IEC/SC 47A - IEC_SC_47A

IEC 61967-8:2023 is available as IEC 61967-8:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61967-8:2023 defines a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline. The IC being evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement. This edition includes the following significant technical changes with respect to the previous edition: a) frequency range of 150 kHz to 3 GHz was deleted from the scope; b) extension of upper usable frequency to 6 GHz or higher as long as the defined requirements are fulfilled.

This document specifies test and measurement methods for EMC evaluation of Peripheral Sensor Interface 5 (PSI5) transceiver integrated circuits (ICs) under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for PSI5 satellite ICs (e.g. sensors) and ICs with embedded PSI5 transceivers (e.g. PSI5 Electronic control unit IC). The document covers - the emission of RF disturbances, - the immunity against RF disturbances, - the immunity against impulses and - the immunity against electrostatic discharges (ESD).

This part of IEC 62228 specifies test and measurement methods for the EMC evaluation of CXPI transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. This specification is applicable for standard CXPI transceiver ICs and ICs with embedded CXPI transceiver and covers - the emission of RF disturbances, - the immunity against RF disturbances, - the immunity against impulses and - the immunity against electrostatic discharges (ESD).

This part of IEC 62228 specifies test and measurement methods for EMC evaluation of CAN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for CAN standard transceivers, CAN transceivers with partial networking functionality and CAN transceivers with flexible data rate capability and covers - the emission of RF disturbances, - the immunity against RF disturbances, - the immunity against impulses, and - the immunity against electrostatic discharges (ESD).

IEC 62433-1:2019(E) specifies the framework and methodology for EMC IC macro-modelling. Terms that are commonly used in IEC 62433 (all parts), different modelling approaches, requirements and data-exchange format for each model category that is standardized in this series are defined in this document. IEC 62433-1 cancels and replaces IEC TS 62433-1 published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to IEC TS 62433 1:2011: Incorporation of a data exchange format for an integrated circuit’s model representation.

This part of IEC 61967 provides general information and definitions on the measurement of conducted and radiated electromagnetic disturbances from integrated circuits. It also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. Test method comparison tables are included in Annex A to assist in selecting the appropriate measurement method(s). The object of this document is to describe general conditions in order to establish a uniform testing environment and to obtain a quantitative measure of RF disturbances from integrated circuits (IC). Critical parameters that are expected to influence the test results are described. Deviations from this document are noted explicitly in the individual test report. The measurement results can be used for comparison or other purposes. Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under controlled conditions, yields information about the potential for RF disturbances in an application of the integrated circuit. The applicable frequency range is described in each part of IEC 61967.

IEC 62228-5:2021(E) specifies test and measurement methods for EMC evaluation of Ethernet transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for transceiver of the Ethernet systems  
100BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD1;
100BASE-TX according to ISO/IEC/IEEE 8802-3;
1000BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD4  and covers  
the emission of RF disturbances;
the immunity against RF disturbances;
the immunity against impulses;
the immunity against electrostatic discharges (ESD).

IEC 62228-1:2018(E) provides general information and definitions for electromagnetic compatibility (EMC) evaluation of integrated circuits (IC) with transceivers for wired network applications under network condition. It defines general test conditions, general test setups and test and measurement methods are applied to all parts of IEC 62228.

IEC 61967-4:2021 is available as IEC 61967-4:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61967-4:2021 specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods ensure a high degree of reproducibility and correlation of EME measurement results. This edition includes the following significant technical changes with respect to the previous edition: - frequency range of 150 kHz to 1 GHz has been deleted from the title; - recommended frequency range for 1 Ω method has been reduced to 30 MHz; - Annex G with recommendations and guidelines for frequency range extension beyond 1 GHz has been added.

IEC 62433-6:2020 describes the extraction flow for deriving an immunity macro-model of an Integrated Circuit (IC) against conducted Electrostatic Discharge (ESD) according to IEC 61000-4-2 and Electrical Fast Transients (EFT) according to IEC 61000-4-4. The model addresses physical damages due to overvoltage, thermal damage and other failure modes. Functional failures can also be addressed. This model allows the immunity simulation of the IC in an application. This model is commonly called "Integrated Circuit Immunity Model Conducted Pulse Immunity", ICIM-CPI. This document provides: - the description of ICIM-CPI macro-model elements representing electrical, thermal or logical behaviour of the IC. - a universal data exchange format based on XML.

