EN 16602-70-08:2015
(Main)Space product assurance - Manual soldering of high-reliability electrical connections
Space product assurance - Manual soldering of high-reliability electrical connections
This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of manually-soldered, high-reliability electrical connections. The Standard defines acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight. The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work. The assembly of surface-mount devices is covered in ECSS-Q-ST-70-38. Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-10 and ECSS-Q-ST-70-11. Verification of manual soldering assemblies which are not described in this standard are performed by vibration and thermal cycling testing. The requirements for verification are given in this Standard. This standard does not cover the qualification and acceptance of EQM and FM equipment with hand soldered connections. The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST-10-03. The mounting and supporting of components, terminals and conductors prescribed herein applies to assemblies designed to operate within the temperature limits of -55 °C to +85 °C. For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability. Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 °C, power transistors) in order to ensure that solder joints do not exceed 85 °C. This standard may be tailored for the specific characteristic and constrains of a space project in conformance with ECSS-S-ST-00.
Raumfahrtproduktsicherung - Manuelles Löten von hoch-zuverlässigen elektrischen Verbindungen
Assurance produit des projets spatiaux - Soudage manuel des connexions électriques à fiabilité élevée
La présente norme définit les exigences techniques et les dispositions d'assurance qualité pour la fabrication et la vérification de connexions électriques de haute fiabilité brasées manuellement.
La norme définit les critères d'acceptabilité et de rejet pour la fabrication de haute fiabilité des connexions électriques brasées manuellement prévues pour résister à des conditions terrestres normales, et aux facteurs de charges vibratoires et à l’environnement imposés par le vol dans l’espace.
Le présent document décrit les outils et matériaux à utiliser, ainsi que les modes de conception et d'exécution à respecter. Il indique des normes d'exécution permettant de déterminer si un travail est correctement réalisé ou non.
L'assemblage des composants montés en surface est couvert par l'ECSS Q ST 70-38.
Les exigences relatives aux circuits imprimés figurent dans l'ECSS-Q-ST-70-10 et l'ECSS-Q-ST-70-11.
La vérification des ensembles brasés manuellement qui ne sont pas décrits dans la présente norme, est réalisée au moyen d'essais vibratoires et de cyclage thermique. Les exigences de vérification sont fournies dans la présente norme.
La présente norme ne couvre pas la qualification et l'acceptation des équipements MQI et FM dotés de connexions brasées manuellement.
Les essais de qualification et d'acceptation des équipements fabriqués conformément à la présente norme sont couverts par l'ECSS-E-ST-10-03.
Le montage et le support de composants, bornes et conducteurs prescrits dans les présentes s'appliquent aux ensembles conçus pour fonctionner dans les limites de température de 55 C à +85 C.
Pour les températures extérieures à cette plage normale, des essais de conception, de vérification et de qualification spéciaux sont réalisés pour assurer les capacités de résistance à l'environnement nécessaire.
Des dissipateurs thermiques spéciaux sont appliqués sur les appareils présentant une dissipation thermique élevée (par exemple, températures de jonction de 110 C, transistors de puissance) afin d'assurer que les joints de soudure ne dépassent pas 85 C.
La présente norme peut être adaptée aux caractéristiques et contraintes spécifiques d'un projet spatial, conformément à l'ECSS-S-ST-00.
