EN 61967-2:2005
(Main)Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
This test procedure defines a method for measuring the electromagnetic radiation from an integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a transverse electromagnetic (TEM) or wideband gigahertz TEM (GTEM) cell. The test board is not inside the cell, as in the conventional usage, but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured radio frequency (RF) voltage will be affected by many factors. The primary factor affecting the measured RF voltage is the septum to IC test board (cell wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to floor spacing of 45 mm and a GTEM cell with average septum to floor spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations. A conversion factor may allow comparisons between data measured on TEM or GTEM cells with different septum to floor spacing. The IC test board controls the geometry and orientation of the operating IC relative to the cell and eliminates any connecting leads within the cell (these are on the backside of the board, which is outside the cell). For the TEM cell, one of the 50 ports is terminated with a 50 load. The other 50 port for a TEM cell, or the single 50 port for a GTEM cell, is connected to the input of a spectrum analyser or receiver that measures the RF emissions emanating from the integrated circuit and impressed onto the septum of the cell.
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen im Frequenzbereich von 150 kHz bis 1 GHz - Teil 2: Messung der abgestrahlten Aussendungen - TEM-Zellen- und Breitband-TEM-Zellenverfahren
Circuits intégrés - Mesure des émissions électromagnétiques, 150 kHz à 1 GHz - Partie 2: Mesure des émissions rayonnées - Méthode de cellule TEM et cellule TEM à large bande
La présente procédure de mesure définit une méthode de mesure du rayonnement électromagnétique provenant d'un circuit intégré (CI). Le CI évalué est monté sur une carte de circuit imprimé (PCB) d'essai de CI qui est fixée sur un accès d'accouplement (désigné comme accès à la paroi) découpé au sommet ou au fond d'une cellule électromagnétique transverse (TEM, transverse electromagnetic) ou d'une cellule TEM en gigahertz (GTEM) à large bande. La carte d'essai n'est pas à l'intérieur de la cellule, comme dans l'usage conventionnel, mais devient une partie de la paroi de la cellule. Cette méthode est applicable à toute cellule TEM ou GTEM modifiée pour incorporer l'accès à la paroi; cependant, la tension RF mesurée sera affectée par de nombreux facteurs. Le facteur principal affectant la tension RF mesurée est l'espacement entre le diaphragme et la carte d'essai du CI (paroi de la cellule). Cette procédure a été élaborée à l'aide d'une cellule TEM de 1 GHz avec un espacement entre le diaphragme et le sol de 45 mm et d'une cellule GTEM avec un espacement moyen entre le diaphragme et le sol de 45 mm au-dessus de la zone de l'accès. D'autres cellules peuvent ne pas produire de sortie spectrale identique, mais peuvent être utilisées pour des mesures comparatives, soumises à leurs limites en fréquence et en sensibilité. Un facteur de conversion peut permettre des comparaisons entre les données mesurées sur les cellules TEM ou GTEM avec un espacement différent entre le diaphragme et le sol. La carte d'essai du CI contrôle la géométrie et l'orientation du CI en fonctionnement par rapport à la cellule et élimine tous les conducteurs de connexion à l'intérieur de la cellule (ceux-ci se situent sur la face arrière de la carte, qui est à l'extérieur de la cellule). Pour la cellule TEM, l'un des accès de 50 est terminé par une charge de 50 . L'autre accès de 50 pour une cellule TEM, ou le seul accès de 50 pour une cellule GTEM, est connecté à l'entrée d'un analyseur de sp
Integrirana vezja – Meritve elektromagnetnega oddajanja v območju od 150 kHz do 1 GHz – 2. del: Meritve sevanih oddajanj – Metoda s celico TEM in s širokopasovno celico TEM (IEC 61967-2:2005)
General Information
Standards Content (Sample)
SLOVENSKI STANDARD
01-februar-2006
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Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz --
Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen im
Frequenzbereich von 150 kHz bis 1 GHz -- Teil 2: Messung der abgestrahlten
Aussendungen - TEM-Zellen- und Breitband-TEM-Zellenverfahren
Circuits intégrés - Mesure des émissions électromagnétiques, 150 kHz à 1 GHz -- Partie
2: Mesure des émissions rayonnées - Méthode de cellule TEM et cellule TEM à large
bande
Ta slovenski standard je istoveten z: EN 61967-2:2005
ICS:
31.200 Integrirana vezja, Integrated circuits.
mikroelektronika Microelectronics
2003-01.Slovenski inštitut za standardizacijo. Razmnoževanje celote ali delov tega standarda ni dovoljeno.
EUROPEAN STANDARD EN 61967-2
NORME EUROPÉENNE
EUROPÄISCHE NORM October 2005
ICS 31.080.99
English version
Integrated circuits -
Measurement of electromagnetic emissions, 150 kHz to 1 GHz
Part 2: Measurement of radiated emissions -
TEM cell and wideband TEM cell method
(IEC 61967-2:2005)
Circuits intégrés - Integrierte Schaltungen -
Mesure des émissions Messung von elektromagnetischen
électromagnétiques, 150 kHz à 1 GHz Aussendungen im Frequenzbereich
Partie 2: Mesure des émissions von 150 kHz bis 1 GHz
rayonnées - Teil 2: Messung der abgestrahlten
Méthode de cellule TEM et Aussendungen -
cellule TEM à large bande TEM-Zellen- und Breitband-TEM-
(CEI 61967-2:2005) Zellenverfahren
(IEC 61967-2:2005)
This European Standard was approved by CENELEC on 2005-09-01. CENELEC members are bound to
comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European
Standard the status of a national standard without any alteration.
Up-to-date lists and bibliographical references concerning such national standards may be obtained on
application to the Central Secretariat or to any CENELEC member.