IEC 62433-3:2017 provides a method for deriving a macro-model to allow the simulation of the radiated emission levels of an Integrated Circuit (IC). This model is commonly called Integrated Circuit Emission Model - Radiated Emission, ICEM-RE. The model is intended to be used for modelling a complete IC, with or without its associated package, a functional block and an Intellectual Property (IP) block of both analogue and digital ICs (input/output pins, digital core and supply), when measured or simulated data cannot be directly imported into simulation tools.

IEC 62433-2:2008(E) specifies macro-models for ICs to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE model can also be used for modelling an IC-die, a functional block and an Intellectual Property block (IP). The ICEM-CE model can be used to model both digital and analogue ICs. Basically, conducted emissions have two origins: - conducted emmissions through power supply terminals and ground reference structure; - conducted emmisions through input/output (I/O) terminals. The ICEM-CE model addresses those two types of origins in a single approach. This standard defines structures and components of the macro-model for EMI simulation taking into account the IC's internal activities. This standard gives general data, which can be implemented in different formats or languages such as IBIS, IMIC, SPICE, VHDL-AMS and Verilog. SPICE is however chosen as default simulation environment to cover all the conducted emissions. This standard also specifies requirements for information that shall be incorporated in each ICEM-CE model or component part of the model for model circulation, but description syntax is not within the scope of this standard.

IEC 62433-4:2016 specifies a flow for deriving a macro-model to allow the simulation of the conducted immunity levels of an integrated circuit (IC). This model is commonly called Integrated Circuit Immunity Model - Conducted Immunity, ICIM-CI. It is intended to be used for predicting the levels of immunity to conducted RF disturbances applied on IC pins. In order to evaluate the immunity threshold of an electronic device, this macro-model will be inserted in an electrical circuit simulation tool. This macro-model can be used to model both analogue and digital ICs (input/output, digital core and supply). This macro-model does not take into account the non-linear effects of the IC. The added value of ICIM-CI is that it could also be used for immunity prediction at board and system level through simulations. This part of IEC 62433 has two main parts: - the electrical description of ICIM-CI macro-model elements; - a universal data exchange format called CIML based on XML. This format allows ICIM-CI to be encoded in a more useable and generic form for immunity simulation.

IEC 62228-2:2016 specifies test and measurement methods for EMC evaluation of LIN transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for standard LIN transceiver ICs and ICs with embedded LIN transceiver and covers: - the emission of RF disturbances, - the immunity against RF disturbances, - the immunity against impulses and - the immunity against electrostatic discharges (ESD).

IEC 62132-1:2015 provides general information and definitions about measurement of electromagnetic immunity of integrated circuits (ICs) to conducted and radiated disturbances. It also defines general test conditions, test equipment and setup, as well as the test procedures and content of the test reports for all parts of the IEC 62132 series. Test method comparison tables are included in Annex A to assist in selecting the appropriate measurement method(s). This edition includes the following significant technical changes with respect to the previous edition: a) frequency range of 150 kHz to 1 GHz has been deleted from the title; b) frequency step above 1 GHz has been added in Table 2 in 7.4.1; c) IC performance classes in 8.3 have been modified; d) Table A.1 was divided into two tables, and references to IEC 62132-8 and IEC 62132-9 have been added in the new Table A.2 in Annex A.

IEC 62215-3:2013 specifies a method for measuring the immunity of an integrated circuit (IC) to standardized conducted electrical transient disturbances. The disturbances, not necessarily synchronized to the operation of the device under test (DUT), are applied to the IC pins via coupling networks. This method enables understanding and classification of interaction between conducted transient disturbances and performance degradation induced in ICs regardless of transients within or beyond the specified operating voltage range.

IEC 62132-8:2012 specifies a method for measuring the immunity of an integrated circuit (IC) to radio frequency (RF) radiated electromagnetic disturbances over the frequency range of 150 kHz to 3 GHz.