Zagotavljanje varnih proizvodov v vesoljski tehniki - Ročno spajkanje visoko zanesljivih električnih spojev
Ta standard določa tehnične zahteve in določbe za zagotavljanje kakovosti za proizvodnjo in preverjanje ročno spajkanih visoko zanesljivih električnih spojev. Standard določa merila za sprejem ali zavrnitev za visoko zanesljivo proizvodnjo ročno spajkanih električnih spojev, ki naj bi prenesli običajne zemeljske pogoje in vibracijske obremenitve zaradi pospeška ter okolje, ki jih povzročijo vesoljski poleti. V tem dokumentu so obravnavani ustrezna orodja, pravilni materiali, zasnova in izvedba. Izvedbeni standardi so vključeni, da se omogoči ločevanje med primernim in neprimernim delom. Sestavljanje površinsko nameščenih naprav obravnava standard ECSS-Q-ST-70-38. Zahteve v zvezi s ploščami tiskanih vezij so podane v standardih ECSS-Q-ST-70-10 in ECSS-Q-ST-70-11. Preverjanje ročno spajkanih sestavov, ki niso opisani v tem standardu, se izvaja z vibracijskim in toplotnim cikličnim preskušanjem. Zahteve glede preverjanja so navedene v tem standardu. Ta standard ne obravnava kvalifikacije in sprejemljivosti opreme EQM in FM z ročno spajkanimi spoji. Kvalifikacijski in sprejemljivostni preskusi opreme, izdelane v skladu s tem standardom, so obravnavani v standardu ECSS-E-ST-10-03. Nameščanje in podpiranje komponent, terminalov in prevodnikov iz tega standarda se uporabljata za sestave, namenjene delovanju v okviru temperaturnega razpona –55 °C to +85 °C. Pri temperaturah zunaj tega običajnega razpona se izvede posebno preskušanje zasnove, preverjanja in kvalifikacij, da se zagotovi potrebna okoljska zmožnost preživetja. Posebni toplotni ponori se uporabljajo za naprave z visokim toplotnim odvajanjem (npr. temperature stika 110 °C, močnostni tranzistor), da se zagotovi, da spojeni spoji ne presegajo 85 °C. Ta standard se lahko prilagodi posebnim značilnostim in omejitvam vesoljskega projekta v skladu s standardom ECSS-S-ST-00.
General Information
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Standards Content (Sample)
SLOVENSKI STANDARD
01-april-2015
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Space product assurance - Manual soldering of high-reliability electrical connections
Raumfahrtproduktsicherung - Manuelles Löten von hoch-zuverlässigen elektrischen
Verbindungen
Assurance produit des projets spatiaux - Soudage manuel des connexions électriques à
fiabilité élevée
Ta slovenski standard je istoveten z: EN 16602-70-08:2015
ICS:
25.160.50 Trdo in mehko lotanje Brazing and soldering
49.140 Vesoljski sistemi in operacije Space systems and
operations
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD
EN 16602-70-08
NORME EUROPÉENNE
EUROPÄISCHE NORM
January 2015
ICS 25.160.50; 49.140
English version
Space product assurance - Manual soldering of high-reliability
electrical connections
Assurance produit des projets spatiaux - Soudage manuel Raumfahrtproduktsicherung - Manuelles Löten von hoch-
des connexions électriques à fiabilité élevée zuverlässigen elektrischen Verbindungen
This European Standard was approved by CEN on 18 October 2014.
CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving
this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning
such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC
member.
This European Standard exists in three official versions (English, French, German). A version in any other language made by translation
under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre
has the same status as the official versions.
CEN and CENELEC members are the national standards bodies and national electrotechnical committees of Austria, Belgium, Bulgaria,
Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece,
Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia,
Slovenia, Spain, Sweden, Switzerland, Turkey and United Kingdom.
CEN-CENELEC Management Centre:
Avenue Marnix 17, B-1000 Brussels
© 2015 CEN/CENELEC All rights of exploitation in any form and by any means reserved Ref. No. EN 16602-70-08:2015 E
worldwide for CEN national Members and for CENELEC
Members.