This European Standard exists in three official versions (English, French, German). A version in any other
language made by translation under the responsibility of a CENELEC member into its own language and
notified to the Central Secretariat has the same status as the official versions.
CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech
Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia,
Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden,
Switzerland and United Kingdom.
CENELEC
European Committee for Electrotechnical Standardization
Comité Européen de Normalisation Electrotechnique
Europäisches Komitee für Elektrotechnische Normung
Central Secretariat: rue de Stassart 35, B - 1050 Brussels
© 2005 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members.
Ref. No. EN 61967-2:2005 E
Foreword
The text of document 47A/722/FDIS, future edition 1 of IEC 61967-2, prepared by SC 47A, Integrated
circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and
was approved by CENELEC as EN 61967-2 on 2005-09-01.
This part of EN 61967 is to be read in conjunction with EN 61967-1.
The following dates were fixed:
– latest date by which the EN has to be implemented
at national level by publication of an identical
national standard or by endorsement (dop) 2006-07-01
– latest date by which the national standards conflicting
with the EN have to be withdrawn (dow) 2008-09-01
Annex ZA has been added by CENELEC.
__________
Endorsement notice
The text of the International Standard IEC 61967-2:2005 was approved by CENELEC as a European
Standard without any modification.
In the official version, for Bibliography, the following notes have to be added for the standards
indicated:
IEC 61000-4-3 NOTE Harmonized as EN 61000-4-3:1996 (modified).
IEC 61000-4-20 NOTE Harmonized as EN 61000-4-20:2003 (not modified).
CISPR 16-1-1 NOTE Harmonized as EN 55016-1-1:2004 (not modified).
CISPR 16-1-2 NOTE Harmonized as EN 55016-1-2:2004 (not modified).
CISPR 16-1-4 NOTE Harmonized as EN 55016-1-4:2004 (not modified).
CISPR 16-1-5 NOTE Harmonized as EN 55016-1-5:2004 (not modified).
CISPR 16-2-1 NOTE Harmonized as EN 55016-2-1:2004 (not modified).
CISPR 16-2-2 NOTE Harmonized as EN 55016-2-2:2004 (not modified).
CISPR 16-2-3 NOTE Harmonized as EN 55016-2-3:2004 (not modified).
CISPR 16-2-4 NOTE Harmonized as EN 55016-2-4:2004 (not modified).
__________
- 3 - EN 61967-2:2005
Annex ZA
(normative)
Normative references to international publications
with their corresponding European publications
The following referenced documents are indispensable for the application of this document. For dated
references, only the edition cited applies. For undated references, the latest edition of the referenced
document (including any amendments) applies.
NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant
EN/HD applies.
Publication Year Title EN/HD Year
IEC 60050-131 2002 International Electrotechnical Vocabulary- -
Part 131: Circuit theory
IEC 60050-161 1990 Chapter 161: Electromagnetic - -
compatibility
1) 2)
IEC 61967-1 - Integrated circuits - Measurement of EN 61967-1 2002
electromagnetic emissions, 150 kHz to
1 GHz
Part 1: General conditions and definitions
1)
Undated reference.
2)
Valid edition at date of issue.
NORME CEI
INTERNATIONALE
IEC
61967-2
INTERNATIONAL
Première édition
STANDARD
First edition
2005-09
Circuits intégrés –
Mesure des émissions électromagnétiques,
150 kHz à 1 GHz –
Partie 2:
Mesure des émissions rayonnées –
Méthode de cellule TEM et cellule
TEM à large bande
Integrated circuits –
Measurement of electromagnetic emissions,
150 kHz to 1 GHz –
Part 2:
Measurement of radiated emissions –
TEM cell and wideband TEM cell method
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61967-2 IEC:2005 – 3 –
CONTENTS
FOREWORD.7
1 Scope.11
2 Normative references .11
3 Terms and definitions .13
4 General .13
5 Test conditions .13
5.1 General .13
5.2 Supply voltage.13
5.3 Frequency range .13
6 Test equipment.13
6.1 General .13
6.2 Shielding .13
6.3 RF measuring instrument .13
6.4 Preamplifier.15
6.5 TEM cell.15
6.6 Wideband TEM/GTEM cell.15
6.7 50-Ohm termination.15
6.8 System gain .15
7 Test set-up .15
7.1 General .15
7.2 Test configuration.15
7.3 Test PCB.17
8 Test procedure .23
8.1 General .23
8.2 Ambient measurement.23
8.3 DUT operational check .23
8.4 DUT emissions measurement .23
9 Test report.25
9.1 General .25
9.2 Measurement conditions.25
10 IC emissions reference levels.25
Annex A (informative) Example calibration & set-up verification sheet .27
Annex B (informative) TEM cell and wideband TEM cell descriptions .29
B.1 TEM cell .29
B.2 Wideband GTEM cell.29
Annex C (informative) Calculation of dipole moment from measured data .31
C.1 General .31
C.2 Dipole moment calculation.31
61967-2 IEC:2005 – 5 –
Annex D (informative) Specification of emissions data .35
D.1 General.35
D.2 Specification of emission levels .35
D.3 Presentation of results.35
D.4 Examples.35
Bibliography.41
Figure 1 – TEM cell test set-up .17
Figure 2 – GTEM cell test set-up.17
Figure 3 – IC Test printed circuit board .21
Figure D.1 – Emission characterization levels .37
Figure D.2 – Maximum Emission Level G8f.39
Table 1 − Pin loading recommendations.19
61967-2 IEC:2005 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –
Part 2: Measurement of radiated emissions –
TEM cell and wideband TEM cell method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardiza
...
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