IEC 61967-8:2011 defines a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline in the frequency range of 150 kHz up to 3 GHz. The IC being evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement. This publication is to be read in conjunction with  IEC 61967-1:2002.

IEC 62132-2:2010 specifies a method for measuring the immunity of an integrated circuit (IC) to radio frequency (RF) radiated electromagnetic disturbances. The frequency range of this method is from 150 kHz to 1 GHz, or as limited by the characteristics of the TEM cell.

Describes a method to measure the immunity of integrated circuits (IC) in the presence of conducted RF disturbances, e.g. resulting from radiated RF disturbances. This method guarantees a high degree of repeatability and correlation of immunity measurements. This standard establishes a common base for the evaluation of semiconductor devices used in equipment functioning in an environment subject to unwanted radio frequency electromagnetic waves.

This measurement procedure describes a measurement method to quantify the RF immunity of integrated circuits (ICs) mounted on a standardized test board or on their final application board (PCB), to electromagnetic conductive disturbances.

This test procedure defines a method for measuring the electromagnetic radiation from an integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a transverse electromagnetic (TEM) or wideband gigahertz TEM (GTEM) cell. The test board is not inside the cell, as in the conventional usage, but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured radio frequency (RF) voltage will be affected by many factors. The primary factor affecting the measured RF voltage is the septum to IC test board (cell wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to floor spacing of 45 mm and a GTEM cell with average septum to floor spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations. A conversion factor may allow comparisons between data measured on TEM or GTEM cells with different septum to floor spacing. The IC test board controls the geometry and orientation of the operating IC relative to the cell and eliminates any connecting leads within the cell (these are on the backside of the board, which is outside the cell). For the TEM cell, one of the 50 ports is terminated with a 50 load. The other 50 port for a TEM cell, or the single 50 port for a GTEM cell, is connected to the input of a spectrum analyser or receiver that measures the RF emissions emanating from the integrated circuit and impressed onto the septum of the cell.

Describes a method to measure the conducted electromagnetic emission of integrated circuits either applied on a standardised test-board or on a final printed circuit board (PCB). Has a high repeatability and a good relationship to the measured RF emission of final applications with the integrated circuits used.

Specifies a method for evaluating RF currents on the pins of an integrated circuit (IC) by means of non-contact current measurement using a miniature magnetic probe. This method is capable of measuring the RF currents generated by the IC over a frequency range of 0,15 MHz to 1 000 MHz.

Defines how to apply the principles and requirements given in IEC 61739 to monolithic integrated circuits. The standard is applicable to those manufacturers of integrated circuits (ICs) who apply for manufacturing line approval. The objective is to establish consistency in the requirements used by manufacturers and auditors for techniques related to integrated circuit manufacturing. Each manufacturer may use his own methods for satisfying the requirements of this standard, provided that the required level of control in the manufacturing line is reached.

Applies to pinout package configurations of solid state integrated circuit memory devices. The purpose of this standard is to establish a registration procedure for such configurations.

IEC 62433-2:2008(E) specifies macro-models for ICs to simulate conducted electromagnetic emissions on a printed circuit board. The model is commonly called Integrated Circuit Emission Model - Conducted Emission (ICEM-CE). The ICEM-CE model can also be used for modelling an IC-die, a functional block and an Intellectual Property block (IP). The ICEM-CE model can be used to model both digital and analogue ICs. Basically, conducted emissions have two origins: - conducted emmissions through power supply terminals and ground reference structure; - conducted emmisions through input/output (I/O) terminals. The ICEM-CE model addresses those two types of origins in a single approach. This standard defines structures and components of the macro-model for EMI simulation taking into account the IC's internal activities. This standard gives general data, which can be implemented in different formats or languages such as IBIS, IMIC, SPICE, VHDL-AMS and Verilog. SPICE is however chosen as default simulation environment to cover all the conducted emissions. This standard also specifies requirements for information that shall be incorporated in each ICEM-CE model or component part of the model for model circulation, but description syntax is not within the scope of this standard.