Table of contents
Foreword . 9
Introduction . 10
1 Scope . 11
2 Normative references . 12
3 Terms, definitions and abbreviated terms . 13
3.1 Terms from other standards . 13
3.2 Terms specific to the present standard . 13
3.3 Abbreviated terms. 20
4 Principles of reliable soldered connections . 22
5 Preparatory conditions . 23
5.1 Calibration . 23
5.2 Facility cleanliness . 23
5.3 Environmental conditions . 23
5.4 Lighting requirements . 24
5.5 Precautions against static discharges . 24
5.5.1 General . 24
5.5.2 Precautions against ESD during manufacturing . 24
5.5.3 Protective Packaging and ESD Protection . 25
5.5.4 Packing and filler materials . 26
5.6 Equipment and tools . 26
5.6.1 General . 26
5.6.2 Brushes . 26
5.6.3 Cutters and pliers . 26
5.6.4 Bending tools . 27
5.6.5 Clinching tools . 27
5.6.6 Insulation strippers . 28
5.6.7 Soldering irons and resistance soldering equipment . 29
5.6.8 Soldering tools . 30
6 Materials selection . 31
6.1 General . 31
6.2 Solder . 31
6.2.1 Form . 31
6.2.2 Composition . 31
6.3 Flux . 32
6.3.1 Rosin-based fluxes. 32
6.3.2 INH1 corrosive acid flux . 33
6.3.3 Application of flux . 33
6.4 Solvents . 34
6.5 Flexible insulation materials . 34
6.6 Terminals . 35
6.6.1 Materials . 35
6.6.2 Tin-, silver- and gold-plated terminals. 35
6.6.3 Shape of terminals . 35
6.7 Wires . 35
6.8 PCBs . 36
6.8.1 Boards . 36
6.8.2 Gold finish on conductors . 36
6.9 Component lead finishes . 36
6.10 Adhesives (staking compounds and heat sinking), encapsulants and
conformal coatings . 36
7 Preparation for soldering . 38
7.1 General . 38
7.1.1 Tools . 38
7.1.2 Components. 38
7.2 Preparation of conductors, terminals and solder cups . 38
7.2.1 Insulation removal . 38
7.2.2 Surfaces to be soldered . 39
7.2.3 De-golding of gold-plated leads and terminals . 40
7.2.4 Constraints on degolding and pretinning methods . 41
7.2.5 Pretinning of stranded wires . 42
7.2.6 Pre-tinning of component leads and solid-wire conductors . 42
7.3 Preparation of the soldering bit . 43
7.3.1 Fit . 43
7.3.2 Maintenance . 43
7.3.3 Plated bits . 43
7.3.4 Tip in operation . 43
7.4 Maintenance of resistance-type soldering electrodes . 44
7.5 Handling (work station) . 44
7.6 Storage (work station) . 44
7.6.1 Components. 44
7.6.2 PCBs. 44
7.6.3 Materials requiring segregation . 44
7.7 Preparation of PCBs for soldering . 45
7.7.1 Process . 45
7.7.2 Demoisturization methods . 45
7.7.3 Storage of prepared PCBs . 45
8 Mounting of components . 46
8.1 General requirements . 46
8.1.1 Introduction . 46
8.1.2 Heavy components . 46
8.1.3 Metal-case components . 46
8.1.4 Glass-encased components . 47
8.1.5 Stress relief of components with bendable leads . 47
8.1.6 Stress relief of components with non-bendable leads . 48
8.1.7 Reinforced plated-through holes . 50
8.1.8 Lead and conductor cutting . 50
8.1.9 Solid hook-up wire. 50
8.1.10 Location . 50
8.1.11 Conformal coating, cementing and encapsulation . 50
8.2 Lead bending requirements . 51
8.2.1 General . 51
8.2.2 Conductors terminating on both sides of a non-plated-through hole . 51
8.3 Mounting of terminals to PCBs. 52
8.4 Lead attachment to PCBs . 53
8.4.1 General . 53
8.4.2 Clinched leads . 53
8.4.3 Stud leads . 55
8.4.4 Lapped round leads . 56
8.4.5 Lapped ribbon leads . 56
8.5 Mounting of components to terminals . 56
8.6 Mounting of connectors to PCBs . 58
9 Attachment of conductors to terminals, solder cups and cables . 59
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