parts of the IEC 61188 series, under the general title Printed boards and printed
board assemblies – Design and use, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

– 6 – 61188-5-5 © IEC:2007(E)
INTRODUCTION
This part of IEC 61188 covers land patterns for components with gull-wing leads on four sides.
Each clause gives information in accordance with the following format.
The proposed land pattern dimensions in this standard are based upon the fundamental
tolerance calculation combined with the given land protrusions and courtyard excesses (see
IEC 61188-5-1, Generic requirements). The courtyard includes all issues of the normal
manufacturing necessities.
The unaltered land pattern dimensions of this part are generally applicable for the solder
paste application plus reflow soldering process. For application of the wave soldering process,
the land pattern dimensions normally have to be modified. Orientation parallel to the wave
direction is preferable and special, suitably dimensioned solder thieves should be added.
This standard offers a threefold land pattern dimensioning (levels 1, 2, and 3) on the basis of
a threefold set of land protrusions and courtyard excesses: maximum (max.); median (mdn)
and minimum (min.). Each land pattern has been assigned an identification number to indicate
the characteristics of the specific robustness of the land patterns. Users also have the
opportunity to organize the information so that it is most useful for their particular design.
If a user has good reason to use a concept different from that of IEC 61188-5-1, or if the user
prefers unusual land protrusions, this standard should be used for checking the resulting
solder fillet size.
It is the responsibility of the user to verify the SMD land patterns used for achieving an
undisturbed mounting process including testing and an ensured reliability for the product
stress conditions in use.
Component dimensions listed in this standard are those available on the market and should
be regarded as for reference only.

61188-5-5 © IEC:2007(E) – 7 –
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES –
DESIGN AND USE –
Part 5-5: Attachment (land/joint) considerations –
Components with gull-wing leads on four sides

1 Scope
This part of IEC 61188 provides information on land pattern geometries used for the surface
attachment of electronic components with gull-wing leads on four sides. The intent of the
information presented herein is to provide the appropriate size, shape and tolerances of
surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also
allow for inspection, testing and reworking of those solder joints.
Each clause contains a specific set of criteria such that the information presented is
consistent, providing information on the component, the component dimensions, the solder
joint design and the land pattern dimensions.
The land pattern dimensions are based on a mathematical model that establishes a platform
for a solder joint attachment to the printed board. The existing models create a platform that is
capable of establishing a reliable solder alloy used to make that joint (lead-free, tin lead, etc.).
Process requirements for solder reflow are different based on the solder alloy and should be
analyzed in order that the process is above that temperature a sufficient time to form a
reliable metallurgical bond.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61188-5-1, Printed boards and printed board assemblies – Design and use – Part 5-1:
Attachment (land/joint) considerations – Generic requirements
3 General information
3.1 General component description
The four-sided gull wing family is characterized by gull-wing leads on four sides of a square or
rectangular package. The family includes both molded plastic and ceramic case styles. The
acronyms PQFP (plastic quad flat pack) and CQFP (ceramic quad flat pack) are also used to
describe the family.
There are several lead pitches within the family form 1,0 mm to 0,30 mm. High lead-court
packages are available in this family that accommodate complex, high lead-count chips.
3.2 Marking
The PQFP and CQFP families of parts are generally marked with the manufacturer’s part
numbers, manufacturer’s name or symbol and a pin 1 indicator. Some parts may have a pin 1
feature in the case shape instead of pin 1 marking. Additional markings may include date-
code manufacturing lot and/or manufacturing location.

– 8 – 61188-5-5 © IEC:2007(E)
3.3 Carrier packaging format
Carrier packaging format may be provided in tube but packaging tray carries are preferred for
best handling and high volume applications. Bulk packaging is not acceptable because of lead
co-planarity required for placement and soldering.
3.4 Process considerations
PQFP and CQFP packages are normally processed by reflow solder operations.
High lead-count fine pitch parts may require special processing outside the normal pick/place
and reflow manufacturing operations.
4 PQFP (square)
4.1 Field of application
This clause provides the component and land pattern dimensions for square PQFP (plastic
quad flat pack) components. Basic construction of the PQFP device is also covered. At the
end of this clause is a listing of the tolerances and target solder joint dimensions used to
arrive at the land pattern dimensions.
4.2 Component descriptions
PQFPs are widely used in a variety of applications for commercial, industrial or military
electronics.
4.2.1 Basic construction
The quad flat pack has been developed for applications requiring low height and high density.
The PQFP, along with the LSOP components, are frequently used in memory card
applications (see Figure 1).
4.2.1.1 Termination materials
Leads shall be solder-coated with a tin/lead alloy. The solder should contain between 58 % to
68 % tin. Solder may be applied to the leads by hot dipping or by plating from solution. Plated
solder terminations should be subjected to post plating reflow operation to fuse the solder.
The tin/lead finish should be at least 0,007 5 mm thick.
4.2.1.2 Marking
All parts shall be marked with a part number and an index area. The index area shall identify
the location of pin 1.
4.2.1.3 Carrier package format
The carrier package format for flat packs may be tubular in shape but, in most instances, flat
packs are delivered in a carrier tray.
4.2.1.4 Process considerations
PQFPs are usually processed using standard reflow solder processes. Parts should be
capable of withstanding ten cycles through a standard reflow system operating at 235 °C.
Each cycle shall consist of 60 s exposure at 235 °C.

61188-5-5 © IEC:2007(E) – 9 –
IEC  2022/07
Figure 1 – PQFP (square)
4.3 Component dimensions
Land pattern dimensional data may need to be adjusted if the component dimensional data
does not match JEDEC and/or JEITA sheets.
Figure 2 provides the component dimensions for PQFP (square) components.

– 10 – 61188-5-5 © IEC:2007(E)

Lp
A
L1
S
IEC  2023/07
Dimensions in millimetres
L2 L1 Lp
EIAJ codes JEDEC code
Min. Max. Min. Max. Min. Max.
P-QFP-0036-0505-1,00 P-QFP/036-5x5-1,00 12,95 13,45 12,95 13,45 0,73 1,03
P-QFP-0044-0505-0,80 P-QFP/044-5x5-0,80 12,95 13,45 12,95 13,45 0,73 1,03
P-QFP-0052-0505-0,65 P-QFP/052-5x5-0,65 12,95 13,45 12,95 13,45 0,73 1,03
P-QFP-0048-1212-0,80 P-QFP/048-12x12-0,80 14,95 15,45 14,95 13,45 0,73 1,03
P-QFP-0052-1414-1,00 P-QFP/052-14x14-1,00 16,95 17,45 16,95 17,45 0,73 1,03
P-QFP-0064-1414-0,80 P-QFP/064-14x14-0,80 16,95 17,45 16,95 17,45 0,73 1,03
P-QFP-0080-1414-0,65 P-QFP/080-14x14-0,65 15,75 17,45 16,95 17,45 0,73 1,03
P-QFP-0100-1414-0,50 P-QFP/100-14x14-0,50 15,75 16,25 15,75 16,25 0,45 0,75
P-QFP-0120-1414-0,40 P-QFP/120-14x14-0,40 15,75 16,25 15,75 16,25 0,45 0,75
P-QFP-0168-1414-0,30 P-QFP/168-14x14-0,30 15,75 16,25 15,75 16,25 0,45 0,75
P-QFP-0076-2020-1,00 P-QFP/076-20x20-1,00 22,95 23,45 22,95 23,45 0,73 1,03
P-QFP-0076-2020-1,00 P-QFP/076-20x20-1,00 22,95 23,45 22,95 23,45 0,73 1,03
P-QFP-0088-2020-0,80 P-QFP/088-20x20-0,80 22,95 23,45 22,95 23,45 0,73 1,03
P-QFP-0088-2020-0,80 P-QFP/088-20x20-0,80
22,95 23,45 22,95 23,45 0,73 1,03
W S* B A P H
Remarks
Min. Nom. Max. Min. Max.
0,34 0,40 0,46 10,89 11,55 10,0 10,0 1,00 2,45
0,29 0,35 0,41 10,89 11,55 10,0 10,0 0,80 2,45
0,22 0,30 0,36 10,89 11,55 10,0 10,0 0,65 2,45
0,29 0,35 0,41 12,89 13,55 12,0 12,0 0,80 2,45
0,34 0,40 0,46 14,89 15,55 14,0 14,0 1,00 3,15
0,29 0,35 0,41 14,89 15,55 14,0 14,0 0,80 3,15
0,22 0,30 0,36 14,89 15,55 14,0 14,0 0,65 3,15
0,17 0,20 0,23 14,25 14,91 14,0 14,0 0,50 3,15
0,13 0,16 0,19 14,25 14,91 14,0 14,0 0,40 3,15
0,09 0,12 0,15 14,25 14,91 14,0 14,0 0,40 3,15
0,34 0,40 0,46 20,89 21,55 20,0 20,0 1,00 3,15 Low stand-off
0,34 0,40 0,46 20,89 21,55 20,0 20,0 1,00 3,40 High stand-off
0,29 0,35 0,41 20,89 21,55 20,0 20,0 0,80 3,15 Low stand-off
0,29 0,35 0,41 20,89 21,55 20,0 20,0 0,80 3,40 High stand-off
* Calculated value.
Figure 2 – PQFP (square) component dimensions
L2
B
H W P
0,25
61188-5-5 © IEC:2007(E) – 11 –

Lp
A
L1
S
IEC  2023/07
Dimensions in millimetres
L2 L1 Lp
EIAJ codes JEDEC code
Min. Max. Min. Max. Min. Max.
P-QFP-0112-2020-0,65 P-QFP/112-20x20-0,65 22,95 23,45 22,95 23,45 0,73 1,03
P-QFP-0112-2020-0,65 P-QFP/112-20x20-0,65 22,95 23,45 22,95 23,45 0,73 1,03
P-QFP-0144-2020-0,50 P-QFP/144-20x20-0,50 21,75 22,25 21,75 22,25 0,45 0,75
P-QFP-0144-2020-0,50 P-QFP/144-20x20-0,50 21,75 22,25 21,75 22,25 0,45 0,75
P-QFP-0176-2020-0,40 P-QFP/176-20x20-0,40 21,75 22,25 21,75 22,25 0,45 0,75
P-QFP-0176-2020-0,40 P-QFP/176-20x20-0,40 21,75 22,25 21,75 22,25 0,45 0,75
P-QFP-0240-2020-0,30 P-QFP/240-20x20-0,30 21,75 22,25 21,75 22,25 0,45 0,75
P-QFP-0176-2424-0,50 P-QFP/176-24x24-0,50 26,35 26,85 26,35 26,85 0,45 0,75
P-QFP-0176-2424-0,50 P-QFP/176-24x24-0,50 26,35 26,85 26,35 26,85 0,45 0,75
P-QFP-0216-2424-0,40 P-QFP/216-24x24-0,40 26,35 26,85 26,35 26,85 0,45 0,75
P-QFP-0216-2424-0,40 P-QFP/216-24x24-0,40 26,35 26,85 26,35 26,85 0,45 0,75
P-QFP-0128-2828-0,80 P-QFP/128-28x28-0,80 30,95 31,45 30,95 31,45 0,73 1,03
P-QFP-0128-2828-0,80 P-QFP/128-28x28-0,80 30,95 31,45 30,95 31,45 0,73 1,03
P-QFP-0160-2828-0,65 P-QFP/160-28x28-0,65 30,95 31,45 30,95 31,45 0,73 1,03

W S*
B A P H Remarks
Min. Nom. Max. Min. Max.
0,22 0,30 0,36 20,89 21,55 20,0 20,0 0,65 3,15 Low stand-off
0,22 0,30 0,36 20,89 21,55 20,0 20,0 0,65 3,40 High stand-off
0,17 0,2 0,23 20,25 20,91 20,0 20,0 0,50 3,15 Low stand-off
0,17 0,2 0,23 20,25 20,91 20,0 20,0 0,50 3,40 High stand-off
0,13 0,16 0,19 20,25 20,91 20,0 20,0 0,40 3,15 Low stand-off
0,13 0,16 0,19 20,25 20,91 20,0 20,0 0,40 3,40 High stand-off
0,09 0,12 0,15 20,25 20,91 20,0 20,0 0,30 3,40 Low stand-off
0,17 0,2 0,23 24,85 25,51 24,0 24,0 0,50 3,85 High stand-off
0,17 0,2 0,23 24,85 25,51 24,0 24,0 0,50 4,10 Low stand-off
0,13 0,16 0,19 24,85 25,51 24,0 24,0 0,40 3,85 High stand-off
0,13 0,16 0,19 24,85 25,51 24,0 24,0 0,40 4,10 Low stand-off
0,29 0,35 0,41 28,89 29,55 28,0 28,0 0,80 3,85 High stand-off
0,29 0,35 0,41 28,89 29,55 28,0 28,0 0,80 4,10 Low stand-off
0,22 0,3 0,36 28,89 29,55 28,0 28,0 0,65 3,85 High stand-off
* Calculated value.
Figure 2 (continued)
L2
B
H W P
0,25
– 12 – 61188-5-5 © IEC:2007(E)

Lp
A
L1
S
IEC  2023/07
Dimensions in millimetres
EIAJ codes JEDEC code L2 L1 Lp
Min. Max. Min. Max. Min. Max.
P-QFP-0160-2828-0,65 P-QFP/160-28x28-0,65 30,95 31,45 30,95 31,45 0,73 1,03
P-QFP-0208-2828-0,50 P-QFP/208-28x28-0,50 30,35 30,85 30,35 30,85 0,45 0,75
P-QFP-0208-2828-0,50 P-QFP/208-28x28-0,50 30,35 30,85 30,35 30,85 0,45 0,75
P-QFP-0256-2828-0,40 P-QFP/256-28x28-0,40 30,35 30,85 30,35 30,85 0,45 0,75
P-QFP-0256-2828-0,40 P-QFP/256-28x28-0,40 30,35 30,85 30,35 30,85 0,45 0,75
P-QFP-0184-3232-0,65 P-QFP/184-32x32-0,65 34,95 35,45 34,95 35,45 0,73 1,03
P-QFP-0240-3232-0,50 P-QFP/240-32x32-0,50 34,95 34,85 34,95 34,85 0,45 0,75
P-QFP-0296-3232-0,40 P-QFP/296-32x32-0,40 34,95 34,85 34,95 34,85 0,45 0,75
P-QFP-0272-3636-0,50 P-QFP/272-36x36-0,50 38,35 38,85 38,35 38,85 0,45 0,75
P-QFP-0336-3636-0,40 P-QFP/336-36x36-0,40 38,35 38,85 38,35 38,85 0,45 0,75
P-QFP-0232-4040-0,65 P-QFP/232-40x40-0,65 42,95 43,45 42,95 43,45 0,73 1,03
P-QFP-0304-4040-0,50 P-QFP/304-40x40-0,50 42,35 42,85 42,35 42,85 0,45 0,75
P-QFP-0376-4040-0,40 P-QFP/376-40x40-0,40 42,35 42,85 42,35 42,85 0,45 0,75

W S* B A P H
Remarks
Min. Nom. Max. Max. Max.
0,22 0,3 0,36 28,89 29,55 28,0 28,0 0,65 4,10 Low stand-off
0,17 0,2 0,23 28,85 29,51 28,0 28,0 0,50 3,85 High stand-off
0,17 0,2 0,23 28,85 29,51 28,0 28,0 0,50 4,10 High stand-off
0,13 0,16 0,19 28,85 29,51 28,0 28,0 0,40 3,85 High stand-off
0,13 0,16 0,19 28,85 29,51 28,0 28,0 0,40 4,10 High stand-off
0,22 0,3 0,36 32,89 29,51 32,0 32,0 0,65 4,10 High stand-off
0,17 0,2 0,23 33,45 33,89 32,0 32,0 0,50 4,10 High stand-off
0,13 0,16 0,19 33,45 33,89 32,0 32,0 0,40 4,10 High stand-off
0,17 0,2 0,23 36,85 37,51 36,0 36,0 0,50 4,50 High stand-off
0,13 0,16 0,19 36,85 37,51 36,0 36,0 0,40 4,50 High stand-off
0,22 0,3 0,36 40,89 41,55 40,0 40,0 0,65 4,50 High stand-off
0,17 0,2 0,23 40,85 41,51 40,0 40,0 0,50 4,50 High stand-off
0,13 0,16 0,19 40,85 41,51 40,0 40,0 0,40 4,50 High stand-off
* Calculated value.
Figure 2 (continued)
L2
B
H W P
0,25
61188-5-5 © IEC:2007(E) – 13 –
4.4 Solder joint fillet design
Figure 3 shows the shape and dimensions of the solder fillet after the soldering process. The
minimum, median and maximum dimensions of each of toe, heel and side fillet are determined
by taking into consideration solder joint reliability and also quality and productivity in the
mounting process of parts.
In designing land patterns, three accuracy factors need to be taken into consideration:
– parts dimensions accuracy (C);
– parts mount accuracy on PWBs (P);
– land shape accuracy of PWBs (F),
in addition to fillet dimensions. The formulae to obtain the tolerance resulted from these
factors are basically as follows:
a) Design consideration when soldered without self-alignment effect (level 1)
In the flow soldering process there is no self-alignment effect. Thus, the formulae cannot
be simplified but remain the same, as follows:
2 2 2
Zmax = Lmin + 2J max + T
T = + +
T T F P C
T L1 L1 L
2 2 2
Gmin = Smax (rms) – 2J max – T
T = + +
H H F P C
H L1 L1 S
2 2 2
Xmax = Wmin + 2J max + T
T = + +
S S F P C
S L1 L1 W
b) Design consideration when soldered without self-alignment effect (level 2)
2 2 2
mdn + T
Zmax = Lmin + 2J
T = + +
T T F P C
L2 L2 L
T
2 2 2
Gmin = Smax(rms) – 2J mdn – T
T = + +
H H F P C
L2 L2 S
H
2 2 2
Xmax = Wmin + 2J mdn + T
T = + +
S S F P C
L2 L2 W
S
c) Design consideration when soldered with self-alignment effect (level 3)

2 2 2
Zmax = Lmin + 2J min + T
T = + +
T T F P C
T L3 L3 L
2 2 2
Gmin = Smax(rms) – 2J min – T
T = + +
H H F P C
H L3 L3 S
2 2 2
Xmax = Wmin + 2 J min + T
T = + +
S S F P C
S L3 L3 W
In the reflow soldering process, there is a self-alignment effect. In the surface mount process
of reflow soldering, parts mount displacement when soldered can be cancelled by self-
alignment effect (therefore factor P can be regarded as 0). In addition, the tolerance of the
land shape accuracy of PWBs is about ±30 µm, and this is extremely small when compared
with that of the parts dimensions accuracy (therefore factor F can be regarded also as 0).
Thus, the formulae can be simplified as follows:
T = C Zmax = Lmin + 2J min + C = Lmax + 2J min
T L, T L T
T = C Gmin = Smax (rms) – 2J min – C
H S, H S
T = C Xmax = Wmin + 2J min + C = Wmax + 2J min
S W, S W S
In addition, the following value Gmin ≥ A, B is also necessary so that the land should not be
hidden under the QFP. The stand-off of the component mould is nearly zero. The land pattern
design should be made to prevent the lead from floating caused by the solder under the
component.
– 14 – 61188-5-5 © IEC:2007(E)
Any tolerance other than the above may be used depending on the soldering strength
required, the capability of the production process used, and so on.

J J
T S W
J
H Xmax.
Zmax.
IEC  2011/07
Dimensions in millimetres
Solder joint
Tolerance
assumptions
Toe Heel Side
Component
pitch
F P J J J
T H S
L-1/ L-1/
C Max. Mdn Min. C Max. Mdn Min. C Max. Mdn Min.
L S W
L-2/L-3 L-2/L-3
1,00 0,1 0,1 0,5 0,55 0,35 0,2 0,656 0,5 0,35 0,2 0,12 0,05 0 0
0,80 0,1 0,1 0,5 0,55 0,35 0,2 0,656 0,5 0,35 0,2 0,12 0,05 0 0
0,65 0,1 0,1 0,5 0,55 0,35 0,2 0,656 0,5 0,35 0,2 0,14 0,05 0 0
0,50 0,1 0,1 0,5 0,55 0,35 0,2 0,656 0,2 0,2 0,2 0,06 0 0 0
0,40 0,1 0,1 0,5 0,55 0,35 0,2 0,656 0,2 0,2 0,2 0,06 0 0 0
0,30 0,1 0,1 0,5 0,55 0,35 0,2 0,656 0,2 0,2 0,2 0,06 0 0 0
NOTE PQFP with lead pitch of 0,5 mm or less are not suitable for flow soldering.

Figure 3 – Solder joint fillet design
4.5 Land pattern dimensions
Figure 4 shows land pattern dimensions for PQFP (square) for reflow and flow soldering.
These values are calculated based on the formula for the solder joint fillet design of 4.5.
The courtyard is calculated using the following formula and rounded off (round-off factor is to
the nearest 0,05 mm for minimum values and to the nearest 0,5 mm for maximum values).
2 2
CY ={whichever larger [L1min + F + P + C ] or [Z1]} + (courtyard excess × 2)
1 L
2 2
CY ={whichever larger [L2min + F + P + C ] or [Z2]} + (courtyard excess × 2)
2 L
61188-5-5 © IEC:2007(E) – 15 –

CY
P
Y
IEC  2024/07
Dimensions in millimetres
Pattern
CY CY
EIAJ code JEDEC code Z G X Y P
1 2
identifier
Level 1
5000M P-QFP-0036-0505-1,00 P-QFP/036-5x5-1,00 14,6 10,0 0,63 2,3 1,00 16 16
5001M P-QFP-0044-0505-0,80 P-QFP/044-5x5-0,80 14,6 10,0 0,58 2,3 0,80 16 16
5002M P-QFP-0052-0505-0,65 P-QFP/052-5x5-0,65 14,6 10,0 0,52 2,3 0,65 16 16
5003M P-QFP-0048-1212-0,80 P-QFP/048-12x12-0,80 16,6 12,0 0,58 2,3 0,80 18 18
5004M P-QFP-0052-1414-1,00 P-QFP/052-14x14-1,00 18,6 14,0 0,63 2,3 1,00 20 20
5005M P-QFP-0064-1414-0,80 P-QFP/064-14x14-0,80 18,6 14,0 0,58 2,3 0,80 20 20
5006M P-QFP-0080-1414-0,65 P-QFP/080-14x14-0,65 18,6 14,0 0,52 2,3 0,65 20 20
5007M P-QFP-0100-1414-0,50 P-QFP/100-14x14-0,50 17,4 14,0 0,33 1,7 0,50 19 19
5008M P-QFP-0120-1414-0,40 P-QFP/120-14x14-0,40 17,4 14,0 0,29 1,7 0,40 19 19
5010M P-QFP-0076-2020-1,00 P-QFP/076-20x20-1,00 24,6 20,0 0,63 2,3 1,00 26 26
5011M P-QFP-0076-2020-1,00 P-QFP/076-20x20-1,00 24,6 20,0 0,63 2,3 1,00 26 26
5012M P-QFP-0088-2020-0,80 P-QFP/088-20x20-0,80 24,6 20,0 0,58 2,3 0,80 26 26
5013M P-QFP-0088-2020-0,80 P-QFP/088-20x20-0,80 24,6 20,0 0,58 2,3 0,80 26 26
5014M P-QFP-0112-2020-0,65 P-QFP/112-20x20-0,65 24,6 20,0 0,52 2,3 0,65 26 26
5015M P-QFP-0112-2020-0,65 P-QFP/112-20x20-0,65 24,6 20,0 0,52 2,3 0,65 26 26
5016M P-QFP-0144-2020-0,50 P-QFP/144-20x20-0,50 23,4 20,0 0,33 1,7 0,50 25 25
5017M P-QFP-0144-2020-0,50 P-QFP/144-20x20-0,50 23,4 20,0 0,33 1,7 0,50 25 25
5018M P-QFP-0176-2020-0,40 P-QFP/176-20x20-0,40 23,4 20,0 0,29 1,7 0,40 25 25
5019M P-QFP-0176-2020-0,40 P-QFP/176-20x20-0,40 23,4 20,0 0,29 1,7 0,40 25 25
5021M P-QFP-0176-2424-0,50 P-QFP/176-24x24-0,50 28,0 24,4 0,33 1,8 0,50 29 29
5022M P-QFP-0176-2424-0,50 P-QFP/176-24x24-0,50 28,0 24,4 0,33 1,8 0,50 29 29
5023M P-QFP-0216-2424-0,40 P-QFP/216-24x24-0,40 28,0 24,4 0,29 1,8 0,40 29 29
5024M P-QFP-0216-2424-0,40 P-QFP/216-24x24-0,40 28,0 24,4 0,29 1,8 0,40 29 29
5025M P-QFP-0128-2828-0,80 P-QFP/128-28x28-0,80 32,6 28,0 0,58 2,3 0,80 34 34
5026M P-QFP-0128-2828-0,80 P-QFP/128-28x28-0,80 32,6 28,0 0,58 2,3 0,80 34 34
5027M P-QFP-0160-2828-0,65 P-QFP/160-28x28-0,65 32,6 28,0 0,52 2,3 0,65 34 34
5028M P-QFP-0160-2828-0,65 P-QFP/160-28x28-0,65 32,6 28,0 0,52 2,3 0,65 34 34
5029M P-QFP-0208-2828-0,50 P-QFP/208-28x28-0,50 32,0 28,4 0,33 1,8 0,50 33 33
5030M P-QFP-0208-2828-0,50 P-QFP/208-28x28-0,50 32,0 28,4 0,33 1,8 0,50 33 33
5031M P-QFP-0256-2828-0,40 P-QFP/256-28x28-0,40 32,0 28,4 0,29 1,8 0,40 33 33
5032M P-QFP-0256-2828-0,40 P-QFP/256-28x28-0,40 32,0 28,4 0,29 1,8 0,40 33 33
5033M P-QFP-0184-3232-0,65 P-QFP/184-32x32-0,65 36,6 32,0 0,52 2,3 0,65 38 38
5034M P-QFP-0240-3232-0,50 P-QFP/240-32x32-0,50 36,4 33,0 0,33 1,7 0,50 38 38
5035M P-QFP-0296-3232-0,40 P-QFP/296-32x32-0,40 36,4 33,0 0,29 1,7 0,40 38 38
5036M P-QFP-0272-3636-0,50 P-QFP/272-36x36-0,50 40,0 36,4 0,33 1,8 0,50 41 41
5037M P-QFP-0336-3636-0,40 P-QFP/336-36x36-0,40 40,0 36,4 0,29 1,8 0,40 41 41
5038M P-QFP-0232-4040-0,65 P-QFP/232-40x40-0,65 44,6 40,0 0,52 2,3 0,65 46 46
5039M P-QFP-0304-4040-0,50 P-QFP/304-40x40-0,50 44,0 40,4 0,33 1,8 0,50 45 45
5040M P-QFP-0376-4040-0,40 P-QFP/376-40x40-0,40 44,0 40,4 0,29 1,8 0,40 45 45

G
Z
CY
X
– 16 – 61188-5-5 © IEC:2007(E)
Pattern
EIAJ code JEDEC code Z G X Y P CY CY
1 2
identifier
Level 2
5000N P-QFP-0036-0505-1,00 P-QFP/036-5x5-1,00 14,2 10,1 0,53 2,05 1,00 14,7 14,7
5001N P-QFP-0044-0505-0,80 P-QFP/044-5x5-0,80 14,2 10,1 0,48 2,05 0,80 14,7 14,7
5002N P-QFP-0052-0505-0,65 P-QFP/052-5x5-0,65 14,2 10,1 0,42 2,05 0,65 14,7 14,7
5003N P-QFP-0048-1212-0,80 P-QFP/048-12x12-0,80 16,2 12,1 0,48 2,05 0,80 16,7 16,7
5004N P-QFP-0052-1414-1,00 P-QFP/052-14x14-1,00 18,2 14,1 0,53 2,05 1,00 18,7 18,7
5005N P-QFP-0064-1414-0,80 P-QFP/064-14x14-0,80 18,2 14,1 0,48 2,05 0,80 18,7 18,7
5006N P-QFP-0080-1414-0,65 P-QFP/080-14x14-0,65 18,2 14,1 0,42 2,05 0,65 18,7 18,7
5007N P-QFP-0100-1414-0,50 P-QFP/100-14x14-0,50 17,0 14,0 0,33 1,50 0,50 17,5 17,5
5008N P-QFP-0120-1414-0,40 P-QFP/120-14x14-0,40 17,0 14,0 0,29 1,50 0,40 17,5 17,5
5010N P-QFP-0076-2020-1,00 P-QFP/076-20x20-1,00 24,2 20,1 0,53 2,05 1,00 24,7 24,7
5011N P-QFP-0076-2020-1,00 P-QFP/076-20x20-1,00 24,2 20,1 0,53 2,05 1,00 24,7 24,7
5012N P-QFP-0088-2020-0,80 P-QFP/088-20x20-0,80 24,2 20,1 0,48 2,05 0,80 24,7 24,7
5013N P-QFP-0088-2020-0,80 P-QFP/088-20x20-0,80 24,2 20,1 0,48 2,05 0,80 24,7 24,7
5014N P-QFP-0112-2020-0,65 P-QFP/112-20x20-0,65 24,2 20,1 0,42 2,05 0,65 24,7 24,7
5015N P-QFP-0112-2020-0,65 P-QFP/112-20x20-0,65 24,2 20,1 0,42 2,05 0,65 24,7 24,7
5016N P-QFP-0144-2020-0,50 P-QFP/144-20x20-0,50 23,0 20,0 0,33 1,50 0,50 23,5 23,5
5017N P-QFP-0144-2020-0,50 P-QFP/144-20x20-0,50 23,0 20,0 0,33 1,50 0,50 23,5 23,5
5018N P-QFP-0176-2020-0,40 P-QFP/176-20x20-0,40 23,0 20,0 0,29 1,50 0,40 23,5 23,5
5019N P-QFP-0176-2020-0,40 P-QFP/176-20x20-0,40 23,0 20,0 0,29 1,50 0,40 23,5 23,5
5021N P-QFP-0176-2424-0,50 P-QFP/176-24x24-0,50 27,6 24,4 0,33 1,60 0,50 28,1 28,1
5022N P-QFP-0176-2424-0,50 P-QFP/176-24x24-0,50 27,6 24,4 0,33 1,60 0,50 28,1 28,1
5023N P-QFP-0216-2424-0,40 P-QFP/216-24x24-0,40 27,6 24,4 0,29 1,60 0,40 28,1 28,1
5024N P-QFP-0216-2424-0,40 P-QFP/216-24x24-0,40 27,6 24,4 0,29 1,60 0,40 28,1 28,1
5025N P-QFP-0128-2828-0,80 P-QFP/128-28x28-0,80 32,6 28,1 0,48 2,05 0,80 32,7 32,7
5026N P-QFP-0128-2828-0,80 P-QFP/128-28x28-0,80 32,6 28,1 0,48 2,05 0,80 32,7 32,7
5027N P-QFP-0160-2828-0,65 P-QFP/160-28x28-0,65 32,6 28,1 0,42 2,05 0,65 32,7 32,7
5028N P-QFP-0160-2828-0,65 P-QFP/160-28x28-0,65 32,6 28,1 0,42 2,05 0,65 32,7 32,7
5029N P-QFP-0208-2828-0,50 P-QFP/208-28x28-0,50 31,6 28,4 0,33 1,60 0,50 32,1 32,1
5030N P-QFP-0208-2828-0,50 P-QFP/208-28x28-0,50 31,6 28,4 0,33 1,60 0,50 32,1 32,1
5031N P-QFP-0256-2828-0,40 P-QFP/256-28x28-0,40 31,6 28,4 0,29 1,60 0,40 32,1 32,1
5032N P-QFP-0256-2828-0,40 P-QFP/256-28x28-0,40 31,6 28,4 0,29 1,60 0,40 32,1 32,1
5033N P-QFP-0184-3232-0,65 P-QFP/184-32x32-0,65 36,2 32,1 0,42 2,05 0,65 36,7 36,7
5034N P-QFP-0240-3232-0,50 P-QFP/240-32x32-0,50 35,9 33,0 0,33 1,45 0,50 36,4 36,4
5035N P-QFP-0296-3232-0,40 P-QFP/296-32x32-0,40 35,9 33,0 0,29 1,45 0,40 36,4 36,4
5036N P-QFP-0272-3636-0,50 P-QFP/272-36x36-0,50 39,6 36,4 0,33 1,60 0,50 40,1 40,1
5037N P-QFP-0336-3636-0,40 P-QFP/336-36x36-0,40 39,6 36,4 0,29 1,60 0,40 40,1 40,1
5038N P-QFP-0232-4040-0,65 P-QFP/232-40x40-0,65 44,2 40,1 0,42 2,05 0,65 44,7 44,7
5039N P-QFP-0304-4040-0,50 P-QFP/304-40x40-0,50 43,6 40,4 0,33 1,60 0,50 44,1 44,1
5040N P-QFP-0376-4040-0,40 P-QFP/376-40x40-0,40 43,6 40,4 0,29 1,60 0,40 44,1 44,1