Corrigendum to EN issued December 2006

This part of IEC 62132 provides general information and definitions on measurement of conducted and radiated electromagnetic immunity of integrated circuits (ICs) to conducted and radiated disturbances. It also provides a description of measurement conditions, test equipment and set-up, as well as the test procedures and content of the test reports. A test method comparison table is included in Annex A to assist in selecting the appropriate measurement method(s). This standard describes general conditions required to obtain a quantitative measure of immunity of ICs in a uniform testing environment. Critical parameters that are expected to influence the test results are described. Deviations from this standard are noted explicitly in the individual test report. The measurement results can be used for comparison or other purposes. Measurement of the injected voltages and currents, together with the responses of the ICs tested at controlled conditions, yields information about the potential immunity of the IC to conducted and radiated RF disturbances in a given application.

This part of IEC 62132 describes a bulk current injection (BCI) test method to measure the immunity of integrated circuits (IC) in the presence of conducted RF disturbances, e.g. resulting from radiated RF disturbances. This method only applies to ICs that have off-board wire connections e.g. into a cable harness. This test method is used to inject RF current on one or a combination of wires. This standard establishes a common base for the evaluation of semiconductor devices to be applied in equipment used in environments that are subject to unwanted radio frequency electromagnetic signals.

D124/C047: Withdrawn

Text prepared by STACK * D96/134: CLC/TC CECC disbanded * D124/C047: Withdrawn

Specifies a method to measure the conducted electromagnetic emission of integrated circuits by direct RF current measurement with a 1 ohm resistive probe and RF voltage measurement using a 150 ohm coupling network. These methods guarantee a high degree of repeatability and correlation of measurements.

Provides general information and definitions on measurement of conducted and radiated electromagnetic disturbances from integrated circuits. Also provides a description of measurement conditions, test equipment and set-up as well as the test procedures and content of the test reports. A test method comparison table is included to assist in selecting the appropriate measurement method(s). Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under controlled conditions, yields information about the potential for RF disturbances in an application of the integrated circuit.

This specification specifies the terms, definitions, symbols, test methods and other material for monolithic integrated (micro)circuits (*), as defined in IEC 747, necessary to prepare appropriate detail sepcifications (DS) in the CECC System. Supplementary requirements for different families of integrated microcircuits are included in separate specifications. (*) In the following term "integrated circuits" is used.

This document relates to AC MOS Digital Integrated Circuits.

This document relates to digital monolithic integrated circuits.

EN 165000 series supersedes EN 163000, CECC 63 000 & 64 000 series * D96/132: CECC/SC 47AX disbanded
2021: CLC legacy converted by DCLab NISOSTS

This checklist is intended for the use of a hybrid microcircuit manufacturer's internal assessment team. It will provide the hybrid manufacturer and the ONS with ongoing information on process control demonstrating compliance with EN 165000-1. It is not intended to include Quality System requirements.

EN 165000 series supersedes EN 163000, CECC 63 000 & 64 000 series * D96/132: CECC/SC 47AX disbanded
2021: CLC legacy converted by DCLab NISOSTS

La présente spécification spécifie les procédures d'assurance de la qualité et les méthodes d'essai correspondantes à utiliser pour l'évaluation des circuits intégrés à couches et hybrides utilisés dans les équipements électroniques, en vertu de la procédure d'agrément de savoir-faire. Elle s'applique également aux dispositifs partiellement achevés fournis aux clients pour traitement ultérieur. Il convient de lire la présente norme conjointement avec l'EN 165000-2, l'EN 165000 -3 et l'EN 165000-4.

This document relates to TTL-Schottky digital integrated circuits - Series 54S, 64S, 74S and 84S.

This document contains general information on TTL Advanced Low Power Shottky digital integrated circuits and defines the common characteristics for this family of integrated circuits.

Supersedes CECC 90 107:1987 (with A1) * CECC WG 9 work handled by SR 47A

Supersedes CECC 90 109:1989 (with A1) * CECC WG 9 work handled by SR 47A

Supersedes CECC 90 108:1987 (with A1) * CECC WG 9 work handled by SR 47A

This document contains general information on TTL Standard digitam integrated circuits and defines the common characteristics for this family of integrated circuits.

Supersedes CECC 90 103:1988 (with A1 and A2) * CECC WG 9 work handled by SR 47A