61188-5-5 © IEC:2007(E) – 17 –

Pattern
CY CY
EIAJ code JEDEC code Z G X Y P
1 2
identifier
Level 3
5000L P-QFP-0036-0505-1,00 P-QFP/036-5x5-1,00 13,75 10,45 0,50 1,65 1,00 14,0 14,0
5001L P-QFP-0044-0505-0,80 P-QFP/044-5x5-0,80 13,75 10,45 0,40 1,65 0,80 14,0 14,0
5002L P-QFP-0052-0505-0,65 P-QFP/052-5x5-0,65 13,75 10,45 0,35 1,65 0,65 14,0 14,0
5003L P-QFP-0048-1212-0,80 P-QFP/048-12x12-0,80 15,75 12,45 0,40 1,65 0,80 16,0 16,0
5004L P-QFP-0052-1414-1,00 P-QFP/052-14x14-1,00 17,75 14,45 0,50 1,65 1,00 18,0 18,0
5005L P-QFP-0064-1414-0,80 P-QFP/064-14x14-0,80 17,75 14,45 0,40 1,65 0,80 18,0 18,0
5006L P-QFP-0080-1414-0,65 P-QFP/080-14x14-0,65 17,75 14,45 0,35 1,65 0,65 18,0 18,0
5007L P-QFP-0100-1414-0,50 P-QFP/100-14x14-0,50 16,55 13,85 0,25 1,35 0,50 16,8 16,8
5008L P-QFP-0120-1414-0,40 P-QFP/120-14x14-0,40 16,55 13,85 0,20 1,35 0,40 16,8 16,8
5009L P-QFP-0168-1414-0,30 P-QFP/168-14x14-0,30 16,55 13,85 0,15 1,35 0,30 16,8 16,8
5010L P-QFP-0076-2020-1,00 P-QFP/076-20x20-1,00 23,75 20,45 0,50 1,65 1,00 24,0 24,0
5011L P-QFP-0076-2020-1,00 P-QFP/076-20x20-1,00 23,75 20,45 0,50 1,65 1,00 24,0 24,0
5012L P-QFP-0088-2020-0,80 P-QFP/088-20x20-0,80 23,75 20,45 0,40 1,65 0,80 24,0 24,0
5013L P-QFP-0088-2020-0,80 P-QFP/088-20x20-0,80 23,75 20,45 0,40 1,65 0,80 24,0 24,0
5014L P-QFP-0112-2020-0,65 P-QFP/112-20x20-0,65 23,75 20,45 0,35 1,65 0,65 24,0 24,0
5015L P-QFP-0112-2020-0,65 P-QFP/112-20x20-0,65 23,75 20,45 0,35 1,65 0,65 24,0 24,0
5016L P-QFP-0144-2020-0,50 P-QFP/144-20x20-0,50 22,55 19,85 0,25 1,35 0,50 22,8 22,8
5017L P-QFP-0144-2020-0,50 P-QFP/144-20x20-0,50 22,55 19,85 0,25 1,35 0,50 22,8 22,8
5018L P-QFP-0176-2020-0,40 P-QFP/176-20x20-0,40 22,55 19,85 0,20 1,35 0,40 22,8 22,8
5019L P-QFP-0176-2020-0,40 P-QFP/176-20x20-0,40 22,55 19,85 0,20 1,35 0,40 22,8 22,8
5020L P-QFP-0240-2020-0,30 P-QFP/240-20x20-0,30 22,55 19,85 0,15 1,35 0,30 22,8 22,8
5021L P-QFP-0176-2424-0,50 P-QFP/176-24x24-0,50 27,15 24,45 0,25 1,35 0,50 27,4 27,4
5022L P-QFP-0176-2424-0,50 P-QFP/176-24x24-0,50 27,15 24,45 0,25 1,35 0,50 27,4 27,4
5023L P-QFP-0216-2424-0,40 P-QFP/216-24x24-0,40 27,15 24,45 0,20 1,35 0,40 27,4 27,4
5024L P-QFP-0216-2424-0,40 P-QFP/216-24x24-0,40 27,15 24,45 0,20 1,35 0,40 27,4 27,4
5025L P-QFP-0128-2828-0,80 P-QFP/128-28x28-0,80 31,75 28,45 0,40 1,65 0,80 32,0 32,0
5026L P-QFP-0128-2828-0,80 P-QFP/128-28x28-0,80 31,75 28,45 0,40 1,65 0,80 32,0 32,0
5027L P-QFP-0160-2828-0,65 P-QFP/160-28x28-0,65 31,75 28,45 0,35 1,65 0,65 32,0 32,0
5028L P-QFP-0160-2828-0,65 P-QFP/160-28x28-0,65 31,75 28,45 0,35 1,65 0,65 32,0 32,0
5029L P-QFP-0208-2828-0,50 P-QFP/208-28x28-0,50 31,15 28,45 0,25 1,35 0,50 31,4 31,4
5030L P-QFP-0208-2828-0,50 P-QFP/208-28x28-0,50 31,15 28,45 0,25 1,35 0,50 31,4 31,4
5031L P-QFP-0256-2828-0,40 P-QFP/256-28x28-0,40 31,15 28,45 0,20 1,35 0,40 31,4 31,4
5032L P-QFP-0256-2828-0,40 P-QFP/256-28x28-0,40 31,15 28,45 0,20 1,35 0,40 31,4 31,4
5033L P-QFP-0184-3232-0,65 P-QFP/184-32x32-0,65 35,75 32,40 0,35 1,65 0,65 36,0 36,0
5034L P-QFP-0240-3232-0,50 P-QFP/240-32x32-0,50 35,15 33,00 0,25 1,05 0,50 35,4 35,4
5035L P-QFP-0296-3232-0,40 P-QFP/296-32x32-0,40 35,15 33,00 0,20 1,05 0,40 35,4 35,4
5036L P-QFP-0272-3636-0,50 P-QFP/272-36x36-0,50 39,15 36,40 0,25 1,35 0,50 39,4 39,4
5037L P-QFP-0336-3636-0,40 P-QFP/336-36x36-0,40 39,15 36,40 0,20 1,35 0,40 39,4 39,4
5038L P-QFP-0232-4040-0,65 P-QFP/232-40x40-0,65 43,75 40,40 0,35 1,65 0,65 44,0 44,0
5039L P-QFP-0304-4040-0,50 P-QFP/304-40x40-0,50 43,15 40,40 0,25 1,35 0,50 43,4 43,4
5040L P-QFP-0376-4040-0,40 P-QFP/376-40x40-0,40 43,15 40,40 0,20 1,35 0,40 43,4 43,4
* When the X dimension is used, it is necessary to confirm whether the space between adjacent land patterns is
proper.
Figure 4 – PQFP (square) land pattern dimensions
5 PQFP (rectangular)
5.1 Field of application
This clause provides the component and land pattern dimensions for rectangular PQFP
(plastic quad flat pack) components. Basic construction of the PQFP device is also covered.

– 18 – 61188-5-5 © IEC:2007(E)
At the end of this clause is a listing of the tolerances and target solder joint dimensions used
to arrive at the land pattern dimensions.
5.2 Component descriptions
PQFPs are widely used in a variety of applications for commercial, industrial or military
electronics.
5.2.1 Basic construction
The quad flat pack has been developed for applications requiring low height and high density.
The PQFPs, along with the LSOP components, are frequently used in memory card
applications (see Figure 5).
5.2.1.1 Termination materials
Leads shall be solder-coated with a tin/lead alloy. The solder should contain between 58 % to
68 % tin. Solder may be applied to the leads by hot dipping or by plating from solution. Plated
solder terminations should be subjected to post plating reflow operation to fuse the solder.
The tin/lead finish should be at least 0,007 5 mm thick.
For applications involving the removal of lead there are a number of lead free or lead free
compatible finishes. Solderability testi